945 research outputs found

    Developing a Silicon Pixel Detector for the Next Generation LHCb Experiment

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    The second long shutdown of the LHC presents an opportunity for the LHCb experiment to upgrade its detector systems and switch to a fully software triggered readout. Its first tracking layer, the VELO detector, is no exception to this and is undergoing an upgrade increasing the number of sensitive channels from 180 thousand silicon microstrips to about 41 million pixels. The new system will operate with zero-suppressed readout at 40 MHz, while cooled down using evaporative liquid CO2_2 in silicon microchannel plates. The VELO Upgrade will consist of 52 modules, placed around the beam-pipe, built at the University of Manchester and Nikhef. The construction of the modules is a complex process that consists of a number of tight tolerance steps, their results verified both in metrology and in the electrical and thermal performance testing. In order to store data and track the performance a database has been developed, used to automatically analyse the uploaded values as well as compute the grades and quality of the individual steps and final modules. By the end of August 2021, 42 modules have been produced in Manchester, 37 of them with high quality and no issues present. Due to the nature of the harsh radiation environment, the sensors have to withstand a fluence up to 1e16 1 MeV neqcm2_\mathrm{eq} \mathrm{cm^{-2}} and still provide a good signal to noise ratio. A new method of a charge collection scan has been proposed, linking the commonly used voltage scan with a threshold scan and using the extrapolated tracking information to estimate the amount of collected charge. The simulation indicates that the scan of a subset of modules will take about 8 min, a feasible duration despite the impact on the physics data taking. A further upgrade of the LHCb is planned for Long Shutdown four of the LHC. This will operate at higher luminosities leading to a significant increase in the pile-up of the collisions from a single proton-proton bunch crossing. For this reason a precise time stamping O\mathcal{O}(50 ps) is to be added. This could be achieved in silicon detectors by using O\mathcal{O}(10) internal gain in the sensor. Simulations of the expected performance of a recently produced batch of sensors are presented. These characterise the anticipated performance of these O\mathcal{O}(50 μ\mum) segmented devices in a test beam, providing the impact of charge sharing and device response to an angular scan

    Pixel detector hybridisation with Anisotropic Conductive Films

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    Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such interconnect technologies need to be suitable for the assembly of single-dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative hybridisation concepts targeting vertex-detector applications at future colliders are under development. This contribution presents recent results of a newly developed in-house single-die interconnection process based on Anisotropic Conductive Film (ACF). The ACF interconnect technology replaces the solder bumps with conductive particles embedded in an adhesive film. The electro-mechanical connection between the sensor and the read-out chip is achieved via thermo-compression of the ACF using a flip-chip device bonder. A specific pad topology is required to enable the connection via conductive particles and create cavities into which excess epoxy can flow. This pixel-pad topology is achieved with an in-house Electroless Nickel Immersion Gold (ENIG) plating process that is also under development within the project. The ENIG and ACF processes are qualified with the Timepix3 ASIC and sensors, with 55 um pixel pitch and 14 um pad diameter. The ACF technology can also be used for ASIC-PCB/FPC integration, replacing wire bonding or large-pitch solder bumping techniques. This contribution introduces the ENIG plating and ACF processes and presents recent results on Timepix3 hybrid assemblies

    A new macro-imager based on Tpx3Cam optical camera for PLIM applications

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    The recently designed Tpx3Cam camera based PLIM (Phosphorescence Lifetime IMaging) macro-imager was tested using an array of phosphorescent chemical and biological samples. A series of sensor materials prepared by incorporating the phosphorescent O2-sensitive dye, PtBP, into five polymers with different O2 permeability were imaged along with several commercial and non-commercial sensors based on PtBP and PtOEPK dyes. The PLIM images showed good lifetime contrast between the different materials, and phosphorescence lifetime values obtained were consistent with those measured by alternative methods. A panel of live tissues samples stained with PtBP based nanoparticle probe were also prepared and imaged under resting conditions and upon inhibition of respiration. The macro-imager showed promising results as a tool for PLIM of O2 in chemical and biological samples

    Costs analysis of the treatment of imported malaria

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    <p>Abstract</p> <p>Background</p> <p>To document the status of imported malaria infections and estimate the costs of treating of patients hospitalized with the diagnosis of imported malaria in the Slovak Republic during 2003 to 2008.</p> <p>Case study</p> <p>Calculating and comparing the direct and indirect costs of treatment of patients diagnosed with imported malaria (ICD-10: B50 - B54) who used and not used chemoprophylaxis. The target sample included 19 patients diagnosed with imported malaria from 2003 to 2008, with 11 whose treatment did not include chemoprophylaxis and eight whose treatment did.</p> <p>Results</p> <p>The mean direct cost of malaria treatment for patients without chemoprophylaxis was 1,776.0 EUR, and the mean indirect cost 524.2 EUR. In patients with chemoprophylaxis the mean direct cost was 405.6 EUR, and the mean indirect cost 257.4 EUR.</p> <p>Conclusions</p> <p>The analysis confirmed statistically-significant differences between the direct and indirect costs of treatment with and without chemoprophylaxis for patients with imported malaria.</p
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