Design requirements for group-IV laser based on fully strained Ge1-xSnx embedded in partially relaxed Si1-y-zGeySnz buffer layers

Theoretical calculation using the model solid theory is performed to design the stack of a group-IV laser based on a fully strained Ge1-xSnx active layer grown on a strain relaxed Si1-y-zGeySnz buffer/barrier layer. The degree of strain relaxation is taken into account for the calculation for the first time. The transition between the indirect and the direct band material for the active Ge1-xSnx layer is calculated as function of Sn content and strain. The required Sn content in the buffer layer needed to apply the required strain in the active layer in order to obtain a direct bandgap material is calculated. Besides, the band offset between the (partly) strain relaxed Si1-y-zGeySnz buffer layer and the Ge1-xSnx pseudomorphically grown on it is calculated. We conclude that an 80% relaxed buffer layer needs to contain 13.8% Si and 14% Sn in order to provide sufficiently high band offsets with respect to the active Ge1-xSnx layer which contains at least 6% Sn in order to obtain a direct bandgap

Carrier lifetime assessment in integrated Ge waveguide devices

Carrier lifetimes in Ge waveguides on Si are deduced from time-resolved pump-probe spectroscopy. For a 1 pm wide Ge waveguide, a lifetime of 1.6 ns is estimated for a carrier density of around 2 x10(19) cm(-3)

Extraction of carrier lifetime in Ge waveguides using pump probe spectroscopy

Carrier lifetimes in Ge-on-Si waveguides are deduced using time-resolved infrared transmission pump-probe spectroscopy. Dynamics of pump-induced excess carriers generated in waveguides with varying Ge thickness and width is probed using a CW laser. The lifetimes of these excess carriers strongly depend on the thickness and width of the waveguide due to defect assisted surface recombination. Interface recombination velocities of 0.975 x 10(4) cm/s and 1.45 x 10(4) cm/s were extracted for the Ge/Si and the Ge/SiO2 interfaces, respectively. Published by AIP Publishing

50GHz Ge waveguide electro-absorption modulator integrated in a 220nm SOI photonics platform

We report waveguide-integrated Ge electro-absorption modulators operating at 1615nm wavelength with 3dB bandwidth beyond 50GHz and a capacitance of 10fF, A 2V voltage swing enables 4.6dB DC extinction ratio for 4.1dB insertion loss

70 Gb/s low-power DC-coupled NRZ differential electro-absorption modulator driver in 55 nm SiGe BiCMOS

We present a 70 Gb/s capable optical transmitter consisting of a 50 mu m long GeSi electro-absorption modulator (integrated in silicon photonics) and a fully differential driver designed in a 55 nm SiGe BiCMOS technology. By properly unbalancing the output stage, the driver can be dc-coupled to the modulator thus avoiding the use of on-chip or external bias-Ts. At a wavelength of 1560 nm, open eye diagrams for 70 Gb/s after transmission over 2 km standard single-mode fiber were demonstrated. The total power consumption is 61 mW, corresponding to 0.87 pJ/b at 70 Gb/s. Bit-error rate measurements at 50 Gb/s and 56 Gb/s (performed both back to back and with up to 2 km standard single-mode fiber) demonstrate large (0.4 UI at a BER of 10(-12)) horizontal eye margins. This optical transmitter is ideally suited for datacenter applications that require densely integrated transceivers with a low power consumption