Parallel Implementation of Lossy Data Compression for Temporal Data Sets

Many scientific data sets contain temporal dimensions. These are the data storing information at the same spatial location but different time stamps. Some of the biggest temporal datasets are produced by parallel computing applications such as simulations of climate change and fluid dynamics. Temporal datasets can be very large and cost a huge amount of time to transfer among storage locations. Using data compression techniques, files can be transferred faster and save storage space. NUMARCK is a lossy data compression algorithm for temporal data sets that can learn emerging distributions of element-wise change ratios along the temporal dimension and encodes them into an index table to be concisely represented. This paper presents a parallel implementation of NUMARCK. Evaluated with six data sets obtained from climate and astrophysics simulations, parallel NUMARCK achieved scalable speedups of up to 8788 when running 12800 MPI processes on a parallel computer. We also compare the compression ratios against two lossy data compression algorithms, ISABELA and ZFP. The results show that NUMARCK achieved higher compression ratio than ISABELA and ZFP.Comment: 10 pages, HiPC 201

Synthesis of Natural Homoisoflavonoids Having Either 5,7-Dihydroxy-6-methoxy or 7-Hydroxy-5,6-dimethoxy Groups

Naturally occurring homoisoflavonoids containing either 5,7-dihydroxy-6-methoxy or 7-hydroxy-5,6-dimethoxy groups such as the antiangiogenic homoisoflavanone, cremastranone, were synthesized via three or four linear steps from the known 4-chromenone. This facile synthesis includes chemoselective 1,4-reduction of 4-chromenone and selective deprotection of 3-benzylidene-4-chromanone a containing C7-benzyloxy group

Gene alterations by peroxisome proliferator-activated receptor gamma agonists in human colorectal cancer cells

The peroxisome proliferator-activated receptor gamma (PPARgamma) is a nuclear transcription factor that controls the genes involved in metabolism and carcinogenesis. In the present study, we examined the alteration of gene expression in HCT-116 human colorectal cancer cells by PPARgamma agonists: MCC-555 (5 microM), rosiglitazone (5 microM), and 15-deoxy-Delta12,14-prostaglandin J2 (1 microM). The long-oligo microarray data revealed a list of target genes commonly induced (307 genes) and repressed (32 genes) by tested PPARgamma agonists. These genes were analyzed by Onto-Express software and KEGG pathway analysis and revealed that PPARgamma agonists are involved in cell proliferation, focal adhesion, and several signaling pathways. Eight genes were selected to confirm the microarray data by RT-PCR and real-time PCR, from which CSTA, DAP13, TAF12, RIS1, CDKN3 and MAGOH were up-regulated, and KLHL11 and NCOA2 were down-regulated. This study elucidates the commonly induced genes modulated by tested PPARgamma ligands involved in the different signaling pathways and metabolisms, probably mediated in a PPARgamma-dependent manner in colorectal cancer cells and helps to better understand the pleiotropic actions of PPARgamma ligands

Wafer Level Package for Image Sensor Module

A new ISM (image sensor module) WLP (wafer level package) for reflow process is designed, fabricated and tested. The ISM WLP is composed of polymer bonding layer, glass cap wafer for particle free process and CIS (CMOS Image Sensor) chip wafer which has micro via hole interconnection. During the last decades, WLP is highlighted as the next generation ISM Package method for many advantages like high yield (particle free process), small form factor (3D interconnection), low assembly cost and so on. Nevertheless these benefits, there are some problems like micro via hole fabrication, low temperature insulation process (inside hole), bottom side oxide etching, warpage control according to wafer level bonding using different material, and whole process temperature limitation for micro lens damage. Among various fabrication methods for ISM package, COB (Chip on board), COF (Chip on film), and L, T contact WLP from ShellCase are generally used. In case of COB and COF package, it has difficulty in particle control during assembly process. In case of ShellCase type WLP has very complicated fabrication process. Additionally, most of above package has disadvantage in size point of view. Through suggested ISM WLP using through interconnection via, wafer level fabrication & packaging technology is realized. It can not only solve problems of conventional packaging structures but also tremendously reduce the manufacturing & assembly cost (include time) of ISM package and realize real chip scale package. Based on sensor size, 3.67 X 3.42 X 0.39 (H) mm3 WLP is designed. During the parametric study using commercial 3-D simulation programs, silicon thickness, polymer bonding layer thickness, and glass thickness were chose the effective factor. And considering the optical and electrical analysis, we decide the parameter : silicon thickness is 0.1mm, polymer bonding layer thickness is 0.04mm, and glass thickness is 0.25mm. The fabrication process is composed bonding layer patterning, wafer bonding, thinning, via etching, passivation layer deposition, bottom oxide opening, metal plating, bottom electrode patterning, solder ball formation, and dicing. A new concept of ISM WLP has been founded to be suitable structure for low cost, small form factor application. We took good quality photo image using realized ISM WLP and obtained high electrical characteristics. Resist from GND to GND pad is measured 2.5 ohms. This package is realized with simple wafer level package technology. The proposed wafer level package can find applications, such as a next image sensor module

Family name distributions: Master equation approach

Although cumulative family name distributions in many countries exhibit power-law forms, there also exist counterexamples. The origin of different family name distributions across countries is discussed analytically in the framework of a population dynamics model. Combined with empirical observations made, it is suggested that those differences in distributions are closely related with the rate of appearance of new family names.Comment: 7 pages, 8 figure

Parallel Data Mining on Multicore Clusters”, gcc

Abstract-The ever increasing number of cores per chip will be accompanied by a pervasive data deluge whose size will probably increase even faster than CPU core count over the next few years. This suggests the importance of parallel data analysis and data mining applications with good multicore, cluster and grid performance. This paper considers data clustering, mixture models and dimensional reduction presenting a unified framework applicable to bioinformatics, cheminformatics and demographics. Deterministic annealing is used to lessen effect of local minima. We present performance results on clusters of 2-8 core systems identifying effects from cache, runtime fluctuations, synchronization and memory bandwidth. We discuss needed programming model and compare with MPI and other approaches

A Low-cost Through Via Interconnection for ISM WLP

WLP (Wafer level packaging) for image sensor devices has the advantage of small size, high performance and low cost, and becomes more and more important for ISM (image sensor module) products. In the WLP technology, in order to form electrical interconnection from image sensor contact pad to the backside of the wafer, several structures have been developed such as T-contact and TSV (Through Silicon Via). In this paper, a wafer level package of image sensor with new type TSV electrical interconnection for image sensor pad is presented. The target of this development is to reduce process cost and difficulty, and increase yield of image sensor packaging. Basic vertical via shape and low cost interconnection processes are adopted, compared to tapered via interconnection processes. Via etch problem caused by CIS wafer thickness non-uniformity was solved by remaining a fillet structure at the bottom of vias. This structure can prevent via notch and give better result of seed layer deposition and via filling

Unconventional sequence of correlated Chern insulators in magic-angle twisted bilayer graphene

The interplay between strong electron-electron interactions and band topology can lead to novel electronic states that spontaneously break symmetries. The discovery of flat bands in magic-angle twisted bilayer graphene (MATBG) with nontrivial topology has provided a unique platform in which to search for new symmetry-broken phases. Recent scanning tunneling microscopy and transport experiments have revealed a sequence of topological insulating phases in MATBG with Chern numbers $C=\pm 3, \, \pm 2, \, \pm 1$ near moir\'e band filling factors $\nu = \pm 1, \, \pm 2, \, \pm 3$, corresponding to a simple pattern of flavor-symmetry-breaking Chern insulators. Here, we report high-resolution local compressibility measurements of MATBG with a scanning single electron transistor that reveal a new sequence of incompressible states with unexpected Chern numbers observed down to zero magnetic field. We find that the Chern numbers for eight of the observed incompressible states are incompatible with the simple picture in which the $C= \pm 1$ bands are sequentially filled. We show that the emergence of these unusual incompressible phases can be understood as a consequence of broken translation symmetry that doubles the moir\'e unit cell and splits each $C=\pm 1$ band into a $C=\pm 1$ band and a $C=0$ band. Our findings significantly expand the known phase diagram of MATBG, and shed light onto the origin of the close competition between different correlated phases in the system