Ion chambers simplify absolute intensity measurements in the vacuum ultraviolet

Single or double ion chamber technique measures absolute radiation intensities in the extreme vacuum ultraviolet region of the spectrum. The ion chambers use rare gases as the ion carrier. Photon absorbed by the gas creates one ion pair so a measure of these is a measure of the number of incident photons

Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space

Development of High Efficiency (14%) Solar Cell Array Module

High efficiency solar cells required for the low cost modules was developed. The production tooling for the manufacture of the cells and modules was designed. The tooling consisted of: (1) back contact soldering machine; (2) vacuum pickup; (3) antireflective coating tooling; and (4) test fixture

Development of high efficiency (14 percent) solar cell array module

Most effort was concentrated on development of procedures to provide large area (3 in. diameter) high efficiency (16.5 percent AM1, 28 C) P+NN+ solar cells. Intensive tests with 3 in. slices gave consistently lower efficiency (13.5 percent). The problems were identified as incomplete formation of and optimum back surface field (BSF), and interaction of the BSF process and the shallow P+ junction. The problem was shown not to be caused by reduced quality of silicon near the edges of the larger slices

Risk Management of Microelectronics: The NASA Electronic Parts and Packaging (NEPP) Program

This viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications

1st NASA Electronic Parts Packaging (NEPP) Program Electronic Technology Workshop (ETW)

NEPP supports all of NASA for >20 years - 7 NASA Centers and JPL actively participate The NEPP Program focuses on the reliability aspects of electronic devices - Three prime technical areas: Parts (die), Packaging, and Radiation Alternately, reliability may be viewed as:

The NASA Electronic Parts Assurance Group (NEPAG) - An Overview

This presentation will discuss in detail NASA Government Working Group government topics from NASA Electronic Parts Assurance Group (NEPAG) which require additional in-depth technical solutions

The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond

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