NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space

LaBel, Kenneth A.

Sampson, Michael J.

NASA Technical Reports Server

National Aeronautics and Space Administration
Packaging Concerns and   
Techniques for Large Devices
Challenges for Complex Electronics
Components for Military and Space Electronics 
(CMSE)
February  9, 2010
K th A L B lenne  . a e
ken.label@nasa.gov
301-286-9936
Michael J. Sampson
Michael.j.sampson@nasa.gov
301-614-6233
www.nasa.gov Co-Managers, NASA Electronic Parts and Packaging Program (NEPP)
https://ntrs.nasa.gov/search.jsp?R=20100015703 2019-08-30T09:25:54+00:00Z
NASA Electronic Parts and Packaging (NEPP) Program
FPGAs- A Sampling of Challenges   
Can we “qualify” without breaking the bank?
New Silicon New Board Material
New Connectors
-higher-speed, lower noise
-serial/parallel
-90nm CMOS
-new materials
-thermal coefficients
-material interfaces
New Architectures
-new interconnects
-new power distribution
New Workmanship
-inspection, lead free
stacking double sided
-new frequencies
New Design Flows/Tools New Package
- , -
-signal integrity
  
-programming algorithms, application
-design rules, tools, simulation, layout
 
-Inspection
-Lead free
Where we were 
©2006
National Aeronautics and Space Administration
-hard/soft IP instantiation
2MJS 01/17/2010
NASA Electronic Parts and Packaging (NEPP) Program
Overview
• Packaging Challenges
Solar Dynamics 
Observatory (SDO).  
Awaiting Launch
• Packaging Options
• Components of All Packages
• Commercial, Non-hermetic Packages
• Space Challenges to Packages   
• A Non-hermetic, Complex Package for Space
• Hermeticity Why Space Users Like It,     
• Non-hermetic, Complex Package Variations
• Class X  
• Summary
National Aeronautics and Space Administration MJS 01/17/2010 3
NASA Electronic Parts and Packaging (NEPP) Program
Packaging Challenges 
• I/O s, increasing number, decreasing pitch
• Heat Dissipation, especially in space
• Manufacturability
• Materials
• Mechanical
• Installation
• Testability
• Inspectability Lunar Reconnaissance Orbiter (LRO), Built at GSFC, Launched with LCROSS, June 18,2009
• Space Environment
• RoHS (Pb-free)
National Aeronautics and Space Administration 4MJS 01/17/2010
NASA Electronic Parts and Packaging (NEPP) Program
Package Options – Hermetic?  
• Driven by consumer products
Passivation
Dielectric
Etch Stop Layer
Dielectric Capping Layer
Via
Wire
– Low cost
– High volume
Global 
  
Copper Conductor with 
Barrier/Nucleation Layer 
– Rapid turnover
– “Green”
Mi i i d i
Intermediate
Metal 1 Pre-Metal Dielectric
Tungsten Contact Plug
– n m ze  s ze
• Once, hermetic options existed for most package types
Now few hermetic options for latest package technologies
Metal 1 Pitch
– ,       
– Development of new hermetic options unattractive
» Very high NRE
» Very high technical difficulty
» Very low volume
Demanding customers
National Aeronautics and Space Administration
»  
MJS 01/17/2010 5
NASA Electronic Parts and Packaging (NEPP) Program
The “General” Package  
• Typically, packages consist of the same basic 
features but achieve them in many ways:
– Functional elements - active die, passives etc.
– Interconnects between elements (2 or more elements)
– A substrate
Interconnects to the external I/O of the package–        
– A protective package
– Interconnects to the next higher level of assembly       
National Aeronautics and Space Administration MJS 01/17/2010 6
NASA Electronic Parts and Packaging (NEPP) Program
Commercial, Non-hermetic Package (PBGA)   
Flip Chip 
Die Bump
Substrate
Multi-layer Encapsulation
Die
Capacitor, 
Resistor etc.
Design Drivers: Commercial Drivers:
UnderfillPb-free 
Ball
• High I/O count
• Large die
• Low cost
• High volume
• Environmental protection
• Performance/Speed
• Limited life
• Automated installation
C
National Aeronautics and Space Administration
• Ancillary parts • ompact
7MJS 01/17/2010
NASA Electronic Parts and Packaging (NEPP) Program
Space Challenges for Complex    
Non-hermetic Packages
• Vacuum:
– Outgassing, offgassing, property deterioration
• Foreign Object Debris (FOD)
– From the package threat to the system, or a threat to the package
• Shock and vibration  
– During launch, deployments and operation
• Thermal cycling
– Usually small range; high number of cycles in Low Earth Orbit (LEO)
Th l t• erma  managemen
– Only conduction and radiation transfer heat
• Thousands of interconnects
– Opportunities for opens, intermittent - possibly latent
ONE 
STRIKE AND     
• Low volume assembly
– Limited automation, lots of rework
• Long life
C t f hi h k th t f th i t t
  
YOU’RE OUT!
– os s or space are g , ma e e mos  o  e nves men
• Novel hardware
– Lots of “one offs”
• Rigorous test and inspection
National Aeronautics and Space Administration
– To try to find the latent threats to reliability
MJS 01/17/2010 8
NASA Electronic Parts and Packaging (NEPP) Program
Non-hermetic Package, With”Space” Features
(CCGA?)
Cover
Flip Chip Die 
Bump
Substrate and 
Sn/Pb Column 
Grid Array
Die
Capacitor, 
Resistor etc.
“Enclosed” 
Package 
OptionUnderfill
 
Space Challenge Some Defenses
Vacuum Low out/off-gassing materials. Ceramics vs polymers. 
Shock and vibration Compliant / robust interconnects - wire bonds, solder balls, columns, conductive polymer 
Thermal cycling Compliant/robust interconnects, matched thermal expansion coefficients
Thermal management Heat  spreader in the lid and/or substrate, thermally conductive materials
Thousands of 
interconnects
Process control, planarity, solderability, substrate design
Low volume assembly Remains a challenge
Long life Good design materials parts and process control
National Aeronautics and Space Administration
  , ,    
Novel hardware Test, test, test
Rigorous test and 
inspection
Testability and inspectability will always be challenges 9MJS 01/17/2010
NASA Electronic Parts and Packaging (NEPP) Program
Hermeticity
• NASA prefers hermetic packages for critical 
applications
• Hermeticity is measureable, assuring package 
integrity
• Only 3 tests provide assurance for hermetic 
package integrity:
– Hermeticity – nothing bad can get in
R id l I t l l i thi b d i– es ua  or n erna  gas ana ys s – no ng a  s 
inside
– Particle Impact Noise Detection – no FOD inside      
• NON-HERMETIC PACKAGE INTEGRITY IS HARD 
TO ASSESS - NO 3 BASIC TESTS
National Aeronautics and Space Administration 10MJS 01/17/2010
NASA Electronic Parts and Packaging (NEPP) Program
Non-hermetic Package Variations  
• Current and future package options mix and match 
elements in almost infinite combinations    
• Elements include:
– Wire bonds
Ball interconnects–  
– Solder joints
– Conductive epoxies
Vias–
– Multi-layer substrates
– Multiple chips, active and passive (hybrid?)
St ki f t– ac ng o  componen s
– Embedded actives and passives
– Polymers
C i– eram cs
– Enclosures/encapsulants
– Thermal control features
National Aeronautics and Space Administration MJS 01/17/2010 11
NASA Electronic Parts and Packaging (NEPP) Program
Some Large Device Package Options     
AMKOR
Embedded Capacitor
National Aeronautics and Space Administration MJS 01/17/2010 12
NASA Electronic Parts and Packaging (NEPP) Program
Some Large Device Package Options     
National Aeronautics and Space Administration MJS 01/17/2010 13
From Amkor’s Website http://www.amkor.com/go/packaging
NASA Electronic Parts and Packaging (NEPP) Program
Why MIL Spec for Space ?  .   
• Space users like MIL spec. parts because:
– There are technical “rules” that apply equally to all 
suppliers
Qualification to recognized requirements–    
– Visibility of change control
– Required tests and inspections reduce or eliminate the 
need for the space user to do post-procurement tests
– Transparent government process for reacting to 
f iper ormance ssues
– Space level participation provides an opportunity to do 
continuous improvement of the MIL supply chain for        
Class S (space grade) microelectronics
They Work!
National Aeronautics and Space Administration MJS 01/17/2010 14
NASA Electronic Parts and Packaging (NEPP) Program
MIL-PRF-38535 Class Y,  
• Proposed new class for M38535, monolithic microcircuits
• Class Y will be for Space level non-hermetic       
• Class V will be defined as hermetic only
• Addition to Appendix B, “Space Application”
• Package-specific  “package integrity” test requirements 
proposed by manufacturer, approved by DSCC and 
government space
• The Package Integrity Test Plan must address:
– Potential materials degradation
Interconnect reliability–  
– Thermal management
– Resistance to processing stresses
Thermo mechanical stresses– -  
• G12 Task Group established 01/13/01
National Aeronautics and Space Administration 15MJS 01/17/2010
NASA Electronic Parts and Packaging (NEPP) Program
Summary
• NASA is going to have to accept the use of non-hermetic 
packages for complex devices
• There are a large number of packaging options available
• Space application subjects the packages to stresses that they 
were probably not designed for (vacuum for instance)
• NASA has to find a way of having assurance in the integrity of 
the packages
• There are manufacturers interested in qualifying non-hermetic 
Cpackages to MIL-PRF-38535 lass V
• Government space users are agreed that Class V should be for 
hermetic packages only
• NASA is working on a new Class for non-hermetic packages for 
M38535 Appendix B, “Class Y”
• Testing for package integrity will be required but can be 
k ifi d ib d b P k I t it T t Plpac age spec c as escr e  y a ac age n egr y es  an
• The plan is developed by the manufacturer and approved by 
DSCC and government space
National Aeronautics and Space Administration 16MJS 01/17/2010
NASA Electronic Parts and Packaging (NEPP) Program
http://nepp.nasa.gov
National Aeronautics and Space Administration MJS 08/31/09 17


Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

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