188 research outputs found

    Laser-wakefield accelerators as hard x-ray sources for 3D medical imaging of human bone

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    A bright μm-sized source of hard synchrotron x-rays (critical energy Ecrit > 30 keV) based on the betatron oscillations of laser wakefield accelerated electrons has been developed. The potential of this source for medical imaging was demonstrated by performing micro-computed tomography of a human femoral trabecular bone sample, allowing full 3D reconstruction to a resolution below 50 μm. The use of a 1 cm long wakefield accelerator means that the length of the beamline (excluding the laser) is dominated by the x-ray imaging distances rather than the electron acceleration distances. The source possesses high peak brightness, which allows each image to be recorded with a single exposure and reduces the time required for a full tomographic scan. These properties make this an interesting laboratory source for many tomographic imaging applications

    Direct observation of the injection dynamics of a laser wakefield accelerator using few-femtosecond shadowgraphy

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    International audienceWe present few-femtosecond shadowgraphic snapshots taken during the non-linear evolution of the plasma wave in a laser wakefield accelerator with transverse synchronized few-cycle probe pulses. These snapshots can be directly associated with the electron density distribution within the plasma wave and give quantitative information about its size and shape. Our results show that self-injection of electrons into the first plasma wave period is induced by a lengthening of the first plasma period. Three dimensional particle in cell simulations support our observations

    Reliability Study of GaN-on-SiC HEMT RF Power Amplifiers

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    The RF power amplifier demonstrators containing each one GaN-on-SiC, HEMT, CHZ015A-QEG, from UMS in SMD quad-flat no-leads package (QFN) were subjected to thermal cycles (TC) and power cycles (PC) and evaluated electrically, thermally and structurally. Two types of solders, Sn63Pb36Ag2 and lead-free SnAgCu (SAC305), and two types of TIM materials, NanoTIM and TgonTM 805, for PCB attachment to the liquid cold plate were tested for thermo-mechanical reliability. Changes in the electrical performance of the devices, namely the reduction of the current saturation value, threshold voltage shift, increase of the leakage current and degradation of the HF performance were observed as a result of an accumulated current stress during PC. No significant changes in the investigated solder or TIM materials were observed

    Angularly resolved characterization of ion beams from laser-ultrathin foil interactions

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    Methods and techniques used to capture and analyze beam profiles produced from the interaction of intense, ultrashort laser pulses and ultrathin foil targets using stacks of Radiochromic Film (RCF) and Columbia Resin #39 (CR-39) are presented. The identification of structure in the beam is particularly important in this regime, as it may be indicative of the dominance of specific acceleration mechanisms. Additionally, RCF can be used to deconvolve proton spectra with coarse energy resolution while mantaining angular information across the whole beam

    Reliability Study of GaN-on-SiC HEMT RF Power Amplifiers

    Get PDF
    The RF power amplifier demonstrators containing each one GaN-on-SiC, HEMT, CHZ015A-QEG, from UMS in SMD quad-flat no-leads package (QFN) were subjected to thermal cycles (TC) and power cycles (PC) and evaluated electrically, thermally and structurally. Two types of solders, Sn63Pb36Ag2 and lead-free SnAgCu (SAC305), and two types of TIM materials, NanoTIM and TgonTM 805, for PCB attachment to the liquid cold plate were tested for thermo-mechanical reliability. Changes in the electrical performance of the devices, namely the reduction of the current saturation value, threshold voltage shift, increase of the leakage current and degradation of the HF performance were observed as a result of an accumulated current stress during PC. No significant changes in the investigated solder or TIM materials were observed
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