Simulation of chemical vapor infiltration and deposition based on 3D images: a local scale approach

International audienceA numerical solution for the simulation of chemical vapor infiltration of ceramic matrix composites is presented. This computational model requires a 3D representation of the preform. Gas transport and chemical reaction are simulated by a Monte Carlo random walk technique. The developed algorithm can also be used for determination of effective transport and reaction properties in a porous medium. It is firstly validated by considering the simple case of diffusion and reaction in a flat pore. Results of infiltration of an actual fiber arrangement are described and discussed. Extension to deposition on a thin substrate with asperities is also studied

Thin film electro-osmotic pumps for biomicrofluidic applications

Electro-osmotic flow (EOF) pumps are attractive for fluid manipulation in microfluidic channels. Open channel EOF pumps can produce high pressures and flow rates, and are relatively easy to fabricate on-chip or integrate with other microfluidic or electrical components. An EOF pump design that is conducive to on-chip fabrication consists of multiple small channel arms feeding into a larger flow channel. We have fabricated this type of pump design using a thin film deposition process that avoids wafer bonding. We have evaluated pumps fabricated on both silicon and glass substrates. Consistent flow rate versus electric field were obtained. For the range of 40–400 V, flow rates of 0.19–2.30 μL∕min were measured. Theoretical calculations of pump efficiency were made, as well as calculations of the mechanical power generated by various pump shapes, to investigate design parameters that should improve future pumps