Piezoelectric and optical setup to measure an electrical field: Application to the longitudinal near-field generated by a tapered coax

We propose a new setup to measure an electrical field in one direction. This setup is made of a piezoelectric sintered lead zinconate titanate film and an optical interferometric probe. We used this setup to investigate how the shape of the extremity of a coaxial cable influences the longitudinal electrical near-field generated by it. For this application, we designed our setup to have a spatial resolution of 100 um in the direction of the electrical field. Simulations and experiments are presented

Caractérisation mécanique par sollicitation locale et mesure de champ

Nous proposons d'utiliser un nouveau système d'imagerie interférométrique à lumière polarisée, basé sur un prisme biréfringent « maison », pour mesurer le champ de rotation d'une surface. Ce système est ensuite utilisé en association avec un microscope acoustique à pointe vibrante (SMM : Scanning Microdeformation Microscope) pour mesurer le champ de rotation de la surface, à proximité de la pointe du microscope. Le champ ainsi déterminé est utilisé dans le but de découpler les constantes élastiques issues des mesures faites avec le SMM

ULTRA-LOCAL TEMPERATURE MAPPING WITH AN INTRINSIC THERMOCOUPLE

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920)International audienceWe report on a set-up derived from an Electrostatic Force Microscope (EFM) allowing us to probe temperature with a high spatial resolution. The system uses the well-known Seebeck effect through an intrinsic thermocouple made from an EFM conducting tip put in contact with a conducting sample. The contact radius between tip and sample is currently estimated to be in the 50 to 100 nm range depending on the elastic or the plastic deformation. The contact area can be assimilated to the electrical and thermal contact areas. In those conditions, the issue of heat conduction in air is solved. The thermal measurement is related to the Seebeck junction effect : it will therefore not be sensitive to buried materials or impurities

Temperature Measurement of Microsystems by Scanning Thermal Microscopy

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920)International audienceSurface temperature measurements were performed with a Scanning Thermal Microscope. We aim at proving an eventual sub-micrometric resolution of this metrology when using a wollaston wire probe of micrometric size. A dedicated CMOS device was designed with arrays of lines 0.35mm in size with 0.8 mm and 10mm periods. Integrated Circuits with or without a passivition layer were tested. To enhance sensitivity, the IC heat source was excited with an AC current. We show that the passivation layer spreads heat so that the lines are not distinguishable. Removing this layer allows us to distinguish the lines in the case of the 10mm period

Micromachined Calibration Chip with Heat Source and Temperature Sensors for Scanning Thermal Metrology (SThM)

The monitoring of heat flux is becoming more and more critical for many technologies approaching nanometric dimensions. Scanning Thermal Microscopy (SThM) is one of the tools available for thermal measurement at the nanoscale. This measurement technics needs calibration samples. Therefore, micro-hotplates made of platinum heater suspended on thin silicon nitride (SiN) membranes were fabricated for the calibration of Scanning Thermal Microscopy probes. The objective is to obtain heated reference samples with localised resistive temperature sensors (RTD) on the membrane to probe the temperature on a micro-scale area (typically 10×10 μm2). This sensing area is dedicated to (1) quantify the thermal resistance between the SThM tip and hot surface contact; and to (2) evaluate the perturbation induced by the probe on the heat dissipation when the contact measurement is performed. In this communication, we report on the thermal design of low-power calibration chip and their fabrication, as well as the electro-thermal characterization of sensitive RTDs made using e-beam technology. Thermal contact measurements using a thermocouple based SThM probe validated the functionality of the calibration chip. © 2015 The Authors. Published by Elsevier Ltd

Surface and bulk investigation of materials with Scanning Microdeformation Microscopy : What is really investigated.

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Near-field acoustic microscopy: application to characterization of layered materials”, 1nd International conference on electromagnetic near-field characterization & imaging Proceedings International center for numerical methods in engineering.

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