Power Management Controller By Using Intel Max 10 Fpga

Currently, FPGA (Field Programmable Gate Array) is one of the choices that consider for digital system design compare to ASIC (Application-Specific Integrated Circuit). This is due to the flexibility of the FPGA to update design based on the application. Intel Stratix 10 FPGA is the FPGA from Intel Cooperation that required proper power sequencing to avoid damage on the devices. Besides power sequencing, Intel Stratix 10 FPGA required 200 us to 100 ms POR (Power On Reset) during power up sequence to avoid FPGA in reset state and require total power down sequence in 100 ms. There are a lot of power sequencing methods are implemented for FPGA such as discrete component, resistor divider rule, sequencing IC (Integrated Circuit), MCU (Microcontroller), CPLD (Complex Programmable Logic Device) and FPGA. All these approaches are used to control the power on and off for the voltage regulator through pin enable voltage regulator and standard interface such as SM (System Management) Bus and PM (Power Management) Bus. For this project, non-volatile Intel MAX 10 FPGA is used for power management controller. This FPGA include internal ADC (Analog to Digital Converter) and UFM (User Flash Memory) that is critical to design power management controller. Power management controller is running on NIOS II and Avalon-MM (Memory-Mapped) Bus is used to connect all the ADC, UFM, timer, UART (Universal Asynchronous Receiver/Transmitter), PWM (Pulse Width Modulation) and PM Bus. This project is to power up and power down the PM Bus compatible voltage regulator within the POR specification which is 200 us to 100 ms and achieve 100 ms power down for FPGA. There are a number of advantages using Intel MAX 10 FPGA such as built in ADC, UFM, flexibility of FPGA, and NIOS II soft processor

Particle Modelling with the Discrete Element Method - A success story of PARDEM

Bulk handling, transport and processing of particulate materials such as powders and granules are integral to a wide range of industrial processes in many fields [1] and [3] or natural, geophysical phenomena and hazards like landslides [3]. Particulate systems are difficult to handle and display unpredictable behaviour, which represents a great challenge for both design and operation of unit operations and plants, but also for the research community of Powders and Grains [5] and [6]. Granular materials and powders consist of discrete particles such as individual sand-grains, agglomerates (comprising of many primary particles), or bonded solid materials like sandstone, ceramics, or some metals or polymers sintered during additive manufacturing. The primary particles can be as small as nano-metres, micro-metres, or millimetres [6] covering multiple scales in size and a variety of mechanical interaction mechanisms. Those interactions include friction and a variety of cohesive forces [8] and [9], which becomes more and more important the smaller the particles are. All these particle systems have a particulate, usually disordered, inhomogeneous and often anisotropic micro-structure, which is at the core of many of the challenges one faces when trying to understand powder technology and granular matte

Characterizing gas film conduction for particle- particle and particle-wall collisions

Heat transfer in granular media is an important mechanism in many industrial applications. For some applications conduction is an important mode of heat transfer. Several models have been proposed to describe particle scale conduction both between particles (particle-particle) and with walls (particle-wall). Within these conduction models are several distinct modes: conduction through physical contact (macro-contact), conduction through surface roughness (micro-contacts), and conduction through the stagnant gas film surrounding each particle (particle-fluid-particle or particle- fluid-wall). While these models have been developed and verified in literature, the relationship between the conduction heat transfer coefficient and key parameters is not immediately obvious. This is especially true for gas film conduction. In this work we investigate gas film conduction for particle- particle and particle-wall collisions via DEM simulations using a well-established gas film model to determine the behavior of the heat transfer coefficient as a function of the separation distance and particle size. With a better understanding of the gas film heat transfer coefficient, we propose a simplified model that captures the same response but is easier to understand and significantly more computationally efficient

Conceptualisation of an Efficient Particle-Based Simulation of a Twin-Screw Granulator

Discrete Element Method (DEM) simulations have the potential to provide particle-scale understanding of twin-screw granulators. This is difficult to obtain experimentally because of the closed, tightly confined geometry. An essential prerequisite for successful DEM modelling of a twin-screw granulator is making the simulations tractable, i.e., reducing the significant computational cost while retaining the key physics. Four methods are evaluated in this paper to achieve this goal: (i) develop reduced-scale periodic simulations to reduce the number of particles; (ii) further reduce this number by scaling particle sizes appropriately; (iii) adopt an adhesive, elasto-plastic contact model to capture the effect of the liquid binder rather than fluid coupling; (iv) identify the subset of model parameters that are influential for calibration. All DEM simulations considered a GEA ConsiGma™ 1 twin-screw granulator with a 60° rearward configuration for kneading elements. Periodic simulations yielded similar results to a full-scale simulation at significantly reduced computational cost. If the level of cohesion in the contact model is calibrated using laboratory testing, valid results can be obtained without fluid coupling. Friction between granules and the internal surfaces of the granulator is a very influential parameter because the response of this system is dominated by interactions with the geometry

A comparative assessment and unification of bond models in DEM simulations

Bonded contact models have been increasingly used in the discrete element method (DEM) to study cemented and sintered particulate materials in recent years. Several popular DEM bond models have been proposed in the literature; thus it is beneficial to assess the similarities and differences between the different bond models before they are used in simulations. This paper identifies and discusses two fundamental types of bond models: the Spring Bond Model where two bonded particles are joined by a set of uniform elastic springs on the bond’s cross-section, and the Beam Bond Model in which a beam is used to connect the centres of two particles. A series of cantilever beam bending simulation cases were carried out to verify the findings and assess the strength and weakness of the bond models. Despite the numerous bond models described in the literature, they can all be considered as a variation of these two fundamental model types. The comparative evaluation in this paper also shows that all the bond models investigated can be unified to a general form given at a predefined contact point location

Modelling cohesive-frictional particulate solids for bulk handling applications

Many powders and particulate solids are cohesive in nature and the strength often exhibits dependence on the consolidation stress. As a result, the stress history in the material leading up to a handling scenario needs to be considered when evaluating its handleability. This paper outlines the development of a DEM contact model accounting for plasticity and adhesion force, which is shown to be suitable for modelling the stress history dependent cohesive strength. The model was used to simulate the confined consolidation and the subsequent unconfined loading of iron ore fines with particle sizes up to 1.18mm. The predicted flow function was found to be comparable to the experimental results