Fast on-wafer electrical, mechanical, and electromechanical characterization of piezoresistive cantilever force sensors

Validation of a technological process requires an intensive characterization of the performance of the resulting devices, circuits, or systems. The technology for the fabrication of micro and nanoelectromechanical systems (MEMS and NEMS) is evolving rapidly, with new kind of device concepts for applications like sensing or harvesting are being proposed and demonstrated. However, the characterization tools and methods for these new devices are still not fully developed. Here, we present an on-wafer, highly precise, and rapid characterization method to measure the mechanical, electrical, and electromechanical properties of piezoresistive cantilevers. The setup is based on a combination of probe-card and atomic force microscopy technology, it allows accessing many devices across a wafer and it can be applied to a broad range of MEMS and NEMS. Using this setup we have characterized the performance of multiple submicron thick piezoresistive cantilever force sensors. For the best design we have obtained a force sensitivity ℜ_F = 158μV/nN, a noise of 5.8 μV (1 Hz–1 kHz) and a minimum detectable force of 37 pN with a relative standard deviation of σ_r ≈ 8%. This small value of σr, together with a high fabrication yield >95%, validates our fabrication technology. These devices are intended to be used as bio-molecular detectors for the measurement of intermolecular forces between ligand and receptor molecule pairs

Modification of HF-treated silicon (100) surfaces by scanning tunneling microscopy in air under imaging conditions

The modification of HF-etched silicon (100) surface with a scanning tunneling microscope(STM) operated in air is studied for the first time in samples subjected to the standard HF etching without the follow-up rinsing in H2O. The modifications are produced in air under normal STM imaging conditions (V t =−1.4 V and I t =2 nA). The simultaneous acquisition of topographical, current image tunneling spectroscopy and local barrier-height images clearly shows that the nature of the modification is not only topographical but also chemical. The features produced with a resolution better than 25 nm are attributed to a tip-induced oxidation enhanced by the presence of fluorine on the surface

Mechanical detection of carbon nanotube resonator vibrations

Bending-mode vibrations of carbon nanotube resonator devices were mechanically detected in air at atmospheric pressure by means of a novel scanning force microscopy method. The fundamental and higher order bending eigenmodes were imaged at up to 3.1GHz with sub-nanometer resolution in vibration amplitude. The resonance frequency and the eigenmode shape of multi-wall nanotubes are consistent with the elastic beam theory for a doubly clamped beam. For single-wall nanotubes, however, resonance frequencies are significantly shifted, which is attributed to fabrication generating, for example, slack. The effect of slack is studied by pulling down the tube with the tip, which drastically reduces the resonance frequency

Investigation of Long Monolayer Graphene Ribbons grown on Graphite Capped 6H-SiC (000-1)

We present an investigation of large, isolated, graphene ribbons grown on the C-face of on-axis semi-insulating 6H-SiC wafers. Using a graphite cap to cover the SiC sample, we modify the desorption of the Si species during the Si sublimation process. This results in a better control of the growth kinetics, yielding very long (about 300 microns long, 5 microns wide), homogeneous monolayer graphene ribbons. These ribbons fully occupy unusually large terraces on the step bunched SiC surface, as shown by AFM, optical microscopy and SEM. Raman spectrometry indicates that the thermal stress has been partially relaxed by wrinkles formation, visible in AFM images. In addition, we show that despite the low optical absorption of graphene, optical differential transmission can be successfully used to prove the monolayer character of the ribbons

Monolithic mass sensor fabricated using a conventional technology with attogram resolution in air conditions

Premi a l'excel·lència investigadora. Àmbit de les Ciències Tecnològiques. 2008Monolithic mass sensors for ultrasensitive mass detection in air conditions have been fabricated using a conventional 0.35 μm complementary metal-oxide-semiconductor (CMOS) process. The mass sensors are based on electrostatically excited submicrometer scale cantilevers integrated with CMOS electronics. The devices have been calibrated obtaining an experimental sensitivity of 6×10−11 g/cm2 Hz equivalent to 0.9 ag/Hz for locally deposited mass. Results from time-resolved mass measurements are also presented. An evaluation of the mass resolution have been performed obtaining a value of 2.4×10−17 g in air conditions, resulting in an improvement of these devices from previous works in terms of sensitivity, resolution, and fabrication process complexity

Study of the Orthoptic Assessment in Refractive Eye Surgery

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Near infra-red light detection enhancement of plasmonic photodetectors

Nowadays numerous are the applications interested in exploiting near infrared light detection like LiDAR (at 850 - 950 nm wavelengths), NIR spectroscopy, quantum computation, and the detection of light from NIR emitting scintillators. Silicon based single photon avalanche diodes (SPAD) could be a valid device achieving high detection efficiency and high timing resolution. Moreover, they can provide single photon sensitivity in large areas if arranged in extended arrays named Silicon Photomultipliers (SiPM). Nevertheless, the Photon Detection Efficiency (PDE) of standard SiPMs in the NIR range is strongly limited by the relatively low Si absorption coefficient, leading to an absorption depth much larger than the typical active thickness of Si SPAD, i.e. 18 μm at 850 nm compared to some few μm’s. Hence, the performance of Si based detectors in NIR range is still inadequate for almost all the cited applications. A potential solution to overcome the limited Si absorption coefficient is to couple these photodetectors with a structure supporting highly confined light such as plasmonic oscillations, thus increasing the absorption. In recent years, the development in nanophotonic demonstrated that the interphase between metallic nanostructured and dielectric surface can support Surface Plasmon Polaritons (SPP) i.e. electrons collective oscillation highly confined along the thickness of the device. Some of these interesting nanostructured are: i) 1- and 2-dimensional gratings; ii) bullseye structures; iii) nano-pillars and nano-holes arrays. Among those, 1D and 2D metallic nanograting are the most promising structures considering their feasibility and possible integration with Si based photodetector and SiPM technologies. In this contribution, we investigated the integration of a bidimensional metallic plasmonic nanograting structure on state of art photodetectors (PDs). For ease of production and characterization, the test devices consisted of conventional Silicon photodiodes instead of a proper SPAD. The PDs have been produced at the facility of Fondazione Bruno Kessler (Trento, Italy) using a custom CMOS-like microfabrication process similar the one used for FBK-SiPM technology. The previous described metallic nanograting is directly fabricated on a PDs by i) Electron Beam Lithography (EBL), ii) silver deposition, and iii) lift-off. Afterwards, the quantum efficiency (QE) of the produced samples have been measured in (450-1100) nm range. The first results are promising with an enhancement of about 45% at 950 nm with respect to the reference PD without any plasmonic nanostructured on top

STM induced hydrogen desorption via a hole resonance

We report STM-induced desorption of H from Si(100)-H(2$\times1$) at negative sample bias. The desorption rate exhibits a power-law dependence on current and a maximum desorption rate at -7 V. The desorption is explained by vibrational heating of H due to inelastic scattering of tunneling holes with the Si-H 5$\sigma$ hole resonance. The dependence of desorption rate on current and bias is analyzed using a novel approach for calculating inelastic scattering, which includes the effect of the electric field between tip and sample. We show that the maximum desorption rate at -7 V is due to a maximum fraction of inelastically scattered electrons at the onset of the field emission regime.Comment: 4 pages, 4 figures. To appear in Phys. Rev. Let