Complementary DMOS-VMOS integrated circuit structure

A high speed CMOS formed on a single semiconductor substrate includes a DMOS having an asymmetric channel and a VMOS with a relatively short channel length. The short channel length of the VMOS is achieved by forming a double diffusion along one edge of a V groove, or ion implanting boron into the apex of the V groove and diffusing a single layer to a relatively deep depth along both edges of the groove

Method of making V-MOS field effect transistors utilizing a two-step anisotropic etching and ion implantation

A method of making V-MOS field effect transistors is disclosed wherein a masking layer is first formed over a surface of a crystalline substrate. An aperture is then formed in the masking layer to expose the surface of the substrate. An anisotropic etchant is applied to the exposed surface so that a groove having a decreasing width within increasing depth is formed. However, the etch is not allowed to go to completion with the result that a partially formed V-shaped groove is formed. Ions are accelerated through the aperture for implantation in the crystalline substrate in the lower portion of the partially formed V-shaped groove. Thereafter, an anisotropic etchant is reapplied to the partially formed V-shaped groove, and the etch is allowed to go to completion

Implantable electrical device

A fully implantable and self contained device is disclosed composed of a flexible electrode array for surrounding damaged nerves and a signal generator for driving the electrode array with periodic electrical impulses of nanoampere magnitude to induce regeneration of the damaged nerves

Direction discriminating hearing aid system

A visual display was developed for people with substantial hearing loss in either one or both ears. The system consists of three discreet units; an eyeglass assembly for the visual display of the origin or direction of sounds; a stationary general purpose noise alarm; and a noise seeker wand

QWIPs, SLS, Landsat and the International Space Station

In 1988 DARPA provided funding to NASAs Goddard Space Flight Center to support the development of GaAs Quantum Well Infrared Photodetectors (QWIP). The goal was to make a single element photodetector that might be expandable to a two-dimensional array format. Ultimately, this led to the development of a 128 x 128 element array in collaboration with AT&T Bell Labs and Rockwell Science Center in 1990. We continued to develop numerous generations of QWIP arrays most recently resulting in the multi-QWIP focal plane for the NASA-US Geological Survey (USGS) Landsat 8 mission launched in 2013 and a similar instrument on the Landsat 9 mission to be launched in 2020. Toward the end of the Landsat 8 QWIP-based Thermal Infrared Sensor (TIRS) instrument the potential of the newly developed Strained Layer Superlattice (SLS) detector array technology became of great interest to NASA for three primary reasons: 1) higher operating temperature; 2) broad spectral response and; 3) higher sensitivity. We have collaborated extensively with QmagiQ, LLC and Northwestern University to further pursue and advance the SLS technology ever since we started back in 2012. In December of 2018 we launched the first SLS-based IR camera system to the International Space Station on board the Robotic Refueling Mission #3 (RRM3). This paper will describe the evolution of QWIP technology leading to the current development of SLS-based imaging systems at the Goddard Space Flight Center over the past 30 years

A complementary MOS process

The complete sequence used to manufacture complementary metal oxide semiconductor (CMOS) integrated circuits is described. The fixed-gate array concept is presented as a means of obtaining CMOS integrated circuits in a fast and reliable fashion. Examples of CMOS circuits fabricated by both the conventional method and the fixed-gate array method are included. The electrical parameter specifications and characteristics are given along with typical values used to produce CMOS circuits. Temperature-bias stressing data illustrating the thermal stability of devices manufactured by this process are presented. Results of a preliminary study on the radiation sensitivity of circuits manufactured by this process are discussed. Some process modifications are given which have improved the radiation hardness of our CMOS devices. A formula description of the chemicals and gases along with the gas flow rates is also included

Advanced inductively coupled plasma etching processes for fabrication of resonator-quantum well infrared photodetector

Resonator-quantum well infrared photodetectors (R-QWIPs) are the next generation of QWIP detectors that use resonances to increase the quantum efficiency (QE). To achieve the expected performance, the detector geometry must be produced in precise specification. In particular, the height of the diffractive elements (DE) and the thickness of the active resonator must be uniformly and accurately realized to within 0.05 lm accuracy and the substrates of the detectors have to be removed totally. To achieve these specifications, two optimized inductively coupled plasma (ICP) etching processes are developed. Using these etching techniques, we have fabricated a number of R-QWIP test detectors and FPAs with the required dimensions and completely removed the substrates of the test detectors and FPAs. Their QE spectra were tested to be in close agreement with the theoretical predictions. The operability and spectral non-uniformity of the FPA is about 99.57% and 3% respectively

Advanced inductively coupled plasma etching processes for fabrication of resonator-quantum well infrared photodetector

Resonator-quantum well infrared photodetectors (R-QWIPs) are the next generation of QWIP detectors that use resonances to increase the quantum efficiency (QE). To achieve the expected performance, the detector geometry must be produced in precise specification. In particular, the height of the diffractive elements (DE) and the thickness of the active resonator must be uniformly and accurately realized to within 0.05 lm accuracy and the substrates of the detectors have to be removed totally. To achieve these specifications, two optimized inductively coupled plasma (ICP) etching processes are developed. Using these etching techniques, we have fabricated a number of R-QWIP test detectors and FPAs with the required dimensions and completely removed the substrates of the test detectors and FPAs. Their QE spectra were tested to be in close agreement with the theoretical predictions. The operability and spectral non-uniformity of the FPA is about 99.57% and 3% respectively