Pluralism about Knowledge

In this paper I consider the prospects for pluralism about knowledge, that is, the view that there is a plurality of knowledge relations. After a brief overview of some views that entail a sort of pluralism about knowledge, I focus on a particular kind of knowledge pluralism I call standards pluralism. Put roughly, standards pluralism is the view that one never knows anything simpliciter. Rather, one knows by this-or-that epistemic standard. Because there is a plurality of epistemic standards, there is a plurality of knowledge relations. In §1 I argue that one can construct an impressive case for standards pluralism. In §2 I clarify the relationship between standards pluralism, epistemic contextualism and epistemic relativism. In §3 I argue that standards pluralism faces a serious objection. The gist of the objection is that standards pluralism is incompatible with plausible claims about the normative role of knowledge. In §4 I finish by sketching the form that a standards pluralist response to this objection might take

Relaxin: Review of Biology and Potential Role in Treating Heart Failure

Relaxin is a naturally occurring human peptide initially identified as a reproductive hormone. More recently, relaxin has been shown to play a key role in the maternal hemodynamic and renal adjustments that accommodate pregnancy. An understanding of these physiologic effects has led to the evaluation of relaxin as a pharmacologic agent for the treatment of patients with acute heart failure. Preliminary results have been encouraging. In addition, the other known biologic properties of relaxin, including anti-inflammatory effects, extracellular matrix remodeling effects, and angiogenic and anti-ischemic effects, all may play a role in potential benefits of relaxin therapy. Ongoing, large-scale clinical testing will provide additional insights into the potential role of relaxin in the treatment of heart failure

INNODIA Master Protocol for the evaluation of investigational medicinal products in children, adolescents and adults with newly diagnosed type 1 diabetes

Background The INNODIA consortium has established a pan-European infrastructure using validated centres to prospectively evaluate clinical data from individuals with newly diagnosed type 1 diabetes combined with centralised collection of clinical samples to determine rates of decline in beta-cell function and identify novel biomarkers, which could be used for future stratification of phase 2 clinical trials. Methods In this context, we have developed a Master Protocol, based on the “backbone” of the INNODIA natural history study, which we believe could improve the delivery of phase 2 studies exploring the use of single or combinations of Investigational Medicinal Products (IMPs), designed to prevent or reverse declines in beta-cell function in individuals with newly diagnosed type 1 diabetes. Although many IMPs have demonstrated potential efficacy in phase 2 studies, few subsequent phase 3 studies have confirmed these benefits. Currently, phase 2 drug development for this indication is limited by poor evaluation of drug dosage and lack of mechanistic data to understand variable responses to the IMPs. Identification of biomarkers which might permit more robust stratification of participants at baseline has been slow. Discussion The Master Protocol provides (1) standardised assessment of efficacy and safety, (2) comparable collection of mechanistic data, (3) the opportunity to include adaptive designs and the use of shared control groups in the evaluation of combination therapies, and (4) benefits of greater understanding of endpoint variation to ensure more robust sample size calculations and future baseline stratification using existing and novel biomarkers

Advantages of the New Generation Quasi-Monolithic Integration Technology (QMIT)

Fabrication process and advantages of the new generation quasi-monolithic integration technology are presented. The novel fabrication process gives excellent advantages such as extremely low thermal resistance, and a much lower thermal stress than the earlier QMIT concept [1]. This highly improves the packaging lifetime and electrical characteristics of the active devices. The fabrication process is simple and compatible with fabrication of high-Q passive elements. In comparison to the old concept of QMIT, elimination of air-bridges in this technology not only reduces the parasitics but also enables the fabrication of the rest of the circuit after measuring the microwave characteristics of the embedded active devices. This makes very accurate microwave and millimetrewave designs possible. Using the new fabrication process, microwave and millimetrewave circuits (with both coplanar and microstrip lines) containing power devices have for the first time been realised

Quasi-Monolithic integration technology (QMIT) for power applications

In this paper, we address the most important issues related to realisation of µ-wave and mm-wave circuits containing power devices in the novel technology of Quasi-Monolithic Integration Technology (QMIT). A finite element simulator (2D and 3D), a scanning probe microscopy (SPM), a nanometer surface profiler (DEKTAK) and a Peltier element (PE) have been used to optimise the standard structure of QMIT with respect to these issues and limitations in fabrication process. The first important issue is the thermal resistance of QMIT structure. Using a 2D finite element method, the effects of the most important parameters on thermal resistance such as the distance between active device and substrate (W), the thermal conductivity of glue (kepoxy) and use of a heat spreader to decrease thermal resistance have been investigated in detail. The second important issue is the induced thermal stress in QMIT structure which results from differences in thermal expansion coefficient of materials involved. A 3D finite element simulator, a scanning probe microscopy (SPM) measurements and a nanometer surface profiler (DEKTAK) accompanied with a Peltier element (PE) have been used to simulate and measure the thermal stress distribution in QMIT standard structure. Then, the effect of the most important parameters such as W, baking temperature of epoxy and material properties of epoxy have been described in detail

Improvements of Thermal Resistance and Thermal Stress in Quasi-Monolithic Integration Technology (QMIT) with a New Fabrication Process

Static heat transfer and thermal stress analysis for the new generation quasi-monolithic integration technology (NGQMIT) is presented using a three-dimensional finite element simulator. Effects of different factors and parameters such as the gap between the silicon sidewalls and GaAs-chip (Wg), temperature dependent materials properties, isotropic material properties and backside gold metallization thickness or diamond-filled polyimide are described. It is shown that thermal resistances of 11 °C/W and 8.5 °C/W are possible using 200 µm electroplated gold heat-spreader and diamond-filled polyimide on the backside of the active device, respectively. This promises successful realization of the high frequency circuits containing power active devices using the novel QMIT. In comparison to the earlier fabrication process [1-2], eight times improvement in thermal stress is achieved. This extremely improves lifetime of the packaging. The results of thermal stress simulation are compared with white-light interferomety measurement

Fragen morphologischer Veraenderung durch glazigene Vorgaenge im norddeutschen Raum und moegliche Auswirkungen auf vorhandene Salzstrukturen

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