Flexible In-Ga-Zn-O based circuits with two and three metal layers: simulation and fabrication study

The quest for high-performance flexible circuits call for scaling of the minimum feature size in Thin-Film Transistors (TFTs). Although reduced channel lengths can guarantee an improvement in the electrical properties of the devices, proper design rules also play a crucial role to minimize parasitics when designing fast circuits. In this letter, systematic Computer-Aided Design (CAD) simulations have guided the fabrication of highperformance flexible operational amplifiers (opamps) and logic circuits based on Indium-Gallium-Zinc-Oxide (IGZO) TFTs. In particular, the performance improvements due to the use of an additional third metal layer for the interconnections has been estimated for the first time. Encouraged by the simulated enhancements resulting by the decreased parasitic resistances and capacitances, both TFTs and circuits have been realized on a free-standing 50μm thick polymide foil using three metal layers. Despite the thicker layer stack, the TFTs have shown mechanical stability down to 5mm bending radii. Moreover, the opamps and the logic circuits have yielded improved electrical performance with respect to the architecture with two metal layers: gainbandwidth- product (GBWP) increased by 16:9%, for the first one, and propagation delay (tpd) decreased by 43%, for the latter one

KiDS+VIKING-450 and DES-Y1 combined:Cosmology with cosmic shear

We present a combined tomographic weak gravitational lensing analysis of the Kilo Degree Survey (KV450) and the Dark Energy Survey (DES-Y1). We homogenize the analysis of these two public cosmic shear datasets by adopting consistent priors and modeling of nonlinear scales, and determine new redshift distributions for DES-Y1 based on deep public spectroscopic surveys. Adopting these revised redshifts results in a $0.8\sigma$ reduction in the DES-inferred value for $S_8$, which decreases to a $0.5\sigma$ reduction when including a systematic redshift calibration error model from mock DES data based on the MICE2 simulation. The combined KV450 + DES-Y1 constraint on $S_8 = 0.762^{+0.025}_{-0.024}$ is in tension with the Planck 2018 constraint from the cosmic microwave background at the level of $2.5\sigma$. This result highlights the importance of developing methods to provide accurate redshift calibration for current and future weak lensing surveys.Comment: 8 pages, 4 figures, new appendix added including a simulated analysis, version accepted for publication by A&A Letters, chains can be found at https://github.com/sjoudaki/kidsde

The fifth data release of the Kilo Degree Survey: Multi-epoch optical/NIR imaging covering wide and legacy-calibration fields

\ua9 The Authors 2024.We present the final data release of the Kilo-Degree Survey (KiDS-DR5), a public European Southern Observatory (ESO) wide-field imaging survey optimised for weak gravitational lensing studies. We combined matched-depth multi-wavelength observations from the VLT Survey Telescope and the VISTA Kilo-degree INfrared Galaxy (VIKING) survey to create a nine-band optical-to-near-infrared survey spanning 1347 deg2. The median r-band 5σlimiting magnitude is 24.8 with median seeing 0.7″. The main survey footprint includes 4 deg2 of overlap with existing deep spectroscopic surveys. We complemented these data in DR5 with a targeted campaign to secure an additional 23 deg2 of KiDS- and VIKING-like imaging over a range of additional deep spectroscopic survey fields. From these fields, we extracted a catalogue of 126 085 sources with both spectroscopic and photometric redshift information, which enables the robust calibration of photometric redshifts across the full survey footprint. In comparison to previous releases, DR5 represents a 34% areal extension and includes an i-band re-observation of the full footprint, thereby increasing the effective i-band depth by 0.4 magnitudes and enabling multi-epoch science. Our processed nine-band imaging, single- and multi-band catalogues with masks, and homogenised photometry and photometric redshifts can be accessed through the ESO Archive Science Portal

The parent?infant dyad and the construction of the subjective self

Developmental psychology and psychopathology has in the past been more concerned with the quality of self-representation than with the development of the subjective agency which underpins our experience of feeling, thought and action, a key function of mentalisation. This review begins by contrasting a Cartesian view of pre-wired introspective subjectivity with a constructionist model based on the assumption of an innate contingency detector which orients the infant towards aspects of the social world that react congruently and in a specifically cued informative manner that expresses and facilitates the assimilation of cultural knowledge. Research on the neural mechanisms associated with mentalisation and social influences on its development are reviewed. It is suggested that the infant focuses on the attachment figure as a source of reliable information about the world. The construction of the sense of a subjective self is then an aspect of acquiring knowledge about the world through the caregiver's pedagogical communicative displays which in this context focuses on the child's thoughts and feelings. We argue that a number of possible mechanisms, including complementary activation of attachment and mentalisation, the disruptive effect of maltreatment on parent-child communication, the biobehavioural overlap of cues for learning and cues for attachment, may have a role in ensuring that the quality of relationship with the caregiver influences the development of the child's experience of thoughts and feelings

Integration method for electronics in woven textiles

This paper presents a technology to integrate electronics at the thread level in woven textiles. Flexible plastic substrates are cut into stripes and serve as carriers for electronics, including ICs, thin-film devices, interconnect lines, and contact pads. These functionalized plastic stripes, called e-stripes, are woven into textiles. Conductive threads perpendicular to the e-stripes electrically interconnect the devices on the individual e-stripes. The integration of e-stripes and conductive threads into the woven textiles is compatible with commercial weaving processes and suitable for large-scale manufacturing. We demonstrate the technology with a woven textile containing five e-stripes with digital temperature sensors. Conductive threads interconnect the e-stripes among each other to form a bus topology. We show that the contacts between the conductive threads and the pads on e-stripes as well as the contacts between the temperature sensors and e-stripes withstand shear forces of at least 20 N. The integration of the temperature sensors into the textile increases the bending rigidity of the textile by 30%; however, it is still possible to obtain a textile-bending radii of <;1 mm. This technology seamlessly integrates electronics into textiles, thus advancing the field of smart textiles and wearable computing