50-nm self-aligned and 'standard' T-gate InP pHEMT comparison: the influence of parasitics on performance at the 50-nm node

Continued research into the development of III-V high-electron mobility transistors (HEMTs), specifically the minimization of the device gate length, has yielded the fastest performance reported for any three terminal devices to date. In addition, more recent research has begun to focus on reducing the parasitic device elements such as access resistance and gate fringing capacitance, which become crucial for short gate length device performance maximization. Adopting a self-aligned T-gate architecture is one method used to reduce parasitic device access resistance, but at the cost of increasing parasitic gate fringing capacitances. As the device gate length is then reduced, the benefits of the self-aligned gate process come into question, as at these ultrashort-gate dimensions, the magnitude of the static fringing capacitances will have a greater impact on performance. To better understand the influence of these issues on the dc and RF performance of short gate length InP pHEMTs, the authors present a comparison between In0.7Ga0.3As channel 50-nm self-aligned and "standard" T-gate devices. Figures of merit for these devices include transconductance greater than 1.9 S/mm, drive current in the range 1.4 A/mm, and fT up to 490 GHz. Simulation of the parasitic capacitances associated with the self-aligned gate structure then leads a discussion concerning the realistic benefits of incorporating the self-aligned gate process into a sub-50-nm HEMT syste

Ultrafast harmonic mode-locking of monolithic compound-cavity laser diodes incorporating photonic-bandgap reflectors

We present the first demonstration of reproducible harmonic mode-locked operation from a novel design of monolithic semiconductor laser comprising a compound cavity formed by a 1-D photonic-bandgap (PBG) mirror. Mode-locking (ML) is achieved at a harmonic of the fundamental round-trip frequency with pulse repetition rates from 131 GHz up to a record high frequency of 2.1 THz. The devices are fabricated from GaAs-Al-GaAs material emitting at a wavelength of 860 nm and incorporate two gain sections with an etched PBG reflector between them, and a saturable absorber section. Autocorrelation studies are reported which allow the device behavior for different ML frequencies, compound cavity ratios, and type and number of intra-cavity reflectors to be analyzed. The highly reflective PBG microstructures are shown to be essential for subharmonic-free ML operation of the high-frequency devices. We have also demonstrated that the single PBG reflector can be replaced by two separate features with lower optical loss. These lasers may find applications in terahertz; imaging, medicine, ultrafast optical links, and atmospheric sensing

The Evolution of Protoplanetary Disks Around Millisecond Pulsars: The PSR 1257 +12 System

We model the evolution of protoplanetary disks surrounding millisecond pulsars, using PSR 1257+12 as a test case. Initial conditions were chosen to correspond to initial angular momenta expected for supernova-fallback disks and disks formed from the tidal disruption of a companion star. Models were run under two models for the viscous evolution of disks: fully viscous and layered accretion disk models. Supernova-fallback disks result in a distribution of solids confined to within 1-2 AU and produce the requisite material to form the three known planets surrounding PSR 1257+12. Tidal disruption disks tend to slightly underproduce solids interior to 1 AU, required for forming the pulsar planets, while overproducing the amount of solids where no body, lunar mass or greater, exists. Disks evolving under 'layered' accretion spread somewhat less and deposit a higher column density of solids into the disk. In all cases, circumpulsar gas dissipates on $\lesssim 10^{5}$ year timescales, making formation of gas giant planets highly unlikely.Comment: 16 pages, 17 figures, Accepted for publication in The Astrophysical Journal (September 20, 2007 issue

Control of threshold voltage in E-mode and D-mode GaN-on-Si metal-insulator-semiconductor heterostructure field effect transistors by in-situ fluorine doping of atomic layer deposition Al2O3 gate dielectrics

We report the modification and control of threshold voltage in enhancement and depletion mode AlGaN/GaN metal-insulator-semiconductor heterostructure field effect transistors through the use of in-situ fluorine doping of atomic layer deposition Al2O3. Uniform distribution of F ions throughout the oxide thickness are achievable, with a doping level of up to 5.5 × 1019 cm−3 as quantified by secondary ion mass spectrometry. This fluorine doping level reduces capacitive hysteretic effects when exploited in GaN metal-oxide-semiconductor capacitors. The fluorine doping and forming gas anneal also induces an average positive threshold voltage shift of between 0.75 and 1.36 V in both enhancement mode and depletion mode GaN-based transistors compared with the undoped gate oxide via a reduction of positive fixed charge in the gate oxide from +4.67 × 1012 cm−2 to −6.60 × 1012 cm−2. The application of this process in GaN based power transistors advances the realisation of normally off, high power, high speed devices

Electron mobility in surface- and buried- channel flatband In_0.53Ga_0.47As MOSFETs with ALD Al₂O₃ gate dielectric.

In this paper, we investigate the scaling potential of flatband III-V MOSFETs by comparing the mobility of surface and buried In<sub>0.53</sub>Ga<sub>0.47</sub>As channel devices employing an Atomic Layer Deposited (ALD) Al<sub>2</sub>O<sub>3</sub> gate dielectric and a delta-doped InGaAs/InAlAs/InP heterostructure. Peak electron mobilities of 4300 cm<sup>2</sup>/V·s and 6600 cm<sup>2</sup>/V·s at a carrier density of 3×1012 cm<sup>-2</sup> for the surface and buried channel structures respectively were determined. In contrast to similarly scaled inversion-channel devices, we find that mobility in surface channel flatband structures does not drop rapidly with electron density, but rather high mobility is maintained up to carrier concentrations around 4x10<sup>12</sup> cm<sup>-2</sup> before slowly dropping to around 2000 cm<sup>2</sup>/V·s at 1x10M<sup>13</sup> cm<sup>-2</sup>. We believe these to be world leading metrics for this material system and an important development in informing the III-V MOSFET device architecture selection process for future low power, highly scaled CM

Terahertz oscillations in an In_0.53Ga_0.47As submicron planar gunn diode

The length of the transit region of a Gunn diode determines the natural frequency at which it operates in fundamental mode – the shorter the device, the higher the frequency of operation. The long-held view on Gunn diode design is that for a functioning device the minimum length of the transit region is about 1.5μm, limiting the devices to fundamental mode operation at frequencies of roughly 60 GHz. Study of these devices by more advanced Monte Carlo techniques that simulate the ballistic transport and electron-phonon interactions that govern device behaviour, offers a new lower bound of 0.5μm, which is already being approached by the experimental evidence that has shown planar and vertical devices exhibiting Gunn operation at 600nm and 700nm, respectively. The paper presents results of the first ever THz submicron planar Gunn diode fabricated in In<sub>0.53</sub>Ga<sub>0.47</sub>A on an InP substrate, operating at a fundamental frequency above 300 GHz. Experimentally measured rf power of 28 µW was obtained from a 600 nm long ×120 µm wide device. At this new length, operation in fundamental mode at much higher frequencies becomes possible – the Monte Carlo model used predicts power output at frequencies over 300 GHz

Devices and fabrication technology

Advances in integrated circuit technology are the key to opening and fully exploiting new market opportunities, as exemplified recently by the massive expansion of the mobile phone sector in the telecommunications arena. The success of mobile communications is fundamentally underpinned by advances in semiconductor manufacturing technology. These have delivered key high performance components in large volume and with high yield, resulting in low unit costs. Today, the RF circuit designer has a greater choice in technology than ever before with the availability of internal corporate and external foundries offering silicon and III-V semiconductor bipolar and field effect device processes. The choice of technology ultimately depends on the application area and the component specifications. In this chapter, the wide range of active and passive device technologies utilised in contemporary MMIC realisation are reviewed, and key RF performance parameters such as bandwidth, gain, noise, power handling and linearity are compared