30 research outputs found

    Temperature dependence and size effects on strain hardening mechanisms in copper polycrystals

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    International audienc

    Size effects and temperature dependence on strain-hardening mechanisms in some face centered cubic materials

    No full text
    International audienceThe mechanical behavior of face centered cubic metals is deeply affected when specimen dimensions decrease from a few millimeters to a few micrometers. At room temperature, a critical thickness (t) to grain size (d) ratio (t/d)c was previously highlighted, under which the softening of mechanical properties became very pronounced both in terms of Hall–Petch relation and work hardening mechanisms. In this work, new experimental results are provided concerning the influence of temperature on this size effect for copper, nickel and Ni–20 wt.%Cr, representative of a wide range of deformation mechanisms (i.e. dislocation slip character). It is shown that multicrystalline samples (t/d (t/d)c) are not significant enough to reduce the gap between polycrystal and multicrystal mechanical behavior when the temperature increases. However, a transition from wavy slip to planar glide mechanisms induces a modification of the polycrystalline behavior which tends toward multicrystalline one with a moderate increase in temperature. This work demonstrates that surface effects and grain size influence can be successfully disassociated for the three studied materials using an analysis supported by the Kocks–Mecking formalism. All these results are supported by microscopic investigations of dislocation substructures and compared to numerical simulations using a strain gradient plasticity model

    Size effects and temperature dependence on strain-hardening mechanisms in some face centered cubic materials

    No full text
    International audienceThe mechanical behavior of face centered cubic metals is deeply affected when specimen dimensions decrease from a few millimeters to a few micrometers. At room temperature, a critical thickness (t) to grain size (d) ratio (t/d)c was previously highlighted, under which the softening of mechanical properties became very pronounced both in terms of Hall–Petch relation and work hardening mechanisms. In this work, new experimental results are provided concerning the influence of temperature on this size effect for copper, nickel and Ni–20 wt.%Cr, representative of a wide range of deformation mechanisms (i.e. dislocation slip character). It is shown that multicrystalline samples (t/d (t/d)c) are not significant enough to reduce the gap between polycrystal and multicrystal mechanical behavior when the temperature increases. However, a transition from wavy slip to planar glide mechanisms induces a modification of the polycrystalline behavior which tends toward multicrystalline one with a moderate increase in temperature. This work demonstrates that surface effects and grain size influence can be successfully disassociated for the three studied materials using an analysis supported by the Kocks–Mecking formalism. All these results are supported by microscopic investigations of dislocation substructures and compared to numerical simulations using a strain gradient plasticity model
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