The Transient Liquid Phase Bonding process (TLPB) : from process development to the characterization of the intermetallic assemblies

Un des enjeux majeur de l’électronique de puissance est de pouvoir étendre l’utilisation des modules de puissance à haute température, supérieure à 200°C. Or, en température, l’endommagement des joints de brasure est un des principaux modes de défaillance des modules de puissance. C’est pourquoi, l’objectif de cette thèse consiste à développer un procédé d’assemblage alternatif : le procédé de report intermétallique (IMC) en phase liquide transitoire (TLPB) à partir du système binaire cuivre-étain. Ce procédé est très attractif car il permet de former à basse température (250°C), un joint entièrement constitué de phases IMCs qui sont réputées pour leur stabilité à très haute température (supérieure à 600°C pour la phase Cu3Sn). Afin d’optimiser le procédé, l’influence des paramètres d’assemblage sur les mécanismes de croissance des phases IMCs a été déterminée. Cette étude a permis de mettre en évidence la nécessité d’insérer une barrière de diffusion de type IMC entre les substrats et le métal d’apport afin de modifier les processus de diffusion atomique aux interfaces et ainsi d’éviter la formation d’une importante porosité au sein des joints IMCs. Après avoir mis au point un procédé de report innovant et optimal, la fiabilité des assemblages IMCs a été évaluée à partir d’essais expérimentaux et de modèles numériques par éléments finis. Il a été montré que la fiabilité en cyclage thermique des joints IMCs est très supérieure à celle des alliages de brasure de référence SnAgCu. Le procédé de report IMC développé au cours de cette thèse est donc un excellent candidat au remplacement des alliages de brasure pour des applications à haute température.To meet the future requirements of power electronics, the packaging technologies of power modules must withstand higher operation temperatures, higher than 200°C. However, an increase of the operation temperatures leads to a significant decrease of the solder joints reliability and thus to the failure of the power modules. That’s why the main objective of this PhD thesis is to develop an alternative bonding technic for high temperature applications: the Transient Liquid Phase Bonding process (TLPB) based on the copper-tin binary system. This process is very attractive because it allows the formation, at low temperature, of a joint entirely composed of intermetallic (IMC) compounds which are well known for their high thermal stability. To optimize the process, the influence of the main bonding parameters on the growth of the IMC phases has been first investigated. The results indicate that the deposition of an IMC diffusion barrier is required to alter the atomic diffusion motion at the interfaces between the Cu substrates and the Sn interlayer and to avoid the formation of large pores along the bond mid-plane. After the development of an innovative and optimal bonding process, the reliability of the IMC assemblies has been investigated through experimental tests and finite element simulations. The IMC joints show a higher thermal cycling reliability than the reference SnAgCu solder alloys. Hence, the IMC bonding process developed during this PhD thesis is an excellent alternative to the soft solder alloys for high temperature applications

Le procédé de report intermétallique en Phase Liquide Transitoire (TLPB) : du développement du procédé à la caractérisation des assemblages intermétalliques

To meet the future requirements of power electronics, the packaging technologies of power modules must withstand higher operation temperatures, higher than 200°C. However, an increase of the operation temperatures leads to a significant decrease of the solder joints reliability and thus to the failure of the power modules. That’s why the main objective of this PhD thesis is to develop an alternative bonding technic for high temperature applications: the Transient Liquid Phase Bonding process (TLPB) based on the copper-tin binary system. This process is very attractive because it allows the formation, at low temperature, of a joint entirely composed of intermetallic (IMC) compounds which are well known for their high thermal stability. To optimize the process, the influence of the main bonding parameters on the growth of the IMC phases has been first investigated. The results indicate that the deposition of an IMC diffusion barrier is required to alter the atomic diffusion motion at the interfaces between the Cu substrates and the Sn interlayer and to avoid the formation of large pores along the bond mid-plane. After the development of an innovative and optimal bonding process, the reliability of the IMC assemblies has been investigated through experimental tests and finite element simulations. The IMC joints show a higher thermal cycling reliability than the reference SnAgCu solder alloys. Hence, the IMC bonding process developed during this PhD thesis is an excellent alternative to the soft solder alloys for high temperature applications.Un des enjeux majeur de l’électronique de puissance est de pouvoir étendre l’utilisation des modules de puissance à haute température, supérieure à 200°C. Or, en température, l’endommagement des joints de brasure est un des principaux modes de défaillance des modules de puissance. C’est pourquoi, l’objectif de cette thèse consiste à développer un procédé d’assemblage alternatif : le procédé de report intermétallique (IMC) en phase liquide transitoire (TLPB) à partir du système binaire cuivre-étain. Ce procédé est très attractif car il permet de former à basse température (250°C), un joint entièrement constitué de phases IMCs qui sont réputées pour leur stabilité à très haute température (supérieure à 600°C pour la phase Cu3Sn). Afin d’optimiser le procédé, l’influence des paramètres d’assemblage sur les mécanismes de croissance des phases IMCs a été déterminée. Cette étude a permis de mettre en évidence la nécessité d’insérer une barrière de diffusion de type IMC entre les substrats et le métal d’apport afin de modifier les processus de diffusion atomique aux interfaces et ainsi d’éviter la formation d’une importante porosité au sein des joints IMCs. Après avoir mis au point un procédé de report innovant et optimal, la fiabilité des assemblages IMCs a été évaluée à partir d’essais expérimentaux et de modèles numériques par éléments finis. Il a été montré que la fiabilité en cyclage thermique des joints IMCs est très supérieure à celle des alliages de brasure de référence SnAgCu. Le procédé de report IMC développé au cours de cette thèse est donc un excellent candidat au remplacement des alliages de brasure pour des applications à haute température

The Transient Liquid Phase Bonding process (TLPB) : from process development to the characterization of the intermetallic assemblies

Un des enjeux majeur de l’électronique de puissance est de pouvoir étendre l’utilisation des modules de puissance à haute température, supérieure à 200°C. Or, en température, l’endommagement des joints de brasure est un des principaux modes de défaillance des modules de puissance. C’est pourquoi, l’objectif de cette thèse consiste à développer un procédé d’assemblage alternatif : le procédé de report intermétallique (IMC) en phase liquide transitoire (TLPB) à partir du système binaire cuivre-étain. Ce procédé est très attractif car il permet de former à basse température (250°C), un joint entièrement constitué de phases IMCs qui sont réputées pour leur stabilité à très haute température (supérieure à 600°C pour la phase Cu3Sn). Afin d’optimiser le procédé, l’influence des paramètres d’assemblage sur les mécanismes de croissance des phases IMCs a été déterminée. Cette étude a permis de mettre en évidence la nécessité d’insérer une barrière de diffusion de type IMC entre les substrats et le métal d’apport afin de modifier les processus de diffusion atomique aux interfaces et ainsi d’éviter la formation d’une importante porosité au sein des joints IMCs. Après avoir mis au point un procédé de report innovant et optimal, la fiabilité des assemblages IMCs a été évaluée à partir d’essais expérimentaux et de modèles numériques par éléments finis. Il a été montré que la fiabilité en cyclage thermique des joints IMCs est très supérieure à celle des alliages de brasure de référence SnAgCu. Le procédé de report IMC développé au cours de cette thèse est donc un excellent candidat au remplacement des alliages de brasure pour des applications à haute température.To meet the future requirements of power electronics, the packaging technologies of power modules must withstand higher operation temperatures, higher than 200°C. However, an increase of the operation temperatures leads to a significant decrease of the solder joints reliability and thus to the failure of the power modules. That’s why the main objective of this PhD thesis is to develop an alternative bonding technic for high temperature applications: the Transient Liquid Phase Bonding process (TLPB) based on the copper-tin binary system. This process is very attractive because it allows the formation, at low temperature, of a joint entirely composed of intermetallic (IMC) compounds which are well known for their high thermal stability. To optimize the process, the influence of the main bonding parameters on the growth of the IMC phases has been first investigated. The results indicate that the deposition of an IMC diffusion barrier is required to alter the atomic diffusion motion at the interfaces between the Cu substrates and the Sn interlayer and to avoid the formation of large pores along the bond mid-plane. After the development of an innovative and optimal bonding process, the reliability of the IMC assemblies has been investigated through experimental tests and finite element simulations. The IMC joints show a higher thermal cycling reliability than the reference SnAgCu solder alloys. Hence, the IMC bonding process developed during this PhD thesis is an excellent alternative to the soft solder alloys for high temperature applications

The Transient Liquid Phase Bonding process (TLPB) : from process development to the characterization of the intermetallic assemblies

Un des enjeux majeur de l’électronique de puissance est de pouvoir étendre l’utilisation des modules de puissance à haute température, supérieure à 200°C. Or, en température, l’endommagement des joints de brasure est un des principaux modes de défaillance des modules de puissance. C’est pourquoi, l’objectif de cette thèse consiste à développer un procédé d’assemblage alternatif : le procédé de report intermétallique (IMC) en phase liquide transitoire (TLPB) à partir du système binaire cuivre-étain. Ce procédé est très attractif car il permet de former à basse température (250°C), un joint entièrement constitué de phases IMCs qui sont réputées pour leur stabilité à très haute température (supérieure à 600°C pour la phase Cu3Sn). Afin d’optimiser le procédé, l’influence des paramètres d’assemblage sur les mécanismes de croissance des phases IMCs a été déterminée. Cette étude a permis de mettre en évidence la nécessité d’insérer une barrière de diffusion de type IMC entre les substrats et le métal d’apport afin de modifier les processus de diffusion atomique aux interfaces et ainsi d’éviter la formation d’une importante porosité au sein des joints IMCs. Après avoir mis au point un procédé de report innovant et optimal, la fiabilité des assemblages IMCs a été évaluée à partir d’essais expérimentaux et de modèles numériques par éléments finis. Il a été montré que la fiabilité en cyclage thermique des joints IMCs est très supérieure à celle des alliages de brasure de référence SnAgCu. Le procédé de report IMC développé au cours de cette thèse est donc un excellent candidat au remplacement des alliages de brasure pour des applications à haute température.To meet the future requirements of power electronics, the packaging technologies of power modules must withstand higher operation temperatures, higher than 200°C. However, an increase of the operation temperatures leads to a significant decrease of the solder joints reliability and thus to the failure of the power modules. That’s why the main objective of this PhD thesis is to develop an alternative bonding technic for high temperature applications: the Transient Liquid Phase Bonding process (TLPB) based on the copper-tin binary system. This process is very attractive because it allows the formation, at low temperature, of a joint entirely composed of intermetallic (IMC) compounds which are well known for their high thermal stability. To optimize the process, the influence of the main bonding parameters on the growth of the IMC phases has been first investigated. The results indicate that the deposition of an IMC diffusion barrier is required to alter the atomic diffusion motion at the interfaces between the Cu substrates and the Sn interlayer and to avoid the formation of large pores along the bond mid-plane. After the development of an innovative and optimal bonding process, the reliability of the IMC assemblies has been investigated through experimental tests and finite element simulations. The IMC joints show a higher thermal cycling reliability than the reference SnAgCu solder alloys. Hence, the IMC bonding process developed during this PhD thesis is an excellent alternative to the soft solder alloys for high temperature applications

Simple fabrication and characterization of discontinuous carbon fiber reinforced aluminum matrix composite for lightweight heat sink applications

International audienceThe constant increase in power and heat flux densities encountered in electronic devices fuels a rising demand for lightweight heat sink materials with suitable thermal properties. In this study, discontinuous pitch-based carbon fiber reinforced aluminum matrix (Al-CF) composites with aluminum-silicon alloy (Al-Si) were fabricated through hot pressing. The small amount of Al-Si contributed to enhance the sintering process in order to achieve fully dense Al-CF composites. A thermal conductivity and CTE of 258 W/(m K) and 7.0 9 10-6 /K in the in-plane direction of the carbon fibers were obtained for a (Al 95 vol% ? Al-Si 5 vol%)-CF 50 vol% composite. Carbon fiber provides the reducing of CTE while the conservation of thermal conductivity and weight of Al. The achieved CTEs satisfy the standard requirements for a heat sink material, which furthermore possess a specific thermal conductivity of 109 W cm 3 /(m K g). This simple process allows the low-cost fabrication of Al-CF composite, which is applicable for a lightweight heat sink material

Improved adhesion of polycrystalline diamond films on copper/carbon composite surfaces due to in situ formation of mechanical gripping sites

Diamond coatings are investigated for thermal management, wear protection and corrosion resistance in harsh environments. In power electronic industries, copper (Cu), which shows high thermal conductivity, is considered as a promising substrate for diamond based heat-spread materials. However, the coefficient of thermal expansion (CTE) mismatch between diamond and Cu induces thermo-mechanical stresses that affect the integrity of the diamond-Cu assembly. In fact, diamond films deposited on Cu substrates tend to peel-off upon cooling due to the compressive stresses present at the diamond-Cu interface. This investigation is focused on the growth of polycrystalline diamond thin films onto Cu/CF (CF) composite materials, using combustion flame chemical vapor deposition (CVD). It has been found that increased CF content in the Cu/CF materials leads to a reduced CTE improving, hence, the adhesion between the diamond film and the Cu/CF substrate and reduces Cu/CF-diamond interfacial residual thermal stresses. At a CF content of 40% in volume, the residual thermal stress of the diamond film deposited on the Cu/CF composite is lower than that on bare Cu and adapted with CVD diamond growth. Naturally engineered composite surfaces have enhanced the adhesion of the diamond film on the composite substrate via mechanical interlocking

Controlling interfacial exchanges in liquid phase bonding enables formation of strong and reliable Cu–Sn soldering for high-power and temperature applications

Developing solder joints capable of withstanding high power density, high temperature, and significant thermomechanical stress is essential to further develop electronic device performances. This study demonstrates an effective route of producing dense, robust, and reliable high-temperature Cu–Sn soldering by modifying the interfacial exchange during a transient liquid phase bonding (TLP) process. Our approach thus relies on altering internal phenomena (diffusion and transport of reactive species) rather than classical external TLP bonding parameters (e.g., time, temperature, and pressure). By adding a Cu3Sn-coated layer between Cu and Sn before the TLP process, fast dissolution of Cu in liquid Sn is achieved, altering undesired Cu6Sn5 scallop grain impingement and promoting their uniform growth within the liquid. A bonding and pore formation mechanism of the solder with or without the Cu3Sn-coated layer is proposed based on experimental and theoretical analysis. The developed TLP joint possesses a shear stress resistance of more than 80 MPa with a thermal cycle endurance superior to 1200 (−45–180 °C), making it highly reliable compared to a classical solder joint with shear and thermal cycling resistances of 45 and 500 MPa, respectively. The developed approaches thus provide an easy, affordable, and scalable method of producing a high-temperature and durable Cu–Sn joint for high-power module applications

Controlling interfacial exchanges in liquid phase bonding enables formation of strong and reliable Cu–Sn soldering for high-power and temperature applications

Developing solder joints capable of withstanding high power density, high temperature, and significant thermomechanical stress is essential to further develop electronic device performances. This study demonstrates an effective route of producing dense, robust, and reliable high-temperature Cu–Sn soldering by modifying the interfacial exchange during a transient liquid phase bonding (TLP) process. Our approach thus relies on altering internal phenomena (diffusion and transport of reactive species) rather than classical external TLP bonding parameters (e.g., time, temperature, and pressure). By adding a Cu3Sn-coated layer between Cu and Sn before the TLP process, fast dissolution of Cu in liquid Sn is achieved, altering undesired Cu6Sn5 scallop grain impingement and promoting their uniform growth within the liquid. A bonding and pore formation mechanism of the solder with or without the Cu3Sn-coated layer is proposed based on experimental and theoretical analysis. The developed TLP joint possesses a shear stress resistance of more than 80 MPa with a thermal cycle endurance superior to 1200 (−45–180 °C), making it highly reliable compared to a classical solder joint with shear and thermal cycling resistances of 45 and 500 MPa, respectively. The developed approaches thus provide an easy, affordable, and scalable method of producing a high-temperature and durable Cu–Sn joint for high-power module applications

Perinatal exposure to a dietary pesticide cocktail does not increase susceptibility to high-fat diet-induced metabolic perturbations at adulthood but modifies urinary and fecal metabolic fingerprints in C57Bl6/J mice

International audienceBackground: We recently demonstrated that chronic dietary exposure to a mixture of pesticides at low-doses induced sexually dimorphic obesogenic and diabetogenic effects in adult mice. Perinatal pesticide exposure may also be a factor in metabolic disease etiology. However, the long-term consequences of perinatal pesticide exposure remain controversial and largely unexplored.Objectives: Here we assessed how perinatal exposure to the same low-dose pesticide cocktail impacted metabolic homeostasis in adult mice.Methods: Six pesticides (boscalid, captan, chlopyrifos, thiachloprid, thiophanate, and ziram) were incorporated in food pellets. During the gestation and lactation periods, female (F0) mice were fed either a pesticide-free or a pesticide-enriched diet at doses exposing them to the tolerable daily intake (TDI) level for each compound, using a 1:1 body weight scaling from humans to mice. All male and female offsprings (F1) were then fed the pesticide-free diet until 18 weeks of age, followed by challenge with a pesticide-free high-fat diet (HFD) for 6 weeks. Metabolic parameters, including body weight, food and water consumption, glucose tolerance, and urinary and fecal metabolomes, were assessed over time. At the end of the experiment, we evaluated energetic metabolism and microbiota activity using biochemical assays, gene expression profiling, and 1H NMR-based metabolomics in the liver, urine, and feces.Results: Perinatal pesticide exposure did not affect body weight or energy homeostasis in 6- and 14-week-old mice. As expected, HFD increased body weight and induced metabolic disorders as compared to a low-fat diet. However, HFD-induced metabolic perturbations were similar between mice with and without perinatal pesticide exposure. Interestingly, perinatal pesticide exposure induced time-specific and sex-specific alterations in the urinary and fecal metabolomes of adult mice, suggesting long-lasting changes in gut microbiota.Conclusions: Perinatal pesticide exposure induced sustained sexually dimorphic perturbations of the urinary and fecal metabolic fingerprints, but did not significantly influence the development of HFD-induced metabolic diseases

Understanding of void formation in Cu/Sn-Sn/Cu system during transient liquid phase bonding process through diffusion modeling

Transient Liquid Phase (TPL) bounding of Sn foil sandwiched between two Cu foils involves, in the temperature range above the melting point of Sn (232 °C) and below 350 °C, the formation and the growth of two intermetallic compounds (IMCs) Cu6Sn5 and Cu3Sn and mostly unintended micro-pores. The present study aims to analyze the mechanism of void development during the soldering process through an experimental and modeling approach of diffusion-controlled IMC transformation. This modeling couples the diffusion process and the interface motion with the volume shrinkage induced by the difference of partial molar volumes of atoms between each phase. We also consider two types of inter-diffusion transports: (i) inter-diffusion based on the exchange of Cu and Sn atoms and (ii) inter-diffusion of Sn atoms with vacancies allowing Kirkendall void formation. The simulations of IMC growth performed correspond to a sequence of planar phase layers, where the distinctive scallop morphology of the Cu6Sn5 layer is described through an analytical function allowing to quantify the grain boundary diffusion pathway. We take into account of the volume diffusion mechanism for Cu3Sn intermetallic. For Cu6Sn5 intermetallic two mechanisms are considered, volume diffusion and grain boundary diffusion, limited by grain growth. The simulations of IMC growth kinetics, for different transport scenarios, are compared to the experimental evolving morphologies to determine the most likely mechanism of micro-void formation