Bit-pairing codification for binary pattern projection system

In a previous work, we proposed a new binary-light projection mechanism that had a much reduced system size that made it particularly suitable for 3D shape inspection of semiconductor products. The inspection speed of the mechanism was governed by the number of required images which also equaled the number of shiftings of the grating. In this paper we address how inspection speed could be gained, i.e., how the number of required images could be reduced, by the incorporation of two neighboring bits in the codification of each scene element. We provide an optimal design of such a codification strategy. A solution to the shifting strategy optimization is also proposed that is applicable to any given binary patterns. Theoretical analysis and real image experiments are presented to illustrate the workability of the solutions. © 2006 IEEE.published_or_final_versio

Reference-free detection of semiconductor assembly defect

This paper aims at developing a novel defect detection algorithm for the semiconductor assembly process by image analysis of a single captured image, without reference to another image during inspection. The integrated circuit (IC) pattern is usually periodic and regular. Therefore, we can implement a classification scheme whereby the regular pattern in the die image is classified as the acceptable circuit pattern and the die defect can be modeled as irregularity on the image. The detection of irregularity in image is thus equivalent to the detection of die defect. We propose a method where the defect detection algorithm first segments the die image into different regions according to the circuit pattern by a set of morphological segmentations with different structuring element sizes. Then, a feature vector, which consists of many image attributes, is calculated for each segmented region. Lastly, the defective region is extracted by the feature vector classification. © 2005 SPIE and IS&T.published_or_final_versio

Three-dimensional reconstruction of wafer solder bumps using binary pattern projection

As the electronic industry advances rapidly, the shrunk dimension of the device leads to more stringent requirement on process control and quality assurance. For instance, the tiny size of the solder bumps grown on wafers for direct die-to-die bonding pose great challenge to the inspection of the bumps' 3D quality. Traditional pattern projection method of recovering 3D is about projecting a light pattern to the inspected surface and imaging the illuminated surface from one or more points of view. However, image saturation and the specular nature of the bump surface are issues. This paper proposes a new 3D reconstruction mechanism for inspecting the surface of such wafer bumps. It is still based upon the light pattern projection framework, but uses the Ronchi pattern - a pattern that contrasts with the traditionally used gray level one. With the use of a parallel or point light source in combination with a binary grating, it allows a discrete pattern to be projected onto the inspected surface. As the projected pattern is binary, the image information is binary as well. With such a bright-or-dark world for each image position, the above-mentioned difficult issues are avoided. Preliminary study shows that the mechanism holds promises that existing approaches do not. © 2005 SPIE and IS&T.published_or_final_versio

Structured-light based sensing using a single fixed fringe grating: Fringe boundary detection and 3-D reconstruction

Advanced electronic manufacturing requires the 3-D inspection of very small surfaces like the solder bumps on wafers for direct die-to-die bonding. Yet the microscopic size and highly specular and textureless nature of the surfaces make the task difficult. It is also demanded that the size of the entire inspection system be small so as to minimize restraint on the operation of the various moving parts involved in the manufacturing process. In this paper, we describe a new 3-D reconstruction mechanism for the task. The mechanism is based upon the well-known concept of structured-light projection, but adapted to a new configuration that owns a particularly small system size and operates in a different manner. Unlike the traditional mechanisms which involve an array of light sources that occupy a rather extended physical space, the proposed mechanism consists of only a single light source plus a binary grating for projecting binary pattern. To allow the projection at each position of the inspected surface to vary and form distinct binary code, the binary grating is shifted in space. In every shift, a separate image of the illuminated surface is taken. With the use of pattern projection, and of discrete coding instead of analog coding in the projection, issues like texture-absence, image saturation, and image noise of the inspected surfaces are much lessened. Experimental results on a variety of objects are presented to illustrate the effectiveness of this mechanism. © 2008 IEEE.published_or_final_versio

Projection optics design for tilted projection of fringe patterns

A challenge in the semiconductor industry is 3-D inspection of the miniaturized solder bumps grown on wafers for direct die-to-die bonding. An inspection mechanism proposed earlier requires the projection of a binary fringe grating to the inspected surface from an inclined angle. For high speed and accuracy of the mechanism, the projection optics has to meet these requirements: (1) it allows a tilt angle between the inspected surface and the projector's optical axis; (2) it has a high bandwidth to let high-spatial-frequency harmonics contained in the binary grating pass through the lens and be projected onto the inspected surface properly; (3) it has a high modulation transfer function; (4) it has a large field of view; and (5) it has an adequate depth of field that matches the depth range of the inspected surface. In this paper, we describe a projection optics design, consisting of a fringe grating and several pieces of spherical lens, that addresses the requirements. To reduce the lens aberrations, the grating is laid out with an angle chosen specifically to make the grating, the lens, and the average plane of the inspected surface intersect in the same line. Performance analysis and tolerance analysis are shown to demonstrate the feasibility of the design. © 2008 Society of Photo-Optical Instrumentation Engineers.published_or_final_versio

The Impact of Employee's Satisfaction on Company’s Well-being and Sustainability of the Company in the Long Run

Nowadays, many business owners and companies realize that employees have now become one the most important assets of a company; their level of happiness and satisfaction will directly impact their working performance and affect company's overall performance and sustainability. It is crucial for companies to keep employees satisfied because it is one of the critical components to success. This article will discuss the factors that affect employees' satisfaction and the impact of their satisfaction to the company's well-being and sustainability of the company in the long run

A comparative evaluation of dried activated sludge and mixed dried activated sludge with rice husk silica to remove hydrogen sulfide.

The aim of this study was to investigate the effectiveness of dried activated sludge (DAS) and mixed dried activated sludge with rice husk silica (DAS & RHS) for removal of hydrogen sulfide (H2S). Two laboratory-scale filter columns (packed one litter) were operated. Both systems were operated under different conditions of two parameters, namely different inlet gas concentrations and different inlet flow rates. The DAS & RHS packed filter showed more than 99.96% removal efficiency (RE) with empty bed residence time (EBRT) of 45 to 90 s and 300 mg/L inlet concentration of H2S. However, the RE decreased to 96.87% with the EBRT of 30 s. In the same condition, the DAS packed filter showed 99.37% RE. Nonetheless, the RE was shown to have dropped to 82.09% with the EBRT of 30 s. The maximum elimination capacity (EC) was obtained in the DAS & RHS packed filter up to 52.32 g/m3h, with the RE of 96.87% and H2S mass loading rate of 54 g/m3h. The maximum EC in the DAS packed filter was obtained up to 44.33 g/m3h with the RE of 82.09% and the H2S mass loading rate of 54 g/m3h. After 53 days of operating time and 54 g/m3h of loading rates, the maximum pressure drop reached to 3.0 and 8.0 (mm H2O) for the DAS & RHS packed and DAS packed filters, respectively. Based on the findings of this study, the DAS & RHS could be considered as a more suitable packing material to remove H2S

Cation-swapped homogeneous nanoparticles in perovskite oxides for high power density

Exsolution has been intensively studied in the fields of energy conversion and storage as a method for the preparation of catalytically active and durable metal nanoparticles. Under typical conditions, however, only a limited number of nanoparticles can be exsolved from the host oxides. Herein, we report the preparation of catalytic nanoparticles by selective exsolution through topotactic ion exchange, where deposited Fe guest cations can be exchanged with Co host cations in PrBaMn1.7Co0.3O5+delta. Interestingly, this phenomenon spontaneously yields the host PrBaMn1.7Fe0.3O5+delta, liberating all the Co cations from the host owing to the favorable incorporation energy of Fe into the lattice of the parent host (Delta E-incorporation = -0.41 eV) and the cation exchange energy (Delta E-exchange = -0.34 eV). Remarkably, the increase in the number of exsolved nanoparticles leads to their improved catalytic activity as a solid oxide fuel cell electrode and in the dry reforming of methane

Whole-body tissue stabilization and selective extractions via tissue-hydrogel hybrids for high-resolution intact circuit mapping and phenotyping

To facilitate fine-scale phenotyping of whole specimens, we describe here a set of tissue fixation-embedding, detergent-clearing and staining protocols that can be used to transform excised organs and whole organisms into optically transparent samples within 1–2 weeks without compromising their cellular architecture or endogenous fluorescence. PACT (passive CLARITY technique) and PARS (perfusion-assisted agent release in situ) use tissue-hydrogel hybrids to stabilize tissue biomolecules during selective lipid extraction, resulting in enhanced clearing efficiency and sample integrity. Furthermore, the macromolecule permeability of PACT- and PARS-processed tissue hybrids supports the diffusion of immunolabels throughout intact tissue, whereas RIMS (refractive index matching solution) grants high-resolution imaging at depth by further reducing light scattering in cleared and uncleared samples alike. These methods are adaptable to difficult-to-image tissues, such as bone (PACT-deCAL), and to magnified single-cell visualization (ePACT). Together, these protocols and solutions enable phenotyping of subcellular components and tracing cellular connectivity in intact biological networks