Vibrational and Thermal Properties of ZnX (X=Se, Te): Density Functional Theory (LDA and GGA) versus Experiment

We calculated the phonon dispersion relations of ZnX (X=Se, Te) employing ab initio techniques. These relations have been used to evaluate the temperature dependence of the respective specific heats of crystals with varied isotopic compositions. These results have been compared with mea- surements performed on crystals down to 2 K. The calculated and measured data are generally in excellent agreement with each other. Trends in the phonon dispersion relations and the correspond- ing densities of states for the zinc chalcogenide series of zincblende-type materials are discussed.Comment: 10 pages, submitted to PR

Analysis and application of digital spectral warping in analog and mixed-signal testing

Spectral warping is a digital signal processing transform which shifts the frequencies contained within a signal along the frequency axis. The Fourier transform coefficients of a warped signal correspond to frequency-domain 'samples' of the original signal which are unevenly spaced along the frequency axis. This property allows the technique to be efficiently used for DSP-based analog and mixed-signal testing. The analysis and application of spectral warping for test signal generation, response analysis, filter design, frequency response evaluation, etc. are discussed in this paper along with examples of the software and hardware implementation

Cerenkov generation of high-frequency confined acoustic phonons in quantum wells

We analyze the Cerenkov emission of high-frequency confined acoustic phonons by drifting electrons in a quantum well. We find that the electron drift can cause strong phonon amplification (generation). A general formula for the gain coefficient, alpha, is obtained as a function of the phonon frequency and the structure parameters. The gain coefficient increases sharply in the short-wave region. For the example of a Si/SiGe/Si device it is shown that the amplification coefficients of the order of hundreds of 1/cm can be achieved in the sub-THz frequency range.Comment: 4 pages, 2 figures. Submitted to AP

Aqueous vapour substitution for hydrogen in the process of pyrolysis

In order to decrease hydrocarbons fractional pressure in the process of ethylene pyrolysis, 0.5-1.5 kilograms of aqueous vapour is added to each kilo of feedstock. In the pyrolysis of hydrocarbon feed, a considerable part of the process' power consumption is connected with water vaporization; heating up of the diluent to 800°C and more with the subsequent condensation. The aim of this work is to reduce specific energy consumption and improve selectivity to ethylene of pyrolysis process. The same hydrocarbons fractional pressure can be created as during diluting by aqueous vapour if we use hydrogen as a diluent with its mass 9 times less. It was found that if hydrogen is purged to the furnace inlet under different feedstock temperatures prior to the pyrolitic reaction, hydrogen will become a homogeneous catalyst for the subsequent radical-chain reactions. The depth of the reaction (according to Korzun and Magaril in Thermal processes of refining 2008) will be greater, under otherwise equal conditions, than without hydrogen. Specific heat energy consumption for the production of ethylene, as well as for the amount of ethylene and propylene, with aqueous vapour substitution to hydrogen decreases. When replacing the vapour for a considerably smaller amount of hydrogen, the latter is involved in a radical chain process, providing greater selectivity for ethylene production, thereby increasing the yield of ethylene at 15% relative. As a result, ethylene production costs are significantly reduced. © 2014 WIT Press.International Journal of Safety and Security Engineering;International Journal of Sustainable Development and Planning;WIT Transactions on Ecology and the Environmen

Defect cluster recognition system for fabricated semiconductor wafers

The International Technology Roadmap for Semiconductors (ITRS) identifies production test data as an essential element in improving design and technology in the manufacturing process feedback loop. One of the observations made from the high-volume production test data is that dies that fail due to a systematic failure have a tendency to form certain unique patterns that manifest as defect clusters at the wafer level. Identifying and categorising such clusters is a crucial step towards manufacturing yield improvement and implementation of real-time statistical process control. Addressing the semiconductor industry's needs, this research proposes an automatic defect cluster recognition system for semiconductor wafers that achieves up to 95% accuracy (depending on the product type)

Уровни представления вычислительного процесса и рабочей нагрузки на ЛВС

The article considers the computational process in local area network at four levels of interaction referring to their possible decomposition into parts and the connection between these parts. Classification of types of workload is presented. A solution to the problem of the rigid dependence of the research results on the features of the architecture of the applied equipment is proposed. В статье рассматривается вычислительный процесс в локальных вычислительных сетях на четырех уровнях взаимодействия по их возможности декомпозиции на части и по связям между этими частями. Представлена классификация видов рабочей нагрузки. Предложено решение проблемы жесткой зависимости получаемых результатов исследований от особенностей архитектуры применяемого оборудования.