GaN transistors efficient cooling by graphene foam

© 2018 Elsevier Ltd Graphene conductive foams have shown very high potential as cooling material in electronic systems. Its exploitation with discrete GaN transistors is demonstrated in this paper. A proper experimental setup is developed to extract the high temperature thermal performance of this material at different test conditions. The results are very promising, showing a noticeable reduction of the device maximum temperature, especially at high dissipated power densities. Moreover, experimental results allowed the validation of a 3D finite element model of the assembled device, which can be used for thermal layout optimization. Finally, preliminary stress tests are in progress, to evaluate the stability of electrical and thermal performance of the proposed graphene based assembly. Good stability was obtained, both at low and high ambient temperatures

Non-linear thermal simulation at system level: Compact modelling and experimental validation

In this work, a general methodology to extract compact, non-linear transient thermal models of complex thermal systems is presented and validated. The focus of the work is to show a robust method to develop compact and accurate non-linear thermal models in the general case of systems with multiple heat sources. A real example of such a system is manufactured and its thermal behaviour is analyzed by means of Infra-Red thermography measurements. A transient, non-linear Finite-Element-Method based model is therefore built and tuned on the measured thermal responses. From this model, the transient thermal responses of the system are calculated in the locations of interest. From these transient responses, non-linear compact transient thermal models are derived. These models are based on Foster network topology and they can capture the effect of thermal non-linearities present in any real thermal system, accounting for mutual interaction between different power sources. The followed methodology is described, verification of the model against measurements is performed and limitations of the approach are therefore discussed. The developed methodology shows that it is possible to capture strongly non-linear effects in multiple-heat source systems with very good accuracy, enabling fast and accurate thermal simulations in electrical solvers

A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies

In this paper, a simple method to describe the effect of Printed Circuit Board (PCB) and environment on the thermal behavior of packaged devices is addressed. This approach aims at exploiting the benefit of compact thermal models, which are necessarily one-dimensional, together with the advantage of Finite Element (FE) modeling, which retains all the three-dimensional geometrical details, only in the regions of the model that must be accurately described. The main focus is on correct modeling of long power pulses for subsequent electro-thermal and thermo-mechanical analysis at chip level

THERMAL AND ELECTRO-THERMAL MODELING OF COMPONENTS AND SYSTEMS: A REVIEW OF THE RESEARCH AT THE UNIVERSITY OF PARMA

This paper reviews the activity carried out at the Department of Information Engineering of the University of Parma, Italy, in the field of thermal and electro-thermal modeling of devices, device and package assemblies, circuits, and systems encompassing active boards and heat-sinking elements. This activity includes: (i) Finite-Element 3D simulation for the thermal analysis of a hierarchy of structures ranging from bare device dies to complex systems including active and passive devices, boards, metallizations, and air- and water-cooled heat-sinks, and (ii) Lumped-Element thermal or electro-thermal models of bare and packaged devices, ranging from purely empirical to strictly physics- and geometry-based

Smart Society and Artificial Intelligence: Big Data Scheduling and the Global Standard Method Applied to Smart Maintenance

Abstract The implementation of artificial intelligence (AI) in a smart society, in which the analysis of human habits is mandatory, requires automated data scheduling and analysis using smart applications, a smart infrastructure, smart systems, and a smart network. In this context, which is characterized by a large gap between training and operative processes, a dedicated method is required to manage and extract the massive amount of data and the related information mining. The method presented in this work aims to reduce this gap with near-zero-failure advanced diagnostics (AD) for smart management, which is exploitable in any context of Society 5.0, thus reducing the risk factors at all management levels and ensuring quality and sustainability. We have also developed innovative applications for a human-centered management system to support scheduling in the maintenance of operative processes, for reducing training costs, for improving production yield, and for creating a human–machine cyberspace for smart infrastructure design. The results obtained in 12 international companies demonstrate a possible global standardization of operative processes, leading to the design of a near-zero-failure intelligent system that is able to learn and upgrade itself. Our new method provides guidance for selecting the new generation of intelligent manufacturing and smart systems in order to optimize human–machine interactions, with the related smart maintenance and education

Editorial: Grid Connection of Converters in Renewable Applications

Energy generated from renewable sources is fed into the grid by means of electronic power converters. These can be supervised at system (grid) level to coordinate all productions points together with storages and loads. Regulations impose power supply quality requirements regarding harmonics, grid fault response and low voltage ride through (LVRT). The progress of distributed generation presents challenges to converters such as island mode operation, voltage and frequency regulation, simulation, etc. New collaborative solutions for “more smart” microgrids must be included to improve power quality, reliability, service quality and duty. Wind turbines employing double-fed induction generators (DFIG) use two converters, one for the rotor side and one for the generator side. To improve the performance during severe grid failures, in Okedu and Barghash the advantages of using alternative configurations to the two-level converter, such as the parallel interleaved 2-level inverter, and the 3-level inverter, have been investigated. It has also been investigated to replace the classical dq-PLL with a new PLL, and to include a series dynamic braking resistor (SDBR) between the converters and the three-phase connections. Wind turbines must meet strict requirements, in terms of their behavior, in the event of grid failures, which are regulated by the LVRT regulations in each country. These regulations indicate, by means of voltage and time graphs, how long the wind turbines must remain connected depending on the depth of the faults. In addition, the limits of active and reactive power that can be exchanged during faults are established. The aim is to avoid cascading disconnections of wind turbines that would compromise the stability of the grid. In Okedu and Barghash, the effect of various elements in improving the behaviour of a DFIG against grid faults has been investigated. The first of these elements is the parameters of the IGBTs, concluding that the on-resistance has the greatest influence. The second is the use of a new PLL, and the third is the use of a SDBR during a grid failure. It was found that all of them could improve the performance of the generator in the event of a grid failure. When a wind turbine uses a permanent magnet synchronous generator (PMSG), 100% of the energy generated passes through both converters. In Okedu and Barghash, the control systems of the generator-side and grid-side converters have been considered; several scenarios regarding the turn on resistance of the IGBTs have been considered, and their behaviour during grid faults has been analysed. Generator performance has also been studied with and without the use of a DC-DC converter for overvoltage protection. The main generators used in wind turbines are DFIG and PMSG. In Okedu et al., a comparison of the behaviour of both wind turbines against grid faults has been carried out in various scenarios with different values of generator parameters. The number of converters, associated with renewable generation, connected to the grid has increased significantly lately. This can affect the dynamic response, especially during disturbances, but it can also provide new grid support functionalities if information on the oscillation characteristics is available. Through the use of artificial intelligence, in Baltas et al. the abilities to predict and damp electromechanical oscillations have been improved. With the constant increase in the number of wind turbines connected to the grid, it is very important to have the ability to maintain grid frequency control. In Okedu and Barghash, a work has been presented to stabilise the wind farm during periods of wind speed change by using capacitors connected via a DC-DC converter and a grid-connected DC-AC converter. It was concluded that higher values of the DC-DC converter time constant lead to better performances during load transients. A system including two steam turbines and two squirrel cage induction generators was used in the experiments. Microgrids bring power generation closer to the places of consumption to reduce the saturation of distribution lines. They consist of renewable generation, energy storage and fossil fuel generation. They have three levels of control, where the primary level is the closest to the converters, and the tertiary level, the most external and slowest, performs general monitoring functions. The paper (Buraimoh et al.) focuses on the secondary control functions related to grid failure performance. It proposes a distributed control between inverters and is based on fast detection techniques (fast Delayed Signal Cancellation, DSC), with the objective of a fast control of active and reactive power. A robust transition method between fault mode and normal mode is proposed. Accurate coordination and power sharing between distributed energy resources is achieved. Some energy conversion systems are so complex that they are very difficult to build and test in the laboratory. These include the study of high voltage direct current (HVDC) transmission when several modular multilevel converters (MMC) are involved together with DC grid failure protection elements. In Wang et al., a system including a simulated part (two digitally simulated MMC) and a physical part (two MMC) has been experimented with. The coupling between the two parts has been carried out by means of A/D and D/A converters and power amplifiers

A cost-efficient DC active load laboratory solution

The increased use of DC renewable energy resources and DC storage systems, combined with the necessary reduction of energy waste, is boosting the development of DC smart grids. In this scenario, DC load emulation is of great importance. From the hardware point of view, DC buses stability of smart grids and the different DC/DC converter topologies must be tested. From the software point of view, smart grid strategies and job schedulers must be tested with different power absorption profiles. Moreover, DC load emulation can be useful for many other purposes, such as battery characterization, power supply testing, photovoltaic I-V curve measurements, etc. In this work, a cost-efficient DC Active Load (AL) solution is proposed. The principle of the circuit topology is a buck-boost-derived converter. This solution can be designed and tested considering the required voltage, current, and maximum input power. Both simulation and experimental results are shown on a 400 W size prototype. Thermal and electrical results validate the simulation model and the AL feasibility

A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles

Current environmental concerns and fuel scarcity are leading to the progressive introduction of Electric Vehicles (EV) in the global fleet vehicle population. This requires significant design and research efforts from scientific community and industry to provide reliable automotive electric propulsion systems. The power modules used for automotive traction inverters can be considered as central elements of such systems. As they are subject to high electro-thermal stress during operation, Design-for-Reliability (DfR) approaches should be adopted. Thus, accurate models for electro-thermal simulations are relevant since the early design stages. However, such simulations become highly time consuming and complex when accurate thermal characterization through standardized or real driving conditions needs to be provided. In this context, this work proposes a simulation methodology that combines real-time simulation for electro-thermal characterization of the whole EV propulsion system, using a 1D equivalent thermal impedance circuit, in conjunction with 3D FEM thermal simulation. In this way, an accurate thermal characterization of the power module under driving cycles with long duration (of hundreds of seconds) can be obtained without computing heavy 3D FEM simulations. The proposed procedure allows to simplify and speed up the early design stages while maintaining high accuracy in the results.This work has been supported by the Department of Education, Linguistic Policy and Culture of the Basque Government within the fund for research groups of the Basque university system IT978-16, by the Government of the Basque Country within the research program ELKARTEK as the project ENSOL (KK-2018/00040), and by the program to support the education of researches of the Basque Country PRE_2017_2_0008

An Iterative Refining Approach to Design the Control of Wave Energy Converters with Numerical Modeling and Scaled HIL Testing

The aim of this work is to show that a significant increase of the e_ciency of aWave Energy Converter (WEC) can be achieved already at an early design stage, through the choice of a turbine and control regulation, by means of an accurate Wave-to-Wire (W2W) modeling that couples the hydrodynamic response calibrated in a wave flume to a Hardware-In-the-Loop (HIL) test bench with sizes and rates not matching those of the system under development. Information on this procedure is relevant to save time, because the acquisition, the installation, and the setup of a test rig are not quick and easy. Moreover, power electronics and electric machines to emulate turbines and electric generators matching the real systems are not low-cost equipment. The use of HIL is important in the development of WECs also because it allows the carrying out of tests in a controlled environment, and this is again time- and money-saving if compared to tests done on a real system installed at the sea. Furthermore, W2W modeling can be applied to several Power Take-O_ (PTO) configurations to experiment di_erent control strategies. The method here proposed, concerning a specific HIL for testing power electronics and control laws for a specific WECs, may have a more general validity.This work was supported by MARINET, a European Community—Research Infrastructure Action under the FP7 “Capacities” Specific Programme, grant agreement n. 262552

THERMAL AND ELECTRO-THERMAL MODELING OF COMPONENTS AND SYSTEMS: A REVIEW OF THE RESEARCH AT THE UNIVERSITY OF PARMA

This paper reviews the activity carried out at the Department of Information Engineering of the University of Parma, Italy, in the field of thermal and electro-thermal modeling of devices, device and package assemblies, circuits, and systems encompassing active boards and heat-sinking elements. This activity includes: (i) Finite-Element 3D simulation for the thermal analysis of a hierarchy of structures ranging from bare device dies to complex systems including active and passive devices, boards, metallizations, and air- and water-cooled heat-sinks, and (ii) Lumped-Element thermal or electro-thermal models of bare and packaged devices, ranging from purely empirical to strictly physics- and geometry-based