LIMO EEG: A Toolbox for hierarchical LInear MOdeling of ElectroEncephaloGraphic data

Magnetic- and electric-evoked brain responses have traditionally been analyzed by comparing the peaks or mean amplitudes of signals from selected channels and averaged across trials. More recently, tools have been developed to investigate single trial response variability (e.g., EEGLAB) and to test differences between averaged evoked responses over the entire scalp and time dimensions (e.g., SPM, Fieldtrip). LIMO EEG is a Matlab toolbox (EEGLAB compatible) to analyse evoked responses over all space and time dimensions, while accounting for single trial variability using a simple hierarchical linear modelling of the data. In addition, LIMO EEG provides robust parametric tests, therefore providing a new and complementary tool in the analysis of neural evoked responses

Electrical Characterization of a Thin Edgeless N-on-p Planar Pixel Sensors For ATLAS Upgrades

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon technology is a promising candidate for a large area pixel detector. The paper reports on the joint development, by LPNHE and FBK of novel n-on-p edgeless planar pixel sensors, making use of the active trench concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, and presenting some sensors' simulation results, a complete overview of the electrical characterization of the produced devices will be given.Comment: 9 pages, 9 figures, to appear in the proceedings of the 15th International Workshops on Radiation Imaging Detector

Novel Silicon n-on-p Edgeless Planar Pixel Sensors for the ATLAS upgrade

In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. We report on the development of novel n-in-p edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of the "active edge" concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology and fabrication process, we present device simulations (pre- and post-irradiation) performed for different sensor configurations. First preliminary results obtained with the test-structures of the production are shown.Comment: 6 pages, 5 figures, to appear in the proceedings of the 9th International Conference on Radiation Effects on Semiconductor Materials Detectors and Device

Development of Edgeless n-on-p Planar Pixel Sensors for future ATLAS Upgrades

The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the "active edge" technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of $1 \times 10^{15} {\rm n_{eq}}/{\rm cm}^2$ comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb$^{-1}$) for the outer pixel layers. We show that, after irradiation and at a bias voltage of 500 V, more than 50% of the signal should be collected in the edge region; this confirms the validity of the active edge approach.Comment: 20 pages, 9 figures, submitted to Nucl. Instr. and Meth.

Performance of Irradiated Thin Edgeless N-on-P Planar Pixel Sensors for ATLAS Upgrades

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon technology is a promising candidate for a large area pixel detector. The paper reports on the joint development, by LPNHE and FBK of novel n-on-p edgeless planar pixel sensors, making use of the active trench concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, a complete overview of the electrical characterization of several irradiated samples will be discussed. Some comments about detector modules being assembled will be made and eventually some plans will be outlined.Comment: 6 pages, 13 figures, to appear in the proceedings of the 2013 Nuclear Science Symposium and Medical Imaging Conference. arXiv admin note: text overlap with arXiv:1311.162

Conjugate Gradient Method Applied to Cortical Imaging in EEG/ERP

International audienc

Single phase a-plane MgZnO epilayers for UV optoelectronics: substitutional behaviour of Mg at large contents

High quality 1 μm thick a-plane MgxZn1−xO layers were produced by molecular beam epitaxy with Mg contents higher than 50%. Resonant Rutherford backscattering spectrometry combined with ion channeling revealed a uniform growth in both composition and atomic order. The lattice-site location of Mg, Zn and O elements was determined independently, proving the substitutional behaviour of Mg in Zn-sites of the wurtzite lattice. X-Ray diffraction pole figure analysis also confirms the absence of phase separation. Optical properties at such high Mg contents were studied in Schottky photodiodes

1.4669, a new lean duplex stainless steel with improved toughness and machinability

Among duplex stainless steels, the lean duplex family is a quite new family, still in expansion. It allows a goodcorrosion resistance, most of the time over that of a standard 4301 austenitic grade, to high mechanicalproperties, far higher than that of a 4301, and to a low amount of expensive alloying elements such as nickelcompared to that of a 4301.But when these grades are produced in high diameter bars, they often present a bad toughness and a poormachinability, these properties being critical when trying to use such high diameter bars in variousapplications. For example, the well-known 4062 and 4162 grades present an impact strength below 100 J at20°C and below 50 J at - 46°C on ?73mm bars. Moreover, their machinability in terms of tool wear and chipbreakability is below that of 4301 grades, especially when these last ones are of an improved machinabilityversion, such as UGIMA®. The poor machinability of these lean duplex grades is mainly due to their highmechanical properties which induce high cutting forces on the tools during a machining operation, thus, rapidtool wear, and is also due to their very low sulphur content (less than 10ppm) which does not help the chipbreaking contrarily to what happens on a 4301 grade with 0,025%S.It is the reason why UGITECH developed these last few years the 1.4669, a new lean duplex grade with a lowernitrogen content and a higher copper content in order to improve the toughness of this kind of grades and tolower the tool wear rates when machining them via a decrease of the cutting forces on the tools. Moreover, acontrol of the inclusions in the grade was performed in order to improve the chip breakability of the gradewhen machined. Of course, this new grade keeps a corrosion resistance over that of a standard 4301.INTRODUCTIONAmong duplex stainless steel, the lean duplex family is a quitenew family, still in expansion. Themost known are the 1.4062 andthe 1.4162 Lean Duplex Stainless Steels (LDSS). Compared to the1.4362, these new LDSS have a lower amount of expensive alloyingelements such as nickel (between 1,5 and 3% compared tothe 4,5% of the 1.4362). To keep a good ratio between ferrite andaustenite (not so far from 50/50) in these two LDSS, their N wasraised from around 0,12% to 0,2% and, in 1.4162, chromium wasslightly decreased (from 22-23% for 1.4362 to 21% for 1.4162).The consequences of these chemical analysismodification aremultipleas detailed in paragraphs 1 to 3: loss in toughness, in machinability(in terms of tool wear rates), and in some cases in corrosionresistance compared to the standard 1.4362. So the questionis: how can we improve the machinability and toughnessof a LDSS, without too expensive alloying elements and keep, atthe same time, a corrosion resistance equal of over that of a 1.4301austenitic SS?TOUGHNESS OF 1.4062 AND 1.4162 LDSSDifferent ? 73mm bars of 1.4062, 1.4162 and 1.4362 were industriallyproduced in order to compare their toughness, corro-Nicolas Renaudot, Eric Chauveau, Marc MantelUGITECH research centre, FrancePaper presented at the 7th European Stainless Steel Conference -Como, 21-23 September 2011sion resistance and machinability. The chemical analysi