Active and passive component embedding into low-cost plastic substrates aimed at smart system applications

The technology development for a low-cost, roll-to-roll compatible chip embedding process is described in this paper. Target applications are intelligent labels and disposable sensor patches. Two generations of the technology are depicted. In the first version of the embedding technology, the chips are embedded in an adhesive layer between a copper foil and a PET film. While this results in a very thin (< 200 µm) and flexible system, the single-layer routing and the incompatibility with passive components restricts the application of this first generation. The double-sided circuitry embedding technology is an extension of the single-sided, foil-based chip embedding, where the PET film is replaced by a second metal foil. To obtain sufficient mechanical strength and to further reduce cost, the adhesive film is replaced by a substrate material which is compatible with the chip embedding concept. Both versions of the foil-based embedding technology are very versatile, as they are compatible with a broad range of polymer materials, for which the specifications can be tuned to the final application

Performance of 3 gelatine-based resorbable cement plugs: a study on 15 synthetic femurs and a prospective randomized study on 103 patients

Background: Intramedullary plugs are key factors in improving cement fixation of the femoral component. We investigated the performance of 3 commercially available resorbable cement restrictors in vitro and in vivo. Methods: We measured the migration of the SEM II, the C-plug, and the REX plug in 15 Sawbones synthetic femurs and in 103 patients during total hip surgery. Cement pressures were also measured distally and proximally in vitro. Results and interpretation: Our in vitro results showed poor performance of the C-plug compared with the REX and SEM II plugs. In vivo, the mean migration was least for the SEM plug and most for the C-plug. The smaller sizes performed significantly better than the larger ones for all 3 plug types. The overall in vivo performance of all 3 plug types was unsatisfactory. Differences between the SEM II and REX plugs were small and therefore not significant. The SEM II performed better than the REX, the former being much cheaper and easier to insert. The Rex plug looks promising; however, the insertion device must be improved for better results. The C-plug proved to be unstable

Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications

This paper describes the successful process investigations on ultrathin flip-chip bonding for fine-pitch applications on foil, using a novel bonding process involving Isotropic Conductive Adhesives (ICA). A Ag-based B-stage curing ICA was printed using state-of-the-art electroformed stencil on printed Ag circuitry, pre-cured and flip-chip bonded at low bonding force and short duration. The interconnection resistance measurements, performed before and after a stabilizing underfilling step, revealed low interconnect resistances down to 150 μm bond pad pitch. Finally, the reliability of the specimens prepared using this process was successfully evaluated by means of standard reliability test procedures such as thermal shock testing and accelerated humidity testing

Flexible and stretchable electronics for wearable healthcare

Measuring the quality of human health and well-being is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch or integrated into garments. This requires the devices to be very thin, flexible and sometimes even stretchable. An overview will be given of recent technology developments in this domain and concrete application examples will be shown

Two new species in the Micarea prasina group from Western Europe

Peer reviewe

Angiographic findings in patients with refractory unstable angina according to troponin T status

BACKGROUND: The CAPTURE (C7E3 fab AntiPlatelet Therapy in Unstable REfactory angina) trial enrolled patients with refractory unstable angina and documented a therapeutic benefit for abciximab, a platelet glycoprotein IIb/IIIa receptor antagonist, that was particularly evident in patients with elevated troponin T (TnT) levels. In the current study, we related the angiographic data to the TnT status of the CAPTURE patients. METHODS AND RESULTS: In 853 patients, angiographic data at baseline and 18 to 24 hours after treatment were available and assessed by an Angiographic Committee with respect to TIMI flow, lesion severity, and visibility of thrombus. TnT levels >0.1 microg/L were found in 30.9% of the patients. Before randomization, thrombus was visible in 14.6% of TnT-positive patients (TnT levels >0.1 microg/L) and 4.2% of TnT-negative patients (P=0.004). Complex lesion characteristics B2+/C (72.0% versus 53.9%; P<0.001) and TIMI flow <2 (15.6% versus 5. 1%; P<0.001) were more frequent in TnT-positive patients. Abciximab was effective with respect to reduction of visible thrombus, increase of TIMI flow, and reduction of cardiac events in TnT-positive patients only. Multivariate analysis identified TnT status, but not angiographic findings, as an independent predictor for both outcome and efficacy of treatment with abciximab. CONCLUSIONS: Complex lesion characteristics and visible thrombus formation at baseline were significantly linked to TnT elevation. However, TnT st

Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils

The aim of the research described in this paper is to develop a low-cost, roll-to-roll compatible process for the realization of electronic systems in foil using chip embedding. The small cost makes these systems suitable for disposable applications as food labels, medicine packages or smart bandages. Surface mount attaching of components on foils is a well-known process for building systems-in-foil. When using low-cost films like PEN and PET, there are serious restrictions on the maximum temperatures that can be used for the surface mounting process (soldering, adhesive bonding). Surface mounting has the additional disadvantage that the components are on the surface of the foil and are therefore not well protected mechanically and physically. The proposed process flow for embedding thin chips in PET foils overcomes these limitations. A key aspect of this technology is the application of a suitable adhesive to encapsulate the chips. The resulting product is based on full-metal copper which has a good thermal and electrical conductivity and allows for fine pitches. The process is compatible with several metal foils (Cu, Al …), offering further possibilities in cost reduction, and does not rely on bumping of the chips or plating of the interconnections to the chips

Flipchip bonding of thin Si dies onto PET foils: possibilities and applications

Low cost large area flexible electronic products are expected to be used in a wide range of applications and in large quantities in our society. Examples of this include sensor packages added to food or conformal intelligent patches that monitor a patient's well-being. Because of their large area, the preferred substrate material for these applications will be low cost materials like polyesters (PEN/PET). Intelligence or communicative capabilities are preferably added to these devices by integrating the chips directly on the low cost foil itself. To maintain the flexibility of the package and not to add too much to the thickness, the Si chip needs to be integrated into the product as a bare, thinned die. Flip chip bonding is currently the most mature, widely available technology to integrate these thin chips. The low temperature stability of the PET foils however puts serious constraints on the materials and the process. The current paper specifically addresses the challenges associated with this. Initial results from a finite element model will be discussed. The model is being developed to understand the influence of the bonding process and material parameters on the final stresses and warpage of the chip. Additionally, lifetime and flexural test results will be discussed of ultrathin chips bonded on Cu and Ag-based screen printed circuitry. Finally, some applications of the technology will be shown: a microcontroller integrated on a Cu-PET foil and a supply chain monitoring tag