A Review of Bayesian Methods in Electronic Design Automation

The utilization of Bayesian methods has been widely acknowledged as a viable solution for tackling various challenges in electronic integrated circuit (IC) design under stochastic process variation, including circuit performance modeling, yield/failure rate estimation, and circuit optimization. As the post-Moore era brings about new technologies (such as silicon photonics and quantum circuits), many of the associated issues there are similar to those encountered in electronic IC design and can be addressed using Bayesian methods. Motivated by this observation, we present a comprehensive review of Bayesian methods in electronic design automation (EDA). By doing so, we hope to equip researchers and designers with the ability to apply Bayesian methods in solving stochastic problems in electronic circuits and beyond.Comment: 24 pages, a draft version. We welcome comments and feedback, which can be sent to [email protected]

A review of data mining applications in semiconductor manufacturing

The authors acknowledge Fundacao para a Ciencia e a Tecnologia (FCT-MCTES) for its financial support via the project UIDB/00667/2020 (UNIDEMI).For decades, industrial companies have been collecting and storing high amounts of data with the aim of better controlling and managing their processes. However, this vast amount of information and hidden knowledge implicit in all of this data could be utilized more efficiently. With the help of data mining techniques unknown relationships can be systematically discovered. The production of semiconductors is a highly complex process, which entails several subprocesses that employ a diverse array of equipment. The size of the semiconductors signifies a high number of units can be produced, which require huge amounts of data in order to be able to control and improve the semiconductor manufacturing process. Therefore, in this paper a structured review is made through a sample of 137 papers of the published articles in the scientific community regarding data mining applications in semiconductor manufacturing. A detailed bibliometric analysis is also made. All data mining applications are classified in function of the application area. The results are then analyzed and conclusions are drawn.publishersversionpublishe

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Spatial stochastic processes for yield and reliability management with applications to nano electronics

This study uses the spatial features of defects on the wafers to examine the detection and control of process variation in semiconductor fabrication. It applies spatial stochastic process to semiconductor yield modeling and the extrinsic reliabil- ity estimation model. New yield models of integrated circuits based on the spatial point process are established. The defect density which varies according to location on the wafer is modeled by the spatial nonhomogeneous Poisson process. And, in order to capture the variations in defect patterns between wafers, a random coeff- cient model and model-based clustering are applied. Model-based clustering is also applied to the fabrication process control for detecting these defect clusters that are generated by assignable causes. An extrinsic reliability model using defect data and a statistical defect growth model are developed based on the new yield model

Advanced Process Monitoring for Industry 4.0

This book reports recent advances on Process Monitoring (PM) to cope with the many challenges raised by the new production systems, sensors and “extreme data” conditions that emerged with Industry 4.0. Concepts such as digital-twins and deep learning are brought to the PM arena, pushing forward the capabilities of existing methodologies to handle more complex scenarios. The evolution of classical paradigms such as Latent Variable modeling, Six Sigma and FMEA are also covered. Applications span a wide range of domains such as microelectronics, semiconductors, chemicals, materials, agriculture, as well as the monitoring of rotating equipment, combustion systems and membrane separation processes

A Modeling Approach for Predicting the Effect of Corrosion on Electrical-Circuit Reliability

An analytical capability is being developed that can be used to predict the effect of corrosion on the performance of electrical circuits and systems. The availability of this ''toolset'' will dramatically improve our ability to influence device and circuit design, address and remediate field occurrences, and determine real limits for circuit service life. In pursuit of this objective, we have defined and adopted an iterative, statistical-based, top-down approach that will permit very formidable and real obstacles related to both the development and use of the toolset to be resolved as effectively as possible. An important component of this approach is the direct incorporation of expert opinion. Some of the complicating factors to be addressed involve the code/model complexity, the existence of large number of possible degradation processes, and an incompatibility between the length scales associated with device dimensions and the corrosion processes. Two of the key aspects of the desired predictive toolset are (1) a direct linkage of an electrical-system performance model with mechanistic-based, deterministic corrosion models, and (2) the explicit incorporation of a computational framework to quantify the effects of non-deterministic parameters (uncertainty). The selected approach and key elements of the toolset are first described in this paper. These descriptions are followed by some examples of how this toolset development process is being implemented

Sensor-Based Monitoring and Inspection of Surface Morphology in Ultraprecision Manufacturing Processes

This research proposes approaches for monitoring and inspection of surface morphology with respect to two ultraprecision/nanomanufacturing processes, namely, ultraprecision machining (UPM) and chemical mechanical planarization (CMP). The methods illustrated in this dissertation are motivated from the compelling need for in situ process monitoring in nanomanufacturing and invoke concepts from diverse scientific backgrounds, such as artificial neural networks, Bayesian learning, and algebraic graph theory. From an engineering perspective, this work has the following contributions:1. A combined neural network and Bayesian learning approach for early detection of UPM process anomalies by integrating data from multiple heterogeneous in situ sensors (force, vibration, and acoustic emission) is developed. The approach captures process drifts in UPM of aluminum 6061 discs within 15 milliseconds of their inception and is therefore valuable for minimizing yield losses.2. CMP process dynamics are mathematically represented using a deterministic multi-scale hierarchical nonlinear differential equation model. This process-machine inter-action (PMI) model is evocative of the various physio-mechanical aspects in CMP and closely emulates experimentally acquired vibration signal patterns, including complex nonlinear dynamics manifest in the process. By combining the PMI model predictions with features gathered from wirelessly acquired CMP vibration signal patterns, CMP process anomalies, such as pad wear, and drifts in polishing were identified in their nascent stage with high fidelity (R2 ~ 75%).3. An algebraic graph theoretic approach for quantifying nano-surface morphology from optical micrograph images is developed. The approach enables a parsimonious representation of the topological relationships between heterogeneous nano-surface fea-tures, which are enshrined in graph theoretic entities, namely, the similarity, degree, and Laplacian matrices. Topological invariant measures (e.g., Fiedler number, Kirchoff index) extracted from these matrices are shown to be sensitive to evolving nano-surface morphology. For instance, we observed that prominent nanoscale morphological changes on CMP processed Cu wafers, although discernible visually, could not be tractably quantified using statistical metrology parameters, such as arithmetic average roughness (Sa), root mean square roughness (Sq), etc. In contrast, CMP induced nanoscale surface variations were captured on invoking graph theoretic topological invariants. Consequently, the graph theoretic approach can enable timely, non-contact, and in situ metrology of semiconductor wafers by obviating the need for reticent profile mapping techniques (e.g., AFM, SEM, etc.), and thereby prevent the propagation of yield losses over long production runs.Industrial Engineering & Managemen