Advanced Fault Diagnosis and Health Monitoring Techniques for Complex Engineering Systems

Over the last few decades, the field of fault diagnostics and structural health management has been experiencing rapid developments. The reliability, availability, and safety of engineering systems can be significantly improved by implementing multifaceted strategies of in situ diagnostics and prognostics. With the development of intelligence algorithms, smart sensors, and advanced data collection and modeling techniques, this challenging research area has been receiving ever-increasing attention in both fundamental research and engineering applications. This has been strongly supported by the extensive applications ranging from aerospace, automotive, transport, manufacturing, and processing industries to defense and infrastructure industries

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.Framework of the IQONIC Project; European Union’s Horizon 2020 Research and Innovation Program

Imaging Sensors and Applications

In past decades, various sensor technologies have been used in all areas of our lives, thus improving our quality of life. In particular, imaging sensors have been widely applied in the development of various imaging approaches such as optical imaging, ultrasound imaging, X-ray imaging, and nuclear imaging, and contributed to achieve high sensitivity, miniaturization, and real-time imaging. These advanced image sensing technologies play an important role not only in the medical field but also in the industrial field. This Special Issue covers broad topics on imaging sensors and applications. The scope range of imaging sensors can be extended to novel imaging sensors and diverse imaging systems, including hardware and software advancements. Additionally, biomedical and nondestructive sensing applications are welcome

Intelligent Circuits and Systems

ICICS-2020 is the third conference initiated by the School of Electronics and Electrical Engineering at Lovely Professional University that explored recent innovations of researchers working for the development of smart and green technologies in the fields of Energy, Electronics, Communications, Computers, and Control. ICICS provides innovators to identify new opportunities for the social and economic benefits of society.　 This conference bridges the gap between academics and R&D institutions, social visionaries, and experts from all strata of society to present their ongoing research activities and foster research relations between them. It provides opportunities for the exchange of new ideas, applications, and experiences in the field of smart technologies and finding global partners for future collaboration. The ICICS-2020 was conducted in two broad categories, Intelligent Circuits & Intelligent Systems and Emerging Technologies in Electrical Engineering

Investigation into Detection of Hardware Trojans on Printed Circuit Boards

The modern semiconductor device manufacturing flow is becoming increasingly vulnerable to malicious implants called Hardware Trojans (HT). With HTs becoming stealthier, a need for more accurate and efficient detection methods is becoming increasingly crucial at both Integrated Circuit (IC) and Printed Circuit Board (PCB) levels. While HT detection at an IC level has been widely studied, there is still very limited research on detecting and preventing HTs implanted on PCBs. In recent years the rise of outsourcing design and fabrication of electronics, including PCBs, to third parties has dramatically increased the possibility of malicious alteration and consequently the security risk for systems incorporating PCBs. Providing mechanical support for the electrical interconnections between different components, PCBs are an important part of electronic systems. Modern, complex and highly integrated designs may contain up to thirty layers, with concealed micro-vias and embedded passive components. An adversary can aim to modify the PCB design by tampering the copper interconnections or inserting extra components in an internal layer of a multi-layer board. Similar to its IC counterpart, a PCB HT can, among other things, cause system failure or leakage of private information. The disruptive actions of a carefully designed HT attack can have catastrophic implications and should therefore be taken seriously by industry, academia and the government. This thesis gives an account of work carried out in three projects concerned with HT detection on a PCB. In the first contribution a power analysis method is proposed for detecting HT components, implanted on the surface or otherwise, consuming power from the power distribution network. The assumption is that any HT device actively tampering or eavesdropping on the signals in the PCB circuit will consume electrical power. Harvesting this side-channel effect and observing the fluctuations of power consumption on the PCB power distribution network enables evincing the HT. Using a purpose-built PCB prototype, an experimental setup is developed for verification of the methodology. The results confirm the ability to detect alien components on a PCB without interference with its main functionality. In the second contribution the monitoring methodology is further developed by applying machine learning (ML) techniques to detect stealthier HTs, consuming power from I/O ports of legitimate ICs on the PCB. Two algorithms, One-Class Support Vector Machine (SVM) and Local Outlier Factor (LOF), are implemented on the legitimate power consumption data harvested experimentally from the PCB prototype. Simulation results are validated through real-life measurements and experiments are carried out on the prototype PCB. For validation of the ML classification models, one hundred categories of HTs are modelled and inserted into the datasets. Simulation results show that using the proposed methodology an HT can be detected with high prediction accuracy (F1-score at 99% for a 15 mW HT). Further, the developed ML model is uploaded to the prototype PCB for experimental validation. The results show consistency between simulations and experiments, with an average discrepancy of ±5.9% observed between One-Class SVM simulations and real-life experiments. The machine learning models developed for HT detection are low-cost in terms of memory (around 27 KB). In the third contribution an automated visual inspection methodology is proposed for detecting HTs on the surface of a PCB. It is based on a combination of conventional computer vision techniques and a dual tower Siamese Neural Network (SNN), modelled in a three stage pipeline. In the interest of making the proposed methodology broadly applicable a particular emphasis is made on the imaging modality of choice, whereby a regular digital optical camera is chosen. The dataset of PCB images is developed in a controlled environment of a photographic tent. The novelty in this work is that, instead of a generic production fault detection, the algorithm is optimised and trained specifically for implanted HT component detection on a PCB, be it active or passive. The proposed HT detection methodology is trained and tested with three groups of HTs, categorised based on their surface area, ranging from 4 mm² to 280 mm² and above. The results show that it is possible to reach effective detection accuracy of 95.1% for HTs as small as 4 mm². In case of HTs with surface area larger than 280 mm² the detection accuracy is around 96.1%, while the average performance across all HT groups is 95.6%

ArgonCube – A Novel Concept for Liquid Argon Time Projection Chambers

Neutrinos are elementary particles that allow for the study of some of the most fundamental questions in particle physics, e.g. the matter-antimatter asymmetry observed in the Universe. Current and future neutrino experiments are designed to measure the properties of these particles with unprecedented accuracy to answer those questions. For this purpose, large data samples collected with very sensitive and precise detectors are required. The Liquid Argon Time Projection Chamber (LArTPC) is an ideal detector for neutrino experiments as it provides accurate particle tracking and calorimetric information, and it can be scaled to large active masses for the collection of high-statistics data samples. However, monolithic LArTPCs face the problem of large cathode bias voltages of several 100 kV and a large amount of stored energy in the drift field, posing the risk of severe damage in the case of electric breakdowns. Furthermore, traditional LArTPCs employ projective wire readout systems, which introduce ambiguities in the 3-dimensional (3D) event reconstruction. The event reconstruction using data acquired with a projective wire readout is particularly challenging in high-multiplicity environments where several particle interactions can overlap within the drift window of the LArTPC. To address these problems, the ArgonCube collaboration developed a novel LArTPC design that segments the total detector volume into several electrically and optically isolated LArTPCs sharing a common cryostat. In this way, the cathode bias voltages and the stored energies within the detector’s drift fields are reduced. Furthermore, the inactive volume of the ArgonCube detector is reduced using new technology to shape the electric field. This technology would slow down the energy released in the case of an electric breakdown. The ArgonCube design furthermore employs a pixelated charge readout system that provides unambiguous particle tracking in 3D. In addition, a dielectric light detection system, sensitive to the Liquid Argon (LAr) scintillation light and with an excellent time resolution of O(1 ns), was developed. These detectors enable a precise association of detached energy depositions to specific neutrino interaction vertices, enabling an improved accuracy of the LArTPC event reconstruction. This thesis motivates the use of LArTPCs in neutrino experiments and describes the novel ArgonCube concepts and technologies. Furthermore, the design and results of several prototypes used to study the performance of the ArgonCube technologies are presented. For the detector calibration, neutral pions decaying within a LArTPC can be used as standard candles. A method based on machine-learning techniques to reconstruct neutral pion decays in a modular LArTPC environment is presented. ArgonCube found application in the Near-Detector (ND) of the Deep Underground Neutrino Experiment (DUNE) and has been proposed for one of the Far-Detector (FD) units of the experiment