Nanometer VLSI placement and optimization for multi-objective design closure

In a VLSI physical synthesis flow, placement directly defines the interconnection, which affects many other design objectives, such as timing, power consumption, congestion, and thermal issues. With the scaling of technology, the relative interconnect delay increases dramatically. As a result, placement has become a bottleneck in deep sub-micron physical synthesis. In this dissertation, I propose several optimization algorithms from global placement, placement migration, timing driven placements, to incremental power optimizations for multi-objective VLSI design closure. The first work is DPlace, a new global placement algorithm that scales well to the modern large-scale circuit placement problems. DPlace simulates the natural diffusion process to spread cells smoothly over the placement region, and uses both analytical and discrete techniques to improve the wire length. However, global placement is never sufficient for multi-objective design closure, a variety of design objectives have to be improved incrementally, such as timing, routing congestion, signal integrity, and heat distribution. Placement migration is a critical step to address the cell overlaps appearing during incremental optimizations. To achieve high placement stability, I propose a computational geometry based placement migration flow to cope with placement changes, and a new stability metric to measure the “similarity” between two placements accurately. Our placement migration algorithm has clear advantage over conventional legalization algorithms such that the neighborhood characteristics of the original placement are preserved. For timing closure in high performance designs, I present a linear programming based incremental timing driven placement to improve the timing on critical paths directly. I further present an efficient timing driven placement algorithm (Pyramids). Two formulations of Pyramids are proposed, which are suitable for different optimization stages in a physical synthesis flow. Both approaches find the optimal location for timing of a cell in constant time, through computational geometry based approaches. For fast convergence of design closure, placement should be integrated with other optimization techniques. I propose to combine placement, gate sizing and Vt swapping techniques to reduce the total power consumption, especially the leakage power, which is becoming increasingly critical for nanometer VLSI design closure.Electrical and Computer Engineerin

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs incur amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies, alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. In this monograph, we provide an overall survey on the recent advances in temperature-aware 3D MPSoC considerations. We explore the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. Our aim of proposing this survey is to provide a global perspective, highlighting the advancements and drawbacks on the recent state-of-the-ar

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Optimising and evaluating designs for reconfigurable hardware

Growing demand for computational performance, and the rising cost for chip design and manufacturing make reconfigurable hardware increasingly attractive for digital system implementation. Reconfigurable hardware, such as field-programmable gate arrays (FPGAs), can deliver performance through parallelism while also providing flexibility to enable application builders to reconfigure them. However, reconfigurable systems, particularly those involving run-time reconfiguration, are often developed in an ad-hoc manner. Such an approach usually results in low designer productivity and can lead to inefficient designs. This thesis covers three main achievements that address this situation. The first achievement is a model that captures design parameters of reconfigurable hardware and performance parameters of a given application domain. This model supports optimisations for several design metrics such as performance, area, and power consumption. The second achievement is a technique that enhances the relocatability of bitstreams for reconfigurable devices, taking into account heterogeneous resources. This method increases the flexibility of modules represented by these bitstreams while reducing configuration storage size and design compilation time. The third achievement is a technique to characterise the power consumption of FPGAs in different activity modes. This technique includes the evaluation of standby power and dedicated low-power modes, which are crucial in meeting the requirements for battery-based mobile devices

High-Speed and Low-Energy On-Chip Communication Circuits.

Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire delays have increased due to less wiring pitch with higher resistance and coupling capacitance. Due to this ever growing gap, long on-chip interconnects pose well-known latency, bandwidth, and energy challenges to high-performance VLSI systems. Repeaters effectively mitigate wire RC effects but do little to improve their energy costs. Moreover, the increased complexity and high level of integration requires higher wire densities, worsening crosstalk noise and power consumption of conventionally repeated interconnects. Such increasing concerns in global on-chip wires motivate circuits to improve wire performance and energy while reducing the number of repeaters. This work presents circuit techniques and investigation for high-performance and energy-efficient on-chip communication in the aspects of encoding, data compression, self-timed current injection, signal pre-emphasis, low-swing signaling, and technology mapping. The improved bus designs also consider the constraints of robust operation and performance/energy gains across process corners and design space. Measurement results from 5mm links on 65nm and 90nm prototype chips validate 2.5-3X improvement in energy-delay product.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75800/1/jseo_1.pd

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast