Experimental Evaluation and Comparison of Time-Multiplexed Multi-FPGA Routing Architectures

Emulating large complex designs require multi-FPGA systems (MFS). However, inter-FPGA communication is confronted by the challenge of lack of interconnect capacity due to limited number of FPGA input/output (I/O) pins. Serializing parallel signals onto a single trace effectively addresses the limited I/O pin obstacle. Besides the multiplexing scheme and multiplexing ratio (number of inter-FPGA signals per trace), the choice of the MFS routing architecture also affect the critical path latency. The routing architecture of an MFS is the interconnection pattern of FPGAs, fixed wires and/or programmable interconnect chips. Performance of existing MFS routing architectures is also limited by off-chip interface selection. In this dissertation we proposed novel 2D and 3D latency-optimized time-multiplexed MFS routing architectures. We used rigorous experimental approach and real sequential benchmark circuits to evaluate and compare the proposed and existing MFS routing architectures. This research provides a new insight into the encouraging effects of using off-chip optical interface and three dimensional MFS routing architectures. The vertical stacking results in shorter off-chip links improving the overall system frequency with the additional advantage of smaller footprint area. The proposed 3D architectures employed serialized interconnect between intra-plane and inter-plane FPGAs to address the pin limitation problem. Additionally, all off-chip links are replaced by optical fibers that exhibited latency improvement and resulted in faster MFS. Results indicated that exploiting third dimension provided latency and area improvements as compared to 2D MFS. We also proposed latency-optimized planar 2D MFS architectures in which electrical interconnections are replaced by optical interface in same spatial distribution. Performance evaluation and comparison showed that the proposed architectures have reduced critical path delay and system frequency improvement as compared to conventional MFS. We also experimentally evaluated and compared the system performance of three inter-FPGA communication schemes i.e. Logic Multiplexing, SERDES and MGT in conjunction with two routing architectures i.e. Completely Connected Graph (CCG) and TORUS. Experimental results showed that SERDES attained maximum frequency than the other two schemes. However, for very high multiplexing ratios, the performance of SERDES & MGT became comparable

A 192×128 Time Correlated SPAD Image Sensor in 40-nm CMOS Technology

A 192 X 128 pixel single photon avalanche diode (SPAD) time-resolved single photon counting (TCSPC) image sensor is implemented in STMicroelectronics 40-nm CMOS technology. The 13% fill factor, 18.4\,\,\mu \text {m} \times 9.2\,\,\mu \text{m} pixel contains a 33-ps resolution, 135-ns full scale, 12-bit time-to-digital converter (TDC) with 0.9-LSB differential and 5.64-LSB integral nonlinearity (DNL/INL). The sensor achieves a mean 219-ps full-width half-maximum (FWHM) impulse response function (IRF) and is operable at up to 18.6 kframes/s through 64 parallelized serial outputs. Cylindrical microlenses with a concentration factor of 3.25 increase the fill factor to 42%. The median dark count rate (DCR) is 25 Hz at 1.5-V excess bias. A digital calibration scheme integrated into a column of the imager allows off-chip digital process, voltage, and temperature (PVT) compensation of every frame on the fly. Fluorescence lifetime imaging microscopy (FLIM) results are presented

High capacity photonic integrated switching circuits

As the demand for high-capacity data transfer keeps increasing in high performance computing and in a broader range of system area networking environments; reconfiguring the strained networks at ever faster speeds with larger volumes of traffic has become a huge challenge. Formidable bottlenecks appear at the physical layer of these switched interconnects due to its energy consumption and footprint. The energy consumption of the highly sophisticated but increasingly unwieldy electronic switching systems is growing rapidly with line rate, and their designs are already being constrained by heat and power management issues. The routing of multi-Terabit/second data using optical techniques has been targeted by leading international industrial and academic research labs. So far the work has relied largely on discrete components which are bulky and incurconsiderable networking complexity. The integration of the most promising architectures is required in a way which fully leverages the advantages of photonic technologies. Photonic integration technologies offer the promise of low power consumption and reduced footprint. In particular, photonic integrated semiconductor optical amplifier (SOA) gate-based circuits have received much attention as a potential solution. SOA gates exhibit multi-terahertz bandwidths and can be switched from a high-gain state to a high-loss state within a nanosecond using low-voltage electronics. In addition, in contrast to the electronic switching systems, their energy consumption does not rise with line rate. This dissertation will discuss, through the use of different kind of materials and integration technologies, that photonic integrated SOA-based optoelectronic switches can be scalable in either connectivity or data capacity and are poised to become a key technology for very high-speed applications. In Chapter 2, the optical switching background with the drawbacks of optical switches using electronic cores is discussed. The current optical technologies for switching are reviewed with special attention given to the SOA-based switches. Chapter 3 discusses the first demonstrations using quantum dot (QD) material to develop scalable and compact switching matrices operating in the 1.55µm telecommunication window. In Chapter 4, the capacity limitations of scalable quantum well (QW) SOA-based multistage switches is assessed through experimental studies for the first time. In Chapter 5 theoretical analysis on the dependence of data integrity as ultrahigh line-rate and number of monolithically integrated SOA-stages increases is discussed. Chapter 6 presents some designs for the next generation of large scale photonic integrated interconnects. A 16x16 switch architecture is described from its blocking properties to the new miniaturized elements proposed. Finally, Chapter 7 presents several recommendations for future work, along with some concluding remark

3D electronics for hybrid pixel detectors – TWEPP-09

Future hybrid pixel detectors are asking for smaller pixels in order to improve spatial resolution and to deal with an increasing counting rate. Facing these requirements is foreseen to be done by microelectronics technology shrinking. However, this straightforward approach presents some disadvantages in term of performances and cost. New 3D technologies offer an alternative way with the advantage of technology mixing. For the upgrade of ATLAS pixel detector, a 3D conception of the read-out chip appeared as an interesting solution. Splitting the pixel functionalities into two separate levels will reduce pixel size and open the opportunity to take benefit of technology's mixing. Based on a previous prototype of the read-out chip FE-I4 (IBM 130nm), this paper presents the design of a hybrid pixel read-out chip using threedimensional Tezzaron-Chartered technology. In order to disentangle effects due to Chartered 130nm technology from effects involved by 3D architecture, a first translation of FEI4 prototype had been designed at the beginning of this year in Chartered 2D technology, and first test results will be presented in the last part of this paper

Reduced pin-count testing, 3D SICs, time division multiplexing, test access mechanism, simultaneous bidirectional signaling

3D Stacked Integrated Circuits (SICs) offer a promising way to cope with the technology scaling; however, the test access requirements are highly complicated due to increased transistor density and a limited number of test channels. Moreover, although the vertical interconnects in 3D SIC are capable of high-speed data transfer, the overall test speed is restricted by scan-chains that are not optimized for timing. Reduced Pin-Count Testing (RPCT) has been effectively used under these scenarios. In particular, Time Division Multiplexing (TDM) allows full utilization of interconnect bandwidth while providing low scan frequencies supported by the scan chains. However, these methods rely on Uni-Directional Signaling (UDS), in which a chip terminal (pin or a TSV) can either be used to transmit or receive data at a given time. This requires that at least two chip terminals are available at every die interface (Tester-Die or Die-Die) to form a single test channel. In this paper, we propose Simultaneous Bi-Directional Signaling (SBS), which allows a chip terminal to be used simultaneously to send and receive data, thus forming a test channel using one pin instead of two. We demonstrate how SBS can be used in conjunction with TDM to achieve reduced pin count testing while using only half the number of pins compared to conventional TDM based methods, consuming only 22.6% additional power. Alternatively, the advantage could be manifested as a test time reduction by utilizing all available test channels, allowing more parallelism and test time reduction down to half compared to UDS-based TDM. Experiments using 45nm technology suggest that the proposed method can operate at up to 1.2 GHz test clock for a stack of 3-dies, whereas for higher frequencies, a binary-weighted transmitter is proposed capable of up to 2.46 GHz test clock

Low power CMOS IC, biosensor and wireless power transfer techniques for wireless sensor network application

The emerging field of wireless sensor network (WSN) is receiving great attention due to the interest in healthcare. Traditional battery-powered devices suffer from large size, weight and secondary replacement surgery after the battery life-time which is often not desired, especially for an implantable application. Thus an energy harvesting method needs to be investigated. In addition to energy harvesting, the sensor network needs to be low power to extend the wireless power transfer distance and meet the regulation on RF power exposed to human tissue (specific absorption ratio). Also, miniature sensor integration is another challenge since most of the commercial sensors have rigid form or have a bulky size. The objective of this thesis is to provide solutions to the aforementioned challenges

Three transducers for one photodetector: essays for optical communications

Dissertation presented to obtain the PhD degree in Electrical and Computer Engineering - ElectronicsOptical processing devices based on a- SiC:H multilayer architectures are expected to become reconfigurable to perform WDM optoelectronic logic functions and provide as well complex photonic functions such as signal amplification and switching. This thesis, entitled ”Three Transducers for One Photodetector: essays for optical communications”, reports the main work areas to design, control, validate and evaluate the research of a voltage-controllable wavelength selective optical switching based on shifting between positive and negative electrically bias and a photodetector, which enables the filtering function with the detector itself and has the potential to be rapidly optically biasing tuned: System Architecture – In this work area it is defined the basic requirements of the device: light-to-dark sensitivity, colour recognition, selective optical and electrical output response, amplification and opto-electronic conversion to transmit, receive, and/or process intelligence(data).The output multiplexed signals should have a strong nonlinear dependence on the light absorption profile, i.e., on the incident light wavelength, bit rate and intensity under unbalanced light generation of carriers. Experimental Design – This test activities work area allows the evaluation of the results. Multiple monochromatic pulsed communication channels were transmitted together, each one with a specific bit sequence. The combined optical signal was analyzed by reading out, under different applied voltages and optical bias, the generated photocurrent across the device. Depending on the wavelength of the external background and irradiation side, it acts either as a short- or a long- pass band filter or as a band-stop filter Optoelectronic Algorithm Interface – To help improve our understanding of the output multiplexed signal, computer models of monolithic photodetectors are developed. Following control theoretic methods we derive state-space representation and an equivalent circuit optoelectronic simulator. We validate each model and calibrate the spectral gain model by background–probe experiments and truth tables lookup that perform 8-to-1 multiplexer (MUX) and 1-to-8 demultiplexer (DEMUX) functions. Applications – The purpose of this work area is to present a new optical logic architecture that offers considerable improvements in reconfigurability. Tunable WDM converters based on amorphous SiC multilayer photonic active filters are used to build blocks to perform standard digital system operations. The transducers combine the simultaneous demultiplexing operation with the photodetection and self amplification. They are optimized for provide the high-sensitivity needed for low-light applications, such as medicine, lighting, sensing and measurement, and manufacturing. The migration to next generation packet based networks can be much easier and smoother than previously thought, using the emerging a-Si solutions and its integration with plastic optical fiber. It will push the limits of functionality, cost/performance and integration level