Network-on-Chip Synchronization

Technology scaling has enabled the number of cores within a System on Chip (SoC) to increase significantly. Globally Asynchronous Locally Synchronous (GALS) systems using Dynamic Voltage and Frequency Scaling (DVFS) operate each of these cores on distinct and dynamic clock domains. The main communication method between these cores is increasingly more likely to be a Network-on-Chip (NoC). Typically, the interfaces between these clock domains experience multi-cycle synchronization latencies due to their use of “brute-force” synchronizers. This dissertation aims to improve the performance of NoCs and thereby SoCs as a whole by reducing this synchronization latency. First, a survey of NoC improvement techniques is presented. One such improvement technique: a multi-layer NoC, has been successfully simulated. Given how one of the most commonly used techniques is DVFS, a thorough analysis and simulation of brute-force synchronizer circuits in both current and future process technologies is presented. Unfortunately, a multi-cycle latency is unavoidable when using brute-force synchronizers, so predictive synchronizers which require only a single cycle of latency have been proposed. To demonstrate the impact of these predictive synchronizer circuits at a high level, multi-core system simulations incorporating these circuits have been completed. Multiple forms of GALS NoC configurations have been simulated, including multi-synchronous, NoC-synchronous, and single-synchronizer. Speedup on the SPLASH benchmark suite was measured to directly quantify the performance benefit of predictive synchronizers in a full system. Additionally, Mean Time Between Failures (MTBF) has been calculated for each NoC synchronizer configuration to determine the reliability benefit possible when using predictive synchronizers

Scalable System-on-Chip Design

The crisis of technology scaling led the industry of semiconductors towards the adoption of disruptive technologies and innovations to sustain the evolution of microprocessors and keep under control the timing of the design cycle. Multi-core and many-core architectures sought more energy-efficient computation by replacing a power-hungry processor with multiple simpler cores exploiting parallelism. Multi-core processors alone, however, turned out to be insufficient to sustain the ever growing demand for energy and power-efficient computation without compromising performance. Therefore, designers were pushed to drift from homogeneous architectures towards more complex heterogeneous systems that employ the large number of available transistors to incorporate a combination of customized energy-efficient accelerators, along with the general-purpose processor cores. Meanwhile, enhancements in manufacturing processes allowed designers to move a variety of peripheral components and analog devices into the chip. This paradigm shift defined the concept of {\em system-on-chip} (SoC) as a single-chip design that integrates several heterogeneous components. The rise of SoCs corresponds to a rapid decrease of the opportunity cost for integrating accelerators. In fact, on one hand, employing more transistors for powerful cores is not feasible anymore, because transistors cannot be active all at once within reasonable power budgets. On the other hand, increasing the number of homogeneous cores incurs more and more diminishing returns. The availability of cost effective silicon area for specialized hardware creates an opportunity to enter the market of semiconductors for new small players: engineers from several different scientific areas can develop competitive algorithms suitable for acceleration for domain-specific applications, such as multimedia systems, self-driving vehicles, robotics, and more. However, turning these algorithms into SoC components, referred to as {\em intellectual property}, still requires expert hardware designers who are typically not familiar with the specific domain of the target application. Furthermore, heterogeneity makes SoC design and programming much more difficult, especially because of the challenges of the integration process. This is a fine art in the hands of few expert engineers who understand system-level trade-offs, know how to design good hardware, how to handle memory and power management, how to shape and balance the traffic over an interconnect, and are able to deal with many different hardware-software interfaces. Designers need solutions enabling them to build scalable and heterogeneous SoCs. My thesis is that {\em the key to scalable SoC designs is a regular and flexible architecture that hides the complexity of heterogeneous integration from designers, while helping them focus on the important aspects of domain-specific applications through a companion system-level design methodology.} I open a path towards this goal by proposing an architecture that mitigates heterogeneity with regularity and addresses the challenges of heterogeneous component integration by implementing a set of {\em platform services}. These are hardware and software interfaces that from a system-level viewpoint give the illusion of working with a homogeneous SoC, thus making it easier to reuse accelerators and port applications across different designs, each with its own target workload and cost-performance trade-off point. A companion system-level design methodology exploits the regularity of the architecture to guide designers in implementing their intellectual property and enables an extensive design-space exploration across multiple levels of abstraction. Throughout the dissertation, I present a fully automated flow to deploy heterogeneous SoCs on single or multiple field-programmable-gate-array devices. The flow provides non-expert designers with a set of knobs for tuning system-level features based on the given mix of accelerators that they have integrated. Many contributions of my dissertation have already influenced other research projects as well as the content of an advanced course for graduate and senior undergraduate students, which aims to form a new generation of system-level designers. These new professionals need not to be circuit or register-transfer level design experts, and not even gurus of operating systems. Instead, they are trained to design efficient intellectual property by considering system-level trade-offs, while the architecture and the methodology that I describe in this dissertation empower them to integrate their components into an SoC. Finally, with the open-source release of the entire infrastructure, including the SoC-deployment flow and the software stack, I hope I will be able to inspire other research groups and help them implement ideas that further reduce the cost and design-time of future heterogeneous systems

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

A survey on scheduling and mapping techniques in 3D Network-on-chip

Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those cores to achieve higher performance by outsourcing their communication tasks. Mapping and Scheduling methodologies are key elements in assigning application tasks, allocating the tasks to the IPs, and organising communication among them to achieve some specified objectives. The goal of this paper is to present a detailed state-of-the-art of research in the field of mapping and scheduling of applications on 3D NoC, classifying the works based on several dimensions and giving some potential research directions

Hierarchical Agent-based Adaptation for Self-Aware Embedded Computing Systems

Siirretty Doriast

Embedded dynamic programming networks for networks-on-chip

PhD ThesisRelentless technology downscaling and recent technological advancements in three dimensional integrated circuit (3D-IC) provide a promising prospect to realize heterogeneous system-on-chip (SoC) and homogeneous chip multiprocessor (CMP) based on the networks-onchip (NoCs) paradigm with augmented scalability, modularity and performance. In many cases in such systems, scheduling and managing communication resources are the major design and implementation challenges instead of the computing resources. Past research efforts were mainly focused on complex design-time or simple heuristic run-time approaches to deal with the on-chip network resource management with only local or partial information about the network. This could yield poor communication resource utilizations and amortize the benefits of the emerging technologies and design methods. Thus, the provision for efficient run-time resource management in large-scale on-chip systems becomes critical. This thesis proposes a design methodology for a novel run-time resource management infrastructure that can be realized efficiently using a distributed architecture, which closely couples with the distributed NoC infrastructure. The proposed infrastructure exploits the global information and status of the network to optimize and manage the on-chip communication resources at run-time. There are four major contributions in this thesis. First, it presents a novel deadlock detection method that utilizes run-time transitive closure (TC) computation to discover the existence of deadlock-equivalence sets, which imply loops of requests in NoCs. This detection scheme, TC-network, guarantees the discovery of all true-deadlocks without false alarms in contrast to state-of-the-art approximation and heuristic approaches. Second, it investigates the advantages of implementing future on-chip systems using three dimensional (3D) integration and presents the design, fabrication and testing results of a TC-network implemented in a fully stacked three-layer 3D architecture using a through-silicon via (TSV) complementary metal-oxide semiconductor (CMOS) technology. Testing results demonstrate the effectiveness of such a TC-network for deadlock detection with minimal computational delay in a large-scale network. Third, it introduces an adaptive strategy to effectively diffuse heat throughout the three dimensional network-on-chip (3D-NoC) geometry. This strategy employs a dynamic programming technique to select and optimize the direction of data manoeuvre in NoC. It leads to a tool, which is based on the accurate HotSpot thermal model and SystemC cycle accurate model, to simulate the thermal system and evaluate the proposed approach. Fourth, it presents a new dynamic programming-based run-time thermal management (DPRTM) system, including reactive and proactive schemes, to effectively diffuse heat throughout NoC-based CMPs by routing packets through the coolest paths, when the temperature does not exceed chip’s thermal limit. When the thermal limit is exceeded, throttling is employed to mitigate heat in the chip and DPRTM changes its course to avoid throttled paths and to minimize the impact of throttling on chip performance. This thesis enables a new avenue to explore a novel run-time resource management infrastructure for NoCs, in which new methodologies and concepts are proposed to enhance the on-chip networks for future large-scale 3D integration.Iraqi Ministry of Higher Education and Scientific Research (MOHESR)

Design and Optimization of Networks-on-Chip for Future Heterogeneous Systems-on-Chip

Due to the tight power budget and reduced time-to-market, Systems-on-Chip (SoC) have emerged as a power-efficient solution that provides the functionality required by target applications in embedded systems. To support a diverse set of applications such as real-time video/audio processing and sensor signal processing, SoCs consist of multiple heterogeneous components, such as software processors, digital signal processors, and application-specific hardware accelerators. These components offer different flexibility, power, and performance values so that SoCs can be designed by mix-and-matching them. With the increased amount of heterogeneous cores, however, the traditional interconnects in an SoC exhibit excessive power dissipation and poor performance scalability. As an alternative, Networks-on-Chip (NoC) have been proposed. NoCs provide modularity at design-time because communications among the cores are isolated from their computations via standard interfaces. NoCs also exploit communication parallelism at run-time because multiple data can be transferred simultaneously. In order to construct an efficient NoC, the communication behaviors of various heterogeneous components in an SoC must be considered with the large amount of NoC design parameters. Therefore, providing an efficient NoC design and optimization framework is critical to reduce the design cycle and address the complexity of future heterogeneous SoCs. This is the thesis of my dissertation. Some existing design automation tools for NoCs support very limited degrees of automation that cannot satisfy the requirements of future heterogeneous SoCs. First, these tools only support a limited number of NoC design parameters. Second, they do not provide an integrated environment for software-hardware co-development. Thus, I propose FINDNOC, an integrated framework for the generation, optimization, and validation of NoCs for future heterogeneous SoCs. The proposed framework supports software-hardware co-development, incremental NoC design-decision model, SystemC-based NoC customization and generation, and fast system protyping with FPGA emulations. Virtual channels (VC) and multiple physical (MP) networks are the two main alternative methods to provide better performance, support quality-of-service, and avoid protocol deadlocks in packet-switched NoC design. To examine the effect of using VCs and MPs with other NoC architectural parameters, I completed a comprehensive comparative analysis that combines an analytical model, synthesis-based designs for both FPGAs and standard-cell libraries, and system-level simulations. Based on the results of this analysis, I developed VENTTI, a design and simulation environment that combines a virtual platform (VP), a NoC synthesis tool, and four NoC models characterized at different abstraction levels. VENTTI facilitates an incremental decision-making process with four NoC abstraction models associated with different NoC parameters. The selected NoC parameters can be validated by running simulations with the corresponding model instantiated in the VP. I augmented this framework to complete FINDNOC by implementing ICON, a NoC generation and customization tool that dynamically combines and customizes synthesizable SystemC components from a predesigned library. Thanks to its flexibility and automatic network interface generation capabilities, ICON can generate a rich variety of NoCs that can be then integrated into any Embedded Scalable Platform (ESP) architectures for fast prototying with FPGA emulations. I designed FINDNOC in a modular way that makes it easy to augmenting it with new capabilities. This, combined with the continuous progress of the ESP design methodology, will provide a seamless SoC integration framework, where the hardware accelerators, software applications, and NoCs can be designed, validated, and integrated simultaneously, in order to reduce the design cycle of future SoC platforms

Automated Hardware Prototyping for 3D Network on Chips

Vor mehr als 50 Jahren stellte Intel® Mitbegründer Gordon Moore eine Prognose zum Entwicklungsprozess der Transistortechnologie auf. Er prognostizierte, dass sich die Zahl der Transistoren in integrierten Schaltungen alle zwei Jahre verdoppeln wird. Seine Aussage ist immer noch gültig, aber ein Ende von Moores Gesetz ist in Sicht. Mit dem Ende von Moore’s Gesetz müssen neue Aspekte untersucht werden, um weiterhin die Leistung von integrierten Schaltungen zu steigern. Zwei mögliche Ansätze für "More than Moore” sind 3D-Integrationsverfahren und heterogene Systeme. Gleichzeitig entwickelt sich ein Trend hin zu Multi-Core Prozessoren, basierend auf Networks on chips (NoCs). Neben dem Ende des Mooreschen Gesetzes ergeben sich bei immer kleiner werdenden Technologiegrößen, vor allem jenseits der 60 nm, neue Herausforderungen. Eine Schwierigkeit ist die Wärmeableitung in großskalierten integrierten Schaltkreisen und die daraus resultierende Überhitzung des Chips. Um diesem Problem in modernen Multi-Core Architekturen zu begegnen, muss auch die Verlustleistung der Netzwerkressourcen stark reduziert werden. Diese Arbeit umfasst eine durch Hardware gesteuerte Kombination aus Frequenzskalierung und Power Gating für 3D On-Chip Netzwerke, einschließlich eines FPGA Prototypen. Dafür wurde ein Takt-synchrones 2D Netzwerk auf ein dreidimensionales asynchrones Netzwerk mit mehreren Frequenzbereichen erweitert. Zusätzlich wurde ein skalierbares Online-Power-Management System mit geringem Ressourcenaufwand entwickelt. Die Verifikation neuer Hardwarekomponenten ist einer der zeitaufwendigsten Schritte im Entwicklungsprozess hochintegrierter digitaler Schaltkreise. Um diese Aufgabe zu beschleunigen und um eine parallele Softwareentwicklung zu ermöglichen, wurde im Rahmen dieser Arbeit ein automatisiertes und benutzerfreundliches Tool für den Entwurf neuer Hardware Projekte entwickelt. Eine grafische Benutzeroberfläche zum Erstellen des gesamten Designablaufs, vom Erstellen der Architektur, Parameter Deklaration, Simulation, Synthese und Test ist Teil dieses Werkzeugs. Zudem stellt die Größe der Architektur für die Erstellung eines Prototypen eine besondere Herausforderung dar. Frühere Arbeiten haben es versäumt, eine schnelles und unkompliziertes Prototyping, insbesondere von Architekturen mit mehr als 50 Prozessorkernen, zu realisieren. Diese Arbeit umfasst eine Design Space Exploration und FPGA-basierte Prototypen von verschiedenen 3D-NoC Implementierungen mit mehr als 80 Prozessoren

A Scalable & Energy Efficient Graphene-Based Interconnection Framework for Intra and Inter-Chip Wireless Communication in Terahertz Band

Network-on-Chips (NoCs) have emerged as a communication infrastructure for the multi-core System-on-Chips (SoCs). Despite its advantages, due to the multi-hop communication over the metal interconnects, traditional Mesh based NoC architectures are not scalable in terms of performance and energy consumption. Folded architectures such as Torus and Folded Torus were proposed to improve the performance of NoCs while retaining the regular tile-based structure for ease of manufacturing. Ultra-low-latency and low-power express channels between communicating cores have also been proposed to improve the performance of conventional NoCs. However, the performance gain of these approaches is limited due to metal/dielectric based interconnection. Many emerging interconnect technologies such as 3D integration, photonic, Radio Frequency (RF), and wireless interconnects have been envisioned to alleviate the issues of a metal/dielectric interconnect system. However, photonic and RF interconnects need the additional physically overlaid optical waveguides or micro-strip transmission lines to enable data transmission across the NoC. Several on-chip antennas have shown to improve energy efficiency and bandwidth of on-chip data communications. However, the date rates of the mm-wave wireless channels are limited by the state-of-the-art power-efficient transceiver design. Recent research has brought to light novel graphene based antennas operating at THz frequencies. Due to the higher operating frequencies compared to mm-wave transceivers, the data rate that can be supported by these antennas are significantly higher. Higher operating frequencies imply that graphene based antennas are just hundred micrometers in size compared to dimensions in the range of a millimeter of mm-wave antennas. Such reduced dimensions are suitable for integration of several such transceivers in a single NoC for relatively low overheads. In this work, to exploit the benefits of a regular NoC structure in conjunction with emerging Graphene-based wireless interconnect. We propose a toroidal folding based NoC architecture. The novelty of this folding based approach is that we are using low power, high bandwidth, single hop direct point to point wireless links instead of multihop communication that happens through metallic wires. We also propose a novel phased based communication protocol through which multiple wireless links can be made active at a time without having any interference among the transceiver. This offers huge gain in terms of performance as compared to token based mechanism where only a single wireless link can be made active at a time. We also propose to extend Graphene-based wireless links to enable energy-efficient, phase-based chip-to-chip communication to create a seamless, wireless interconnection fabric for multichip systems as well. Through cycle-accurate system-level simulations, we demonstrate that such designs with torus like folding based on THz links instead of global wires along with the proposed phase based multichip systems. We provide estimates that they are able to provide significant gains (about 3 to 4 times better in terms of achievable bandwidth, packet latency and average packet energy when compared to wired system) in performance and energy efficiency in data transfer in a NoC as well as multichip system. Thus, realization of these kind of interconnection framework that could support high data rate links in Tera-bits-per-second that will alleviate the capacity limitations of current interconnection framework