Optimising and evaluating designs for reconfigurable hardware

Growing demand for computational performance, and the rising cost for chip design and manufacturing make reconfigurable hardware increasingly attractive for digital system implementation. Reconfigurable hardware, such as field-programmable gate arrays (FPGAs), can deliver performance through parallelism while also providing flexibility to enable application builders to reconfigure them. However, reconfigurable systems, particularly those involving run-time reconfiguration, are often developed in an ad-hoc manner. Such an approach usually results in low designer productivity and can lead to inefficient designs. This thesis covers three main achievements that address this situation. The first achievement is a model that captures design parameters of reconfigurable hardware and performance parameters of a given application domain. This model supports optimisations for several design metrics such as performance, area, and power consumption. The second achievement is a technique that enhances the relocatability of bitstreams for reconfigurable devices, taking into account heterogeneous resources. This method increases the flexibility of modules represented by these bitstreams while reducing configuration storage size and design compilation time. The third achievement is a technique to characterise the power consumption of FPGAs in different activity modes. This technique includes the evaluation of standby power and dedicated low-power modes, which are crucial in meeting the requirements for battery-based mobile devices

FPGA dynamic and partial reconfiguration : a survey of architectures, methods, and applications

Dynamic and partial reconfiguration are key differentiating capabilities of field programmable gate arrays (FPGAs). While they have been studied extensively in academic literature, they find limited use in deployed systems. We review FPGA reconfiguration, looking at architectures built for the purpose, and the properties of modern commercial architectures. We then investigate design flows, and identify the key challenges in making reconfigurable FPGA systems easier to design. Finally, we look at applications where reconfiguration has found use, as well as proposing new areas where this capability places FPGAs in a unique position for adoption

Méthodologies de conception ASIC pour des systèmes sur puce 3D hétérogènes à base de réseaux sur puce 3D

Dans cette thèse, nous étudions les architectures 3D NoC grâce à des implémentations de conception physiques en utilisant la technologie 3D réel mis en oeuvre dans l'industrie. Sur la base des listes d'interconnexions en déroute, nous procédons à l'analyse des performances d'évaluer le bénéfice de l'architecture 3D par rapport à sa mise en oeuvre 2D. Sur la base du flot de conception 3D proposé en se concentrant sur la vérification temporelle tirant parti de l'avantage du retard négligeable de la structure de microbilles pour les connexions verticales, nous avons mené techniques de partitionnement de NoC 3D basé sur l'architecture MPSoC y compris empilement homogène et hétérogène en utilisant Tezzaron 3D IC technlogy. Conception et mise en oeuvre de compromis dans les deux méthodes de partitionnement est étudiée pour avoir un meilleur aperçu sur l'architecture 3D de sorte qu'il peut être exploitée pour des performances optimales. En utilisant l'approche 3D homogène empilage, NoC topologies est explorée afin d'identifier la meilleure topologie entre la topologie 2D et 3D pour la mise en œuvre MPSoC 3D sous l'hypothèse que les chemins critiques est fondée sur les liens inter-routeur. Les explorations architecturales ont également examiné les différentes technologies de traitement. mettant en évidence l'effet de la technologie des procédés à la performance d'architecture 3D en particulier pour l'interconnexion dominant du design. En outre, nous avons effectué hétérogène 3D d'empilage pour la mise en oeuvre MPSoC avec l'approche GALS de style et présenté plusieurs analyses de conception physiques connexes concernant la conception 3D et la mise en œuvre MPSoC utilisant des outils de CAO 2D. Une analyse plus approfondie de l'effet microbilles pas à la performance de l'architecture 3D à l'aide face-à-face d'empilement est également signalé l'identification des problèmes et des limitations à prendre en considération pendant le processus de conception.In this thesis, we study the exploration 3D NoC architectures through physical design implementations using real 3D technology used in the industry. Based on the proposed 3D design flow focusing on timing verification by leveraging the benefit of negligible delay of microbumps structure for vertical connections, we have conducted partitioning techniques for 3D NoC-based MPSoC architecture including homogeneous and heterogeneous stacking using Tezzaron 3D IC technlogy. Design and implementation trade-off in both partitioning methods is investigated to have better insight about 3D architecture so that it can be exploited for optimal performance. Using homogeneous 3D stacking approach, NoC architectures are explored to identify the best topology between 2D and 3D topology for 3D MPSoC implementation. The architectural explorations have also considered different process technologies highlighting the wire delay effect to the 3D architecture performance especially for interconnect-dominated design. Additionally, we performed heterogeneous 3D stacking of NoC-based MPSoC implementation with GALS style approach and presented several physical designs related analyses regarding 3D MPSoC design and implementation using 2D EDA tools. Finally we conducted an exploration of 2D EDA tool on different 3D architecture to evaluate the impact of 2D EDA tools on the 3D architecture performance. Since there is no commercialize 3D design tool until now, the experiment is important on the basis that designing 3D architecture using 2D EDA tools does not have a strong and direct impact to the 3D architecture performance mainly because the tools is dedicated for 2D architecture design.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Simulated Annealing

The book contains 15 chapters presenting recent contributions of top researchers working with Simulated Annealing (SA). Although it represents a small sample of the research activity on SA, the book will certainly serve as a valuable tool for researchers interested in getting involved in this multidisciplinary field. In fact, one of the salient features is that the book is highly multidisciplinary in terms of application areas since it assembles experts from the fields of Biology, Telecommunications, Geology, Electronics and Medicine

Multi-objective Digital VLSI Design Optimisation

Modern VLSI design's complexity and density has been exponentially increasing over the past 50 years and recently reached a stage within its development, allowing heterogeneous, many-core systems and numerous functions to be integrated into a tiny silicon die. These advancements have revealed intrinsic physical limits of process technologies in advanced silicon technology nodes. Designers and EDA vendors have to handle these challenges which may otherwise result in inferior design quality, even failures, and lower design yields under time-to-market pressure. Multiple or many design objectives and constraints are emerging during the design process and often need to be dealt with simultaneously. Multi-objective evolutionary algorithms show flexible capabilities in maintaining multiple variable components and factors in uncertain environments. The VLSI design process involves a large number of available parameters both from designs and EDA tools. This provides many potential optimisation avenues where evolutionary algorithms can excel. This PhD work investigates the application of evolutionary techniques for digital VLSI design optimisation. Automated multi-objective optimisation frameworks, compatible with industrial design flows and foundry technologies, are proposed to improve solution performance, expand feasible design space, and handle complex physical floorplan constraints through tuning designs at gate-level. Methodologies for enriching standard cell libraries regarding drive strength are also introduced to cooperate with multi-objective optimisation frameworks, e.g., subsequent hill-climbing, providing a richer pool of solutions optimised for different trade-offs. The experiments of this thesis demonstrate that multi-objective evolutionary algorithms, derived from biological inspirations, can assist the digital VLSI design process, in an industrial design context, to more efficiently search for well-balanced trade-off solutions as well as optimised design space coverage. The expanded drive granularity of standard cells can push the performance of silicon technologies with offering improved solutions regarding critical objectives. The achieved optimisation results can better deliver trade-off solutions regarding power, performance and area metrics than using standard EDA tools alone. This has been not only shown for a single circuit solution but also covered the entire standard-tool-produced design space