Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes

Today, power electronic reliability is a main subject of interest for many companies and laboratories. The main process leading to the IGBT failure is the cycling thermal stress. Indeed the current flow induce local heating and then mechanical stress. This paper deals with electro thermal stress under steady and transient current states. The main objective is to test bonded wires with active current cycle. Consequently, the thermo mechanical stress is obtained. A numerical 3D finite element model is presented and some experimental results are given. Indeed an infrared system monitors the temperature dispatching from an experimental test bench under active current cycle. The overall study is a first step before a global simulation (electrical thermal-mechanical) in order to optimize some geometric parameters of the packaging

Technology for the Future: In-Space Technology Experiments Program, part 2

The purpose of the Office of Aeronautics and Space Technology (OAST) In-Space Technology Experiments Program In-STEP 1988 Workshop was to identify and prioritize technologies that are critical for future national space programs and require validation in the space environment, and review current NASA (In-Reach) and industry/ university (Out-Reach) experiments. A prioritized list of the critical technology needs was developed for the following eight disciplines: structures; environmental effects; power systems and thermal management; fluid management and propulsion systems; automation and robotics; sensors and information systems; in-space systems; and humans in space. This is part two of two parts and contains the critical technology presentations for the eight theme elements and a summary listing of critical space technology needs for each theme

Numerical modelling of a high temperature power module technology with SiC devices for high density power electronics

This paper presents the development of a new packaging technology using silicon carbide (SiC) power devices. These devices will be used in the next power electronic converters. They will provide higher densities, switching frequencies and operating temperature than current Si technologies. Thus the new designed packaging has to take into account such new constraints. The presented work tries to demonstrate the importance of packaging designs for the performance and reliability of integrated SiC power modules. In order to increase the integrated density in power modules, packaging technologies consisting of two stacked substrates with power devices and copper bumps soldered between them were proposed into two configurations. Silver sintering technique is used as die-attach material solution. In order to assess the assembling process and robustness of these packaging designs, the thermo-mechanical behaviour is studied using FEM modelling. Finally, some recommendations are made in order to choose the suitable design for reliable power module

Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact

Thermo-mechanical analysis of flexible and stretchable systems

This paper presents a summary of the modeling and technology developed for flexible and stretchable electronics. The integration of ultra thin dies at package level, with thickness in the range of 20 to 30 μ m, into flexible and/or stretchable materials are demonstrated as well as the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. These technologies can achieve mechanically bendable and stretchable subsystems. The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the relatively rigid polyimide by a soft and elastic silicone material. We have shown through finite element modeling and experimental validation that an appropriate thermo mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages

Unified Modeling Suite for Two-Phase Flow, Convective Boiling and Condensation in Macro-and Micro-Channels

This paper was presented at the 4th Micro and Nano Flows Conference (MNF2014), which was held at University College, London, UK. The conference was organised by Brunel University and supported by the Italian Union of Thermofluiddynamics, IPEM, the Process Intensification Network, the Institution of Mechanical Engineers, the Heat Transfer Society, HEXAG - the Heat Exchange Action Group, and the Energy Institute, ASME Press, LCN London Centre for Nanotechnology, UCL University College London, UCL Engineering, the International NanoScience Community, www.nanopaprika.eu.The present paper focuses on the unified modeling suite for annular flow that the authors have and continue to develop. Annular flow is of fundamental importance to the thermal design and simulation of microevaporators and micro-condensers for compact two-phase cooling systems of high heat flux components for the thermal management of computer chips, power electronics, laser diodes and high energy physics particle detectors. First, the unified suite of methods is presented, illustrating in particular the most recent updates. Then, results for convective evaporation of refrigerants in non-circular multi-microchannel configurations for microelectronics cooling are presented and discussed. The annular flow suite includes models to predict the void fraction, the entrained liquid fraction, the wall shear stress and pressure gradient, and a turbulence model for momentum and heat transport inside the annular liquid film. The turbulence model, in particular, allows prediction of the local average liquid film thicknesses and the local heat transfer coefficients during convective evaporation and condensation. The benefit of a unified modeling suite is that all the included prediction methods are consistently formulated and are proven to work well together, and provide a platform for continued advancement based on the other models in the suite

A Review on Mechanics and Mechanical Properties of 2D Materials - Graphene and Beyond

Since the first successful synthesis of graphene just over a decade ago, a variety of two-dimensional (2D) materials (e.g., transition metal-dichalcogenides, hexagonal boron-nitride, etc.) have been discovered. Among the many unique and attractive properties of 2D materials, mechanical properties play important roles in manufacturing, integration and performance for their potential applications. Mechanics is indispensable in the study of mechanical properties, both experimentally and theoretically. The coupling between the mechanical and other physical properties (thermal, electronic, optical) is also of great interest in exploring novel applications, where mechanics has to be combined with condensed matter physics to establish a scalable theoretical framework. Moreover, mechanical interactions between 2D materials and various substrate materials are essential for integrated device applications of 2D materials, for which the mechanics of interfaces (adhesion and friction) has to be developed for the 2D materials. Here we review recent theoretical and experimental works related to mechanics and mechanical properties of 2D materials. While graphene is the most studied 2D material to date, we expect continual growth of interest in the mechanics of other 2D materials beyond graphene