Cross layer reliability estimation for digital systems

Forthcoming manufacturing technologies hold the promise to increase multifuctional computing systems performance and functionality thanks to a remarkable growth of the device integration density. Despite the benefits introduced by this technology improvements, reliability is becoming a key challenge for the semiconductor industry. With transistor size reaching the atomic dimensions, vulnerability to unavoidable fluctuations in the manufacturing process and environmental stress rise dramatically. Failing to meet a reliability requirement may add excessive re-design cost to recover and may have severe consequences on the success of a product. %Worst-case design with large margins to guarantee reliable operation has been employed for long time. However, it is reaching a limit that makes it economically unsustainable due to its performance, area, and power cost. One of the open challenges for future technologies is building ``dependable'' systems on top of unreliable components, which will degrade and even fail during normal lifetime of the chip. Conventional design techniques are highly inefficient. They expend significant amount of energy to tolerate the device unpredictability by adding safety margins to a circuit's operating voltage, clock frequency or charge stored per bit. Unfortunately, the additional cost introduced to compensate unreliability are rapidly becoming unacceptable in today's environment where power consumption is often the limiting factor for integrated circuit performance, and energy efficiency is a top concern. Attention should be payed to tailor techniques to improve the reliability of a system on the basis of its requirements, ending up with cost-effective solutions favoring the success of the product on the market. Cross-layer reliability is one of the most promising approaches to achieve this goal. Cross-layer reliability techniques take into account the interactions between the layers composing a complex system (i.e., technology, hardware and software layers) to implement efficient cross-layer fault mitigation mechanisms. Fault tolerance mechanism are carefully implemented at different layers starting from the technology up to the software layer to carefully optimize the system by exploiting the inner capability of each layer to mask lower level faults. For this purpose, cross-layer reliability design techniques need to be complemented with cross-layer reliability evaluation tools, able to precisely assess the reliability level of a selected design early in the design cycle. Accurate and early reliability estimates would enable the exploration of the system design space and the optimization of multiple constraints such as performance, power consumption, cost and reliability. This Ph.D. thesis is devoted to the development of new methodologies and tools to evaluate and optimize the reliability of complex digital systems during the early design stages. More specifically, techniques addressing hardware accelerators (i.e., FPGAs and GPUs), microprocessors and full systems are discussed. All developed methodologies are presented in conjunction with their application to real-world use cases belonging to different computational domains

An Experimental Study of Reduced-Voltage Operation in Modern FPGAs for Neural Network Acceleration

We empirically evaluate an undervolting technique, i.e., underscaling the circuit supply voltage below the nominal level, to improve the power-efficiency of Convolutional Neural Network (CNN) accelerators mapped to Field Programmable Gate Arrays (FPGAs). Undervolting below a safe voltage level can lead to timing faults due to excessive circuit latency increase. We evaluate the reliability-power trade-off for such accelerators. Specifically, we experimentally study the reduced-voltage operation of multiple components of real FPGAs, characterize the corresponding reliability behavior of CNN accelerators, propose techniques to minimize the drawbacks of reduced-voltage operation, and combine undervolting with architectural CNN optimization techniques, i.e., quantization and pruning. We investigate the effect of environmental temperature on the reliability-power trade-off of such accelerators. We perform experiments on three identical samples of modern Xilinx ZCU102 FPGA platforms with five state-of-the-art image classification CNN benchmarks. This approach allows us to study the effects of our undervolting technique for both software and hardware variability. We achieve more than 3X power-efficiency (GOPs/W) gain via undervolting. 2.6X of this gain is the result of eliminating the voltage guardband region, i.e., the safe voltage region below the nominal level that is set by FPGA vendor to ensure correct functionality in worst-case environmental and circuit conditions. 43% of the power-efficiency gain is due to further undervolting below the guardband, which comes at the cost of accuracy loss in the CNN accelerator. We evaluate an effective frequency underscaling technique that prevents this accuracy loss, and find that it reduces the power-efficiency gain from 43% to 25%.Comment: To appear at the DSN 2020 conferenc

Soft-error resilient on-chip memory structures

Soft errors induced by energetic particle strikes in on-chip memory structures, such as L1 data/instruction caches and register files, have become an increasing challenge in designing new generation reliable microprocessors. Due to their transient/random nature, soft errors cannot be captured by traditional verification and testing process due to the irrelevancy to the correctness of the logic. This dissertation is thus focusing on the reliability characterization and cost-effective reliable design of on-chip memories against soft errors. Due to various performance, area/size, and energy constraints in various target systems, many existing unoptimized protection schemes on cache memories may eventually prove significantly inadequate and ineffective. This work develops new lifetime models for data and tag arrays residing in both the data and instruction caches. These models facilitate the characterization of cache vulnerability of the stored items at various lifetime phases. The design methodology is further exemplified by the proposed reliability schemes targeting at specific vulnerable phases. Benchmarking is carried out to showcase the effectiveness of these approaches. The tag array demands high reliability against soft errors while the data array is fully protected in on-chip caches, because of its crucial importance to the correctness of cache accesses. Exploiting the address locality of memory accesses, this work proposes a Tag Replication Buffer (TRB) to protect information integrity of the tag array in the data cache with low performance, energy and area overheads. To provide a comprehensive evaluation of the tag array reliability, this work also proposes a refined evaluation metric, detected-without-replica-TVF (DOR-TVF), which combines the TVF and access-with-replica (AWR) analysis. Based on the DOR-TVF analysis, a TRB scheme with early write-back (TRB-EWB) is proposed, which achieves a zero DOR-TVF at a negligible performance overhead. Recent research, as well as the proposed optimization schemes in this cache vulnerability study, have focused on the design of cost-effective reliable data caches in terms of performance, energy, and area overheads based on the assumption of fixed error rates. However, for systems in operating environments that vary with time or location, those schemes will be either insufficient or over-designed for the changing error rates. This work explores the design of a self-adaptive reliable data cache that dynamically adapts its employed reliability schemes to the changing operating environments in order to maintain a target reliability. The experimental evaluation shows that the self-adaptive data cache achieves similar reliability to a cache protected by the most reliable scheme, while simultaneously minimizing the performance and power overheads. Besides the data/instruction caches, protecting the register file and its data buses is crucial to reliable computing in high-performance microprocessors. Since the register file is in the critical path of the processor pipeline, any reliable design that increases either the pressure on the register file or the register file access latency is not desirable. This work proposes to exploit narrow-width register values, which represent the majority of generated values, for making the duplicates within the same register data item. A detailed architectural vulnerability factor (AVF) analysis shows that this in-register duplication (IRD) scheme significantly reduces the AVF in the register file compared to the conventional design. The experimental evaluation also shows that IRD provides superior read-with-duplicate (RWD) and error detection/recovery rates under heavy error injection as compared to previous reliability schemes, while only incurring a small power overhead. By integrating the proposed reliable designs in data/instruction caches and register files, the vulnerability of the entire microprocessor is dramatically reduced. The new lifetime model, the self-adaptive design and the narrow-width value duplication scheme proposed in this work can also provide guidance to architects toward highly efficient reliable system design

On the Resilience of RTL NN Accelerators: Fault Characterization and Mitigation

Machine Learning (ML) is making a strong resurgence in tune with the massive generation of unstructured data which in turn requires massive computational resources. Due to the inherently compute and power-intensive structure of Neural Networks (NNs), hardware accelerators emerge as a promising solution. However, with technology node scaling below 10nm, hardware accelerators become more susceptible to faults, which in turn can impact the NN accuracy. In this paper, we study the resilience aspects of Register-Transfer Level (RTL) model of NN accelerators, in particular, fault characterization and mitigation. By following a High-Level Synthesis (HLS) approach, first, we characterize the vulnerability of various components of RTL NN. We observed that the severity of faults depends on both i) application-level specifications, i.e., NN data (inputs, weights, or intermediate) and NN layers and ii) architectural-level specifications, i.e., data representation model and the parallelism degree of the underlying accelerator. Second, motivated by characterization results, we present a low-overhead fault mitigation technique that can efficiently correct bit flips, by 47.3% better than state-of-the-art methods.We thank Pradip Bose, Alper Buyuktosunoglu, and Augusto Vega from IBM Watson for their contribution to this work. The research leading to these results has received funding from the European Union’s Horizon 2020 Programme under the LEGaTO Project (www.legato-project.eu), grant agreement nº 780681.Peer ReviewedPostprint (author's final draft

Comprehensive Evaluation of Supply Voltage Underscaling in FPGA on-Chip Memories

In this work, we evaluate aggressive undervolting, i.e., voltage scaling below the nominal level to reduce the energy consumption of Field Programmable Gate Arrays (FPGAs). Usually, voltage guardbands are added by chip vendors to ensure the worst-case process and environmental scenarios. Through experimenting on several FPGA architectures, we measure this voltage guardband to be on average 39% of the nominal level, which in turn, delivers more than an order of magnitude power savings. However, further undervolting below the voltage guardband may cause reliability issues as the result of the circuit delay increase, i.e., start to appear faults. We extensively characterize the behavior of these faults in terms of the rate, location, type, as well as sensitivity to environmental temperature, with a concentration of on-chip memories, or Block RAMs (BRAMs). Finally, we evaluate a typical FPGA-based Neural Network (NN) accelerator under low-voltage BRAM operations. In consequence, the substantial NN energy savings come with the cost of NN accuracy loss. To attain power savings without NN accuracy loss, we propose a novel technique that relies on the deterministic behavior of undervolting faults and can limit the accuracy loss to 0.1% without any timing-slack overhead.Peer ReviewedPostprint (author's final draft

Fault Injection in Native Logic-in-Memory Computation on Neuromorphic Hardware

Logic-in-memory (LIM) describes the execution of logic gates within memristive crossbar structures, promising to improve performance and energy efficiency. Utilizing only binary values, LIM particularly excels in accelerating binary neural networks, shifting it in the focus of edge applications. Considering its potential, the impact of faults on BNNs accelerated with LIM still lacks investigation. In this paper, we propose faulty logic-in-memory (FLIM), a fault injection platform capable of executing full-fledged BNNs on LIM while injecting in-field faults. The results show that FLIM runs a single MNIST picture 66754x faster than the state of the art by offering a fine-grained fault injection methodology

Restoring Reliability in Fault Tolerant Reconfigurable Systems

The new generations of SRAM-based FPGAdevices, built on nanometer technology, are thepreferred choice for the implementation ofreconfigurable computing platforms. However,smaller technological scales increase theirvulnerability to manufacturing imperfections andhence to the occurrence of electromigration.Moreover, the large internal RAM (for configurationpurposes or as embedded memory blocks) makesthem more prone to soft errors.The incorporation of self-reconfigurationcapabilities in recent FPGAs, allied to the use of softand hard microprocessor cores, facilitates the offsetof these vulnerabilities by enabling the developmentof self-restoring fault tolerant reconfigurablesystems. In the methodology presented in this paper,the embedded microprocessor is also responsible forthe implementation of online self-test-and-repairstrategies, based on modular redundancy and onself-reconfiguration. The detection of faults, causedby soft or hard errors, may be followed by repairingactions, depending on the fault type. This approachleads to smoother system degradation, extending itslifetime and improving its reliability

Methodologies for Accelerated Analysis of the Reliability and the Energy Efficiency Levels of Modern Microprocessor Architectures

Η εξέλιξη της τεχνολογίας ημιαγωγών, της αρχιτεκτονικής υπολογιστών και της σχεδίασης οδηγεί σε αύξηση της απόδοσης των σύγχρονων μικροεπεξεργαστών, η οποία επίσης συνοδεύεται από αύξηση της ευπάθειας των προϊόντων. Οι σχεδιαστές εφαρμόζουν διάφορες τεχνικές κατά τη διάρκεια της ζωής των ολοκληρωμένων κυκλωμάτων με σκοπό να διασφαλίσουν τα υψηλά επίπεδα αξιοπιστίας των παραγόμενων προϊόντων και να τα προστατέψουν από διάφορες κατηγορίες σφαλμάτων διασφαλίζοντας την ορθή λειτουργία τους. Αυτή η διδακτορική διατριβή προτείνει καινούριες μεθόδους για να διασφαλίσει τα υψηλά επίπεδα αξιοπιστίας και ενεργειακής απόδοσης των σύγχρονων μικροεπεξεργαστών οι οποίες μπορούν να εφαρμοστούν κατά τη διάρκεια του πρώιμου σχεδιαστικού σταδίου, του σταδίου παραγωγής ή του σταδίου της κυκλοφορίας των ολοκληρωμένων κυκλωμάτων στην αγορά. Οι συνεισφορές αυτής της διατριβής μπορούν να ομαδοποιηθούν στις ακόλουθες δύο κατηγορίες σύμφωνα με το στάδιο της ζωής των μικροεπεξεργαστών στο οποίο εφαρμόζονται: • Πρώιμο σχεδιαστικό στάδιο: Η στατιστική εισαγωγή σφαλμάτων σε δομές που είναι μοντελοποιημένες σε προσομοιωτές οι οποίοι στοχεύουν στην μελέτη της απόδοσης είναι μια επιστημονικά καθιερωμένη μέθοδος για την ακριβή μέτρηση της αξιοπιστίας, αλλά υστερεί στον αργό χρόνο εκτέλεσης. Σε αυτή τη διατριβή, αρχικά παρουσιάζουμε ένα νέο πλήρως αυτοματοποιημένο εργαλείο εισαγωγής σφαλμάτων σε μικροαρχιτεκτονικό επίπεδο που στοχεύει στην ακριβή αξιολόγηση της αξιοπιστίας ενός μεγάλου πλήθους μονάδων υλικού σε σχέση με διάφορα μοντέλα σφαλμάτων (παροδικά, διακοπτόμενα, μόνιμα σφάλματα). Στη συνέχεια, χρησιμοποιώντας το ίδιο εργαλείο και στοχεύοντας τα παροδικά σφάλματα, παρουσιάζουμε διάφορες μελέτες σχετιζόμενες με την αξιοπιστία και την απόδοση, οι οποίες μπορούν να βοηθήσουν τις σχεδιαστικές αποφάσεις στα πρώιμα στάδια της ζωής των επεξεργαστών. Τελικά, προτείνουμε δύο μεθοδολογίες για να επιταχύνουμε τα μαζικά πειράματα στατιστικής εισαγωγής σφαλμάτων. Στην πρώτη, επιταχύνουμε τα πειράματα έπειτα από την πραγματική εισαγωγή των σφαλμάτων στις δομές του υλικού. Στη δεύτερη, επιταχύνουμε ακόμη περισσότερο τα πειράματα προτείνοντας τη μεθοδολογία με όνομα MeRLiN, η οποία βασίζεται στη μείωση της αρχικής λίστας σφαλμάτων μέσω της ομαδοποίησής τους σε ισοδύναμες ομάδες έπειτα από κατηγοριοποίηση σύμφωνα με την εντολή που τελικά προσπελαύνει τη δομή που φέρει το σφάλμα. • Παραγωγικό στάδιο και στάδιο κυκλοφορίας στην αγορά: Οι συνεισφορές αυτής της διδακτορικής διατριβής σε αυτά τα στάδια της ζωής των μικροεπεξεργαστών καλύπτουν δύο σημαντικά επιστημονικά πεδία. Αρχικά, χρησιμοποιώντας το ολοκληρωμένο κύκλωμα των 48 πυρήνων με ονομασία Intel SCC, προτείνουμε μια τεχνική επιτάχυνσης του εντοπισμού μονίμων σφαλμάτων που εφαρμόζεται κατά τη διάρκεια λειτουργίας αρχιτεκτονικών με πολλούς πυρήνες, η οποία εκμεταλλεύεται το δίκτυο υψηλής ταχύτητας μεταφοράς μηνυμάτων που διατίθεται στα ολοκληρωμένα κυκλώματα αυτού του είδους. Δεύτερον, προτείνουμε μια λεπτομερή στατιστική μεθοδολογία με σκοπό την ακριβή πρόβλεψη σε επίπεδο συστήματος των ασφαλών ορίων λειτουργίας της τάσης των πυρήνων τύπου ARMv8 που βρίσκονται πάνω στη CPU X-Gene 2.The evolution in semiconductor manufacturing technology, computer architecture and design leads to increase in performance of modern microprocessors, which is also accompanied by increase in products’ vulnerability to errors. Designers apply different techniques throughout microprocessors life-time in order to ensure the high reliability requirements of the delivered products that are defined as their ability to avoid service failures that are more frequent and more severe than is acceptable. This thesis proposes novel methods to guarantee the high reliability and energy efficiency requirements of modern microprocessors that can be applied during the early design phase, the manufacturing phase or after the chips release to the market. The contributions of this thesis can be grouped in the two following categories according to the phase of the CPUs lifecycle that are applied at: • Early design phase: Statistical fault injection using microarchitectural structures modeled in performance simulators is a state-of-the-art method to accurately measure the reliability, but suffers from low simulation throughput. In this thesis, we firstly present a novel fully-automated versatile microarchitecture-level fault injection framework (called MaFIN) for accurate characterization of a wide range of hardware components of an x86-64 microarchitecture with respect to various fault models (transient, intermittent, permanent faults). Next, using the same tool and focusing on transient faults, we present several reliability and performance related studies that can assist design decision in the early design phases. Moreover, we propose two methodologies to accelerate the statistical fault injection campaigns. In the first one, we accelerate the fault injection campaigns after the actual injection of the faults in the simulated hardware structures. In the second, we further accelerate the microarchitecture level fault injection campaigns by proposing MeRLiN a fault pre-processing methodology that is based on the pruning of the initial fault list by grouping the faults in equivalent classes according to the instruction access patterns to hardware entries. • Manufacturing phase and release to the market: The contributions of this thesis in these phases of microprocessors life-cycle cover two important aspects. Firstly, using the 48-core Intel’s SCC architecture, we propose a technique to accelerate online error detection of permanent faults for many-core architectures by exploiting their high-speed message passing on-chip network. Secondly, we propose a comprehensive statistical analysis methodology to accurately predict at the system level the safe voltage operation margins of the ARMv8 cores of the X- Gene 2 chip when it operates in scaled voltage conditions