NASA Tech Briefs, July/August 1988

Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences

At the Locus of Performance: A Case Study in Enhancing CPUs with Copious 3D-Stacked Cache

Over the last three decades, innovations in the memory subsystem were primarily targeted at overcoming the data movement bottleneck. In this paper, we focus on a specific market trend in memory technology: 3D-stacked memory and caches. We investigate the impact of extending the on-chip memory capabilities in future HPC-focused processors, particularly by 3D-stacked SRAM. First, we propose a method oblivious to the memory subsystem to gauge the upper-bound in performance improvements when data movement costs are eliminated. Then, using the gem5 simulator, we model two variants of LARC, a processor fabricated in 1.5 nm and enriched with high-capacity 3D-stacked cache. With a volume of experiments involving a board set of proxy-applications and benchmarks, we aim to reveal where HPC CPU performance could be circa 2028, and conclude an average boost of 9.77x for cache-sensitive HPC applications, on a per-chip basis. Additionally, we exhaustively document our methodological exploration to motivate HPC centers to drive their own technological agenda through enhanced co-design

Methods for Robust and Energy-Efficient Microprocessor Architectures

Σήμερα, η εξέλιξη της τεχνολογίας επιτρέπει τη βελτίωση τριών βασικών στοιχείων της σχεδίασης των επεξεργαστών: αυξημένες επιδόσεις, χαμηλότερη κατανάλωση ισχύος και χαμηλότερο κόστος παραγωγής του τσιπ, ενώ οι σχεδιαστές επεξεργαστών έχουν επικεντρωθεί στην παραγωγή επεξεργαστών με περισσότερες λειτουργίες σε χαμηλότερο κόστος. Οι σημερινοί επεξεργαστές είναι πολύ ταχύτεροι και διαθέτουν εξελιγμένες λειτουργικές μονάδες συγκριτικά με τους προκατόχους τους, ωστόσο, καταναλώνουν αρκετά μεγάλη ενέργεια. Τα ποσά ηλεκτρικής ισχύος που καταναλώνονται, και η επακόλουθη έκλυση θερμότητας, αυξάνονται παρά τη μείωση του μεγέθους των τρανζίστορ. Αναπτύσσοντας όλο και πιο εξελιγμένους μηχανισμούς και λειτουργικές μονάδες για την αύξηση της απόδοσης και βελτίωση της ενέργειας, σε συνδυασμό με τη μείωση του μεγέθους των τρανζίστορ, οι επεξεργαστές έχουν γίνει εξαιρετικά πολύπλοκα συστήματα, καθιστώντας τη διαδικασία της επικύρωσής τους σημαντική πρόκληση για τη βιομηχανία ολοκληρωμένων κυκλωμάτων. Συνεπώς, οι κατασκευαστές επεξεργαστών αφιερώνουν επιπλέον χρόνο, προϋπολογισμό και χώρο στο τσιπ για να διασφαλίσουν ότι οι επεξεργαστές θα λειτουργούν σωστά κατά τη διάθεσή τους στη αγορά. Για τους λόγους αυτούς, η εργασία αυτή παρουσιάζει νέες μεθόδους για την επιτάχυνση και τη βελτίωση της φάσης της επικύρωσης, καθώς και για τη βελτίωση της ενεργειακής απόδοσης των σύγχρονων επεξεργαστών. Στο πρώτο μέρος της διατριβής προτείνονται δύο διαφορετικές μέθοδοι για την επικύρωση του επεξεργαστή, οι οποίες συμβάλλουν στην επιτάχυνση αυτής της διαδικασίας και στην αποκάλυψη σπάνιων σφαλμάτων στους μηχανισμούς μετάφρασης διευθύνσεων των σύγχρονων επεξεργαστών. Και οι δύο μέθοδοι καθιστούν ευκολότερη την ανίχνευση και τη διάγνωση σφαλμάτων, και επιταχύνουν την ανίχνευση του σφάλματος κατά τη φάση της επικύρωσης. Στο δεύτερο μέρος της διατριβής παρουσιάζεται μια λεπτομερής μελέτη χαρακτηρισμού των περιθωρίων τάσης σε επίπεδο συστήματος σε δύο σύγχρονους ARMv8 επεξεργαστές. Η μελέτη του χαρακτηρισμού προσδιορίζει τα αυξημένα περιθώρια τάσης που έχουν προκαθοριστεί κατά τη διάρκεια κατασκευής του κάθε μεμονωμένου πυρήνα του επεξεργαστή και αναλύει τυχόν απρόβλεπτες συμπεριφορές που μπορεί να προκύψουν σε συνθήκες μειωμένης τάσης. Για την μελέτη και καταγραφή της συμπεριφοράς του συστήματος υπό συνθήκες μειωμένης τάσης, παρουσιάζεται επίσης σε αυτή τη διατριβή μια απλή και ενοποιημένη συνάρτηση: η συνάρτηση πυκνότητας-σοβαρότητας. Στη συνέχεια, παρουσιάζεται αναλυτικά η ανάπτυξη ειδικά σχεδιασμένων προγραμμάτων (micro-viruses) τα οποία υποβάλουν της θεμελιώδεις δομές του επεξεργαστή σε μεγάλο φορτίο εργασίας. Αυτά τα προγράμματα στοχεύουν στην γρήγορη αναγνώριση των ασφαλών περιθωρίων τάσης. Τέλος, πραγματοποιείται ο χαρακτηρισμός των περιθωρίων τάσης σε εκτελέσεις πολλαπλών πυρήνων, καθώς επίσης και σε διαφορετικές συχνότητες, και προτείνεται ένα πρόγραμμα το οποίο εκμεταλλεύεται όλες τις διαφορετικές πτυχές του προβλήματος της κατανάλωσης ενέργειας και παρέχει μεγάλη εξοικονόμηση ενέργειας διατηρώντας παράλληλα υψηλά επίπεδα απόδοσης. Αυτή η μελέτη έχει ως στόχο τον εντοπισμό και την ανάλυση της σχέσης μεταξύ ενέργειας και απόδοσης σε διαφορετικούς συνδυασμούς τάσης και συχνότητας, καθώς και σε διαφορετικό αριθμό νημάτων/διεργασιών που εκτελούνται στο σύστημα, αλλά και κατανομής των προγραμμάτων στους διαθέσιμους πυρήνες.Technology scaling has enabled improvements in the three major design optimization objectives: increased performance, lower power consumption, and lower die cost, while system design has focused on bringing more functionality into products at lower cost. While today's microprocessors, are much faster and much more versatile than their predecessors, they also consume much power. As operating frequency and integration density increase, the total chip power dissipation increases. This is evident from the fact that due to the demand for increased functionality on a single chip, more and more transistors are being packed on a single die and hence, the switching frequency increases in every technology generation. However, by developing aggressive and sophisticated mechanisms to boost performance and to enhance the energy efficiency in conjunction with the decrease of the size of transistors, microprocessors have become extremely complex systems, making the microprocessor verification and manufacturing testing a major challenge for the semiconductor industry. Manufacturers, therefore, choose to spend extra effort, time, budget and chip area to ensure that the delivered products are operating correctly. To meet high-dependability requirements, manufacturers apply a sequence of verification tasks throughout the entire life-cycle of the microprocessor to ensure the correct functionality of the microprocessor chips from the various types of errors that may occur after the products are released to the market. To this end, this work presents novel methods for ensuring the correctness of the microprocessor during the post-silicon validation phase and for improving the energy efficiency requirements of modern microprocessors. These methods can be applied during the prototyping phase of the microprocessors or after their release to the market. More specifically, in the first part of the thesis, we present and describe two different ISA-independent software-based post-silicon validation methods, which contribute to formalization and modeling as well as the acceleration of the post-silicon validation process and expose difficult-to-find bugs in the address translation mechanisms (ATM) of modern microprocessors. Both methods improve the detection and diagnosis of a hardware design bug in the ATM structures and significantly accelerate the bug detection during the post-silicon validation phase. In the second part of the thesis we present a detailed system-level voltage scaling characterization study for two state-of-the-art ARMv8-based multicore CPUs. We present an extensive characterization study which identifies the pessimistic voltage guardbands (the increased voltage margins set by the manufacturer) of each individual microprocessor core and analyze any abnormal behavior that may occur in off-nominal voltage conditions. Towards the formalization of the any abnormal behavior we also present a simple consolidated function; the Severity function, which aggregates the effects of reduced voltage operation. We then introduce the development of dedicated programs (diagnostic micro-viruses) that aim to accelerate the time-consuming voltage margins characterization studies by stressing the fundamental hardware components. Finally, we present a comprehensive exploration of how two server-grade systems behave in different frequency and core allocation configurations beyond nominal voltage operation in multicore executions. This analysis aims (1) to identify the best performance per watt operation points, (2) to reveal how and why the different core allocation options affect the energy consumption, and (3) to enhance the default Linux scheduler to take task allocation decisions for balanced performance and energy efficiency

NASA Tech Briefs, October 1988

Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences

Integration of the White Sands Complex into a Wide Area Network

The NASA White Sands Complex (WSC) satellite communications facility consists of two main ground stations, an auxiliary ground station, a technical support facility, and a power plant building located on White Sands Missile Range. When constructed, terrestrial communication access to these facilities was limited to copper telephone circuits. There was no local or wide area communications network capability. This project incorporated a baseband local area network (LAN) topology at WSC and connected it to NASA's wide area network using the Program Support Communications Network-Internet (PSCN-I). A campus-style LAN is configured in conformance with the International Standards Organization (ISO) Open Systems Interconnect (ISO) model. Ethernet provides the physical and data link layers. Transmission Control Protocol and Internet Protocol (TCP/IP) are used for the network and transport layers. The session, presentation, and application layers employ commercial software packages. Copper-based Ethernet collision domains are constructed in each of the primary facilities and these are interconnected by routers over optical fiber links. The network and each of its collision domains are shown to meet IEEE technical configuration guidelines. The optical fiber links are analyzed for the optical power budget and bandwidth allocation and are found to provide sufficient margin for this application. Personal computers and work stations attached to the LAN communicate with and apply a wide variety of local and remote administrative software tools. The Internet connection provides wide area network (WAN) electronic access to other NASA centers and the world wide web (WWW). The WSC network reduces and simplifies the administrative workload while providing enhanced and advanced inter-communications capabilities among White Sands Complex departments and with other NASA centers

Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics

The fundamental motivation for this dissertation is to address the widening interconnect gap between integrated circuit (IC) demands and package substrates specifically for high frequency digital-RF systems applications. Moore's law for CMOS ICs predicts that transistor density on ICs will double approximately every 18 months. The current state-of-the-art in IC package substrates is at 20µm lines/spaces and 50-60µm microvia diameter using epoxy dielectrics with loss tangent above 0.01. The research targets are to overcome the barriers of current technologies and demonstrate a set of advanced materials and process technologies capable of 5-10µm lines and spaces, and 10-30µm diameter microvias in a multilayer 3-D wiring substrate using 10-25µm thin film dielectrics with loss tangent in the <0.005. The research elements are organized as follows with a clear focus on understanding and characterization of fundamental materials structure-processing-property relationships and interfaces to achieve the next generation targets. (a) Low CTE Core Substrate, (b) Low Loss Dielectrics with 25µm and smaller microvias, (c) Sub-10µm Width Cu Conductors, and (d) Integration of the various dielectric and conductor processes.Ph.D.Committee Chair: Tummala, Rao; Committee Member: Iyer, Mahadevan; Committee Member: Saxena, Ashok; Committee Member: Swaminathan, Madhavan; Committee Member: Wong, Chingpin

NASA Tech Briefs, January 1995

Topics include: Sensors; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Report

NASA Tech Briefs, October 1990

Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical' Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences

Wireless Interconnects for Intra-chip & Inter-chip Transmission

With the emergence of Internet of Things and information revolution, the demand of high performance computing systems is increasing. The copper interconnects inside the computing chips have evolved into a sophisticated network of interconnects known as Network on Chip (NoC) comprising of routers, switches, repeaters, just like computer networks. When network on chip is implemented on a large scale like in Multicore Multichip (MCMC) systems for High Performance Computing (HPC) systems, length of interconnects increases and so are the problems like power dissipation, interconnect delays, clock synchronization and electrical noise. In this thesis, wireless interconnects are chosen as the substitute for wired copper interconnects. Wireless interconnects offer easy integration with CMOS fabrication and chip packaging. Using wireless interconnects working at unlicensed mm-wave band (57-64GHz), high data rate of Gbps can be achieved. This thesis presents study of transmission between zigzag antennas as wireless interconnects for Multichip multicores (MCMC) systems and 3D IC. For MCMC systems, a four-chips 16-cores model is analyzed with only four wireless interconnects in three configurations with different antenna orientations and locations. Return loss and transmission coefficients are simulated in ANSYS HFSS. Moreover, wireless interconnects are designed, fabricated and tested on a 6’’ silicon wafer with resistivity of 55Ω-cm using a basic standard CMOS process. Wireless interconnect are designed to work at 30GHz using ANSYS HFSS. The fabricated antennas are resonating around 20GHz with a return loss of less than -10dB. The transmission coefficients between antenna pair within a 20mm x 20mm silicon die is found to be varying between -45dB to -55dB. Furthermore, wireless interconnect approach is extended for 3D IC. Wireless interconnects are implemented as zigzag antenna. This thesis extends the work of analyzing the wireless interconnects in 3D IC with different configurations of antenna orientations and coolants. The return loss and transmission coefficients are simulated using ANSYS HFSS