Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Statistical Power Supply Dynamic Noise Prediction in Hierarchical Power Grid and Package Networks

One of the most crucial high performance systems-on-chip design challenge is to front their power supply noise sufferance due to high frequencies, huge number of functional blocks and technology scaling down. Marking a difference from traditional post physical-design static voltage drop analysis, /a priori dynamic voltage drop/evaluation is the focus of this work. It takes into account transient currents and on-chip and package /RLC/ parasitics while exploring the power grid design solution space: Design countermeasures can be thus early defined and long post physical-design verification cycles can be shortened. As shown by an extensive set of results, a carefully extracted and modular grid library assures realistic evaluation of parasitics impact on noise and facilitates the power network construction; furthermore statistical analysis guarantees a correct current envelope evaluation and Spice simulations endorse reliable result

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Rapid Prototyping of Large-scale Analog Circuits With Field Programmable Analog Array

Abstract — Modern advances in reconfigurable analog technologies are allowing field-programmable analog arrays (FPAAs) to dramatically grow in size, flexibility, and usefulness. This paper presents rapid prototyping results of a bandpass filter as a sample analog circuit using our floating-gate based large-scale FPAA. A major source of parasitics introduced during the circuit mapping process is interconnect switches used for routing. Our goal is to obtain models of the mapped circuits that can be simulated using SPICE in order to observe the impact of interconnect parasitics on the relevant analog metrics. Our results indicate that the mapped analog circuits obtain desired responses even with interconnect parasitics, clearly demonstrating the practicality of our FPAA. I

Characterization of voltage noise in big, small and single-ISA heterogeneous systems

Sensitivity of the microprocessor to voltage fluctuations is becoming a major concern with growing emphasis on designing power-efficient microprocessors. Voltage fluctuations that exceed a certain threshold cause "emergencies" that can lead to timing errors in the processor, thus risking reliability. To guarantee correctness under such conditions, large voltage guardbands are employed, at the cost of reduced performance and wastage of power. Trends in microprocessor technology indicate that worst-case operating voltage margins are not sustainable. Since voltage emergencies occur only infrequently, resilient architectures with aggressive guardbands are needed. However, to enable the exploration of the design space of resilient processors, it is important to have a deep understanding of the characteristics of voltage noise in different system configurations. Prior research in this area has mostly focused on systems with very few cores. Given the increasing relevance of large multi-core systems, this thesis presents a detailed characterization of voltage noise on chip multi-processors, consisting of large number of cores. The data indicates that while the worst case voltage droop increases with increase in the number of cores, the frequency of occurrence of the droops is not greatly impacted, emphasizing the feasibility of employing resilient microarchitectures with aggressive voltage margins. The thesis also presents a comparative study of voltage noise in CMPs consisting of either high-performant out-of-order cores and power-efficient in-order cores. The study highlights that the out-of-order cores experience much larger voltage variations when compared to the in-order cores, but offer a clear advantage in terms of performance. Experiments indicate that in-order configurations that offer equivalent performance to the out-of-order cores result in large energy-delay product, indicating the trade-offs involved in designing for performance, power and reliability. The thesis also presents a study of voltage noise in single-ISA heterogeneous configurations, to highlight the benefits of such systems towards lowering the worst-case voltage margins, which improve both performance and power. The experimental results indicate that the worst-case voltage droop in such heterogeneous systems lies in between the out-of-order and in-order cores and provide reasonable power-efficiency and performance. Further, the work highlights the importance of exploring the design-space of heterogeneous systems considering reliability as an important design criteria.Computer Science

Overcoming the challenges in very deep submicron for area reduction, power reduction and faster design closure

The project is aimed at understanding the existing very deep sub-micron (VDSM) implementation of a digital design, analyzing it from the point of view of power, area and timing and to come up with solutions and strategies to optimize the implementation in terms of power, area and timing. The effort involved, to understand the constraints, reasons and the requirements resulting in the existing implementation of the design. Further, various experiments were carried out to improve the design in various aspects like power, area and timing. The tradeoffs required and the benefits of each of the experiments were contrasted and analyzed. The optimum solutions and strategies which balance the requirements were tried out and published at the end of the report