High-speed Time-interleaved Digital-to-Analog Converter (TI-DAC) for Self-Interference Cancellation Applications

Nowadays, the need for higher data-rate is constantly growing to enhance the quality of the daily communication services. The full-duplex (FD) communication is exemplary method doubling the data-rate compared to half-duplex one. However, part of the strong output signal of the transmitter interferes to the receiver-side because they share the same antenna with limited attenuation and, as a result, the receiver’s performance is corrupted. Hence, it is critical to remove the leakage signal from the receiver’s path by designing another block called self-interference cancellation (SIC). The main goal of this dissertation is to develop the SIC block embedded in the current-mode FD receivers. To this end, the regenerated cancellation current signal is fed to the inputs of the base-band filter and after the mixer of a (direct-conversion) current-mode FD receiver. Since the pattern of the transmitter (the digital signal generated by DSP) is known, a high-speed digital-to-Analog converter (DAC) with medium-resolution can perfectly suppress main part of the leakage on the receiver path. A capacitive DAC (CDAC) is chosen among the available solutions because it is compatible with advanced CMOS technology for high-speed application and the medium-resolution designs. Although the main application of the design is to perform the cancellation, it can also be employed as a stand-alone DAC in the Analog (I/Q) transmitter. The SIC circuitry includes a trans-impedance amplifier (TIA), two DACs, high-speed digital circuits, and built-in-self-test section (BIST). According to the available specification for full-duplex communication system, the resolution and working frequency of the CDAC are calculated (designed) equal to 10-bit (3 binary+ 2 binary + 5 thermometric) and 1GHz, respectively. In order to relax the design of the TIA (settling time of the DAC), the CDAC implements using 2-way time-interleaved (TI) manner (the effective SIC frequency equals 2GHz) without using any calibration technique. The CDAC is also developed with the split-capacitor technique to lower the negative effects of the conventional binary-weighted DAC. By adding one extra capacitor on the left-side of the split-capacitor, LSB-side, the value of the split-capacitor can be chosen as an integer value of the unit capacitor. As a result, it largely enhances the linearity of the CADC and cancellation performance. If the block works as a stand-alone DAC with non-TI mode, the digital input code representing a Sinus waveform with an amplitude 1dB less than full-scale and output frequency around 10.74MHz, chosen by coherent sampling rule, then the ENOB, SINAD, SFDR, and output signal are 9.4-bit, 58.2 dB, 68.4dBc, and -9dBV. The simulated value of the |DNL| (static linearity) is also less than 0.7. The similar simulation was done in the SIC mode while the capacitive-array woks in the TI mode and cancellation current is set to the full-scale. Hence, the amount of cancelling the SI signal at the output of the TIA, SNDR, SFDR, SNDRequ. equals 51.3dB, 15.1 dB, 24dBc, 66.4 dB. The designed SIC cannot work as a closed-loop design. The layout was optimally drawn in order to minimize non-linearity, the power-consumption of the decoders, and reduce the complexity of the DAC. By distributing the thermometric cells across the array and using symmetrical switching scheme, the DAC is less subjected to the linear and gradient effect of the oxide. Based on the post-layout simulation results, the deviation of the design after drawing the layout is studied. To compare the results of the schematic and post-layout designs, the exact conditions of simulation above (schematic simulations) are used. When the block works as a stand-alone CDAC, the ENOB, SINAD, SFDR are 8.5-bit, 52.6 dB, 61.3 dBc. The simulated value of the |DNL| (static linearity) is also limited to 1.3. Likewise, the SI signal at the output of the TIA, SNDR, SFDR, SNDRequ. are equal to 44dB, 11.7 dB, 19 dBc, 55.7 dB

Wideband CMOS Data Converters for Linear and Efficient mmWave Transmitters

With continuously increasing demands for wireless connectivity, higher\ua0carrier frequencies and wider bandwidths are explored. To overcome a limited transmit power at these higher carrier frequencies, multiple\ua0input multiple output (MIMO) systems, with a large number of transmitters\ua0and antennas, are used to direct the transmitted power towards\ua0the user. With a large transmitter count, each individual transmitter\ua0needs to be small and allow for tight integration with digital circuits. In\ua0addition, modern communication standards require linear transmitters,\ua0making linearity an important factor in the transmitter design.In this thesis, radio frequency digital-to-analog converter (RF-DAC)-based transmitters are explored. They shift the transition from digital\ua0to analog closer to the antennas, performing both digital-to-analog\ua0conversion and up-conversion in a single block. To reduce the need for\ua0computationally costly digital predistortion (DPD), a linear and wellbehaved\ua0RF-DAC transfer characteristic is desirable. The combination\ua0of non-overlapping local oscillator (LO) signals and an expanding segmented\ua0non-linear RF-DAC scaling is evaluated as a way to linearize\ua0the transmitter. This linearization concept has been studied both for\ua0the linearization of the RF-DAC itself and for the joint linearization of\ua0the cascaded RF-DAC-based modulator and power amplifier (PA) combination.\ua0To adapt the linearization, observation receivers are needed.\ua0In these, high-speed analog-to-digital converters (ADCs) have a central\ua0role. A high-speed ADC has been designed and evaluated to understand\ua0how concepts used to increase the sample rate affect the dynamic performance

Design Techniques for High-Performance SAR A/D Converters

The design of electronics needs to account for the non-ideal characteristics of the device technologies used to realize practical circuits. This is particularly important in mixed analog-digital design since the best device technologies are very different for digital compared to analog circuits. One solution for this problem is to use a calibration correction approach to remove the errors introduced by devices, but this adds complexity and power dissipation, as well as reducing operation speed, and so must be optimised. This thesis addresses such an approach to improve the performance of certain types of analog-to-digital converter (ADC) used in advanced telecommunications, where speed, accuracy and power dissipation currently limit applications. The thesis specifically focuses on the design of compensation circuits for use in successive approximation register (SAR) ADCs. ADCs are crucial building blocks in communication systems, in general, and for mobile networks, in particular. The recently launched fifth generation of mobile networks (5G) has required new ADC circuit techniques to meet the higher speed and lower power dissipation requirements for 5G technology. The SAR has become one of the most favoured architectures for designing high-performance ADCs, but the successive nature of the circuit operation makes it difficult to reach ∼GS/s sampling rates at reasonable power consumption. Here, two calibration techniques for high-performance SAR ADCs are presented. The first uses an on-chip stochastic-based mismatch calibration technique that is able to accurately compute and compensate for the mismatch of a capacitive DAC in a SAR ADC. The stochastic nature of the proposed calibration method enables determination of the mismatch of the CAPDAC with a resolution much better than that of the DAC. This allows the unit capacitor to scale down to as low as 280aF for a 9-bit DAC. Since the CAP-DAC causes a large part of the overall dynamic power consumption and directly determines both the sizes of the driving and sampling switches and the size of the input capacitive load of the ADC and the kT/C noise power, a small CAP-DAC helps the power efficiency. To validate the proposed calibration idea, a 10-bit asynchronous SAR ADC was fabricated in 28-nm CMOS. Measurement results show that the proposed stochastic calibration improves the ADC’s SFDR and SNDR by 14.9 dB, 11.5 dB, respectively. After calibration, the fabricated SAR ADC achieves an ENOB of 9.14 bit at a sampling rate of 85 MS/s, resulting in a Walden FoM of 10.9 fJ/c-s. The second calibration technique is a timing-skew calibration for a time-interleaved (TI) SAR ADC that calibrates/computes the inter-channel timing and offset mismatch simultaneously. Simulation results show the effectiveness of this calibration method. When used together, the proposed mismatch calibration technique and the timing-skew calibration technique enables a TI SAR ADC to be designed that can achieve a sampling rate of ∼GS/s with 10-bit resolution and a power consumption as low as ∼10mW; specifications that satisfy the requirements of 5G technology

Design of High-Speed Power-Efficient A/D Converters for Wireline ADC-Based Receiver Applications

Serial input/output (I/O) data rates are increasing in order to support the explosion in network traffic driven by big data applications such as the Internet of Things (IoT), cloud computing and etc. As the high-speed data symbol times shrink, this results in an increased amount of inter-symbol interference (ISI) for transmission over both severe low-pass electrical channels and dispersive optical channels. This necessitates increased equalization complexity and consideration of advanced modulation schemes, such as four-level pulse amplitude modulation (PAM-4). Serial links which utilize an analog-to-digital converter (ADC) receiver front-end offer a potential solution, as they enable more powerful and flexible digital signal processing (DSP) for equalization and symbol detection and can easily support advanced modulation schemes. Moreover, the DSP back-end provides robustness to process, voltage, and temperature (PVT) variations, benefits from improved area and power with CMOS technology scaling and offers easy design transfer between different technology nodes and thus improved time-to-market. However, ADC-based receivers generally consume higher power relative to their mixed-signal counterparts because of the significant power consumed by conventional multi-GS/s ADC implementations. This motivates exploration of energy-efficient ADC designs with moderate resolution and very high sampling rates to support data rates at or above 50Gb/s. This dissertation presents two power-efficient designs of ≥25GS/s time-interleaved ADCs for ADC-based wireline receivers. The first prototype includes the implementation of a 6b 25GS/s time-interleaved multi-bit search ADC in 65nm CMOS with a soft-decision selection algorithm that provides redundancy for relaxed track-and-hold (T/H) settling and improved metastability tolerance, achieving a figure-of-merit (FoM) of 143fJ/conversion step and 1.76pJ/bit for a PAM-4 receiver design. The second prototype features the design of a 52Gb/s PAM-4 ADC-based receiver in 65nm CMOS, where the front-end consists of a 4-stage continuous-time linear equalizer (CTLE)/variable gain amplifier (VGA) and a 6b 26GS/s time-interleaved SAR ADC with a comparator-assisted 2b/stage structure for reduced digital-to-analog converter (DAC) complexity and a 3-tap embedded feed-forward equalizer (FFE) for relaxed ADC resolution requirement. The receiver front-end achieves an efficiency of 4.53bJ/bit, while compensating for up to 31dB loss with DSP and no transmitter (TX) equalization

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Pipeline analog-to-digital converters for wide-band wireless communications

During the last decade, the development of the analog electronics has been dictated by the enormous growth of the wireless communications. Typical for the new communication standards has been an evolution towards higher data rates, which allows more services to be provided. Simultaneously, the boundary between analog and digital signal processing is moving closer to the antenna, thus aiming for a software defined radio. For analog-to-digital converters (ADCs) of radio receivers this indicates higher sample rate, wider bandwidth, higher resolution, and lower power dissipation. The radio receiver architectures, showing the greatest potential to meet the commercial trends, include the direct conversion receiver and the super heterodyne receiver with an ADC sampling at the intermediate frequency (IF). The pipelined ADC architecture, based on the switched capacitor (SC) technique, has most successfully covered the widely separated resolution and sample rate requirements of these receiver architectures. In this thesis, the requirements of ADCs in both of these receiver architectures are studied using the system specifications of the 3G WCDMA standard. From the standard and from the limited performance of the circuit building blocks, design constraints for pipeline ADCs, at the architectural and circuit level, are drawn. At the circuit level, novel topologies for all the essential blocks of the pipeline ADC have been developed. These include a dual-mode operational amplifier, low-power voltage reference circuits with buffering, and a floating-bulk bootstrapped switch for highly-linear IF-sampling. The emphasis has been on dynamic comparators: a new mismatch insensitive topology is proposed and measurement results for three different topologies are presented. At the architectural level, the optimization of the ADCs in the single-chip direct conversion receivers is discussed: the need for small area, low power, suppression of substrate noise, input and output interfaces, etc. Adaptation of the resolution and sample rate of a pipeline ADC, to be used in more flexible multi-mode receivers, is also an important topic included. A 6-bit 15.36-MS/s embedded CMOS pipeline ADC and an 8-bit 1/15.36-MS/s dual-mode CMOS pipeline ADC, optimized for low-power single-chip direct conversion receivers with single-channel reception, have been designed. The bandwidth of a pipeline ADC can be extended by employing parallelism to allow multi-channel reception. The errors resulted from mismatch of parallel signal paths are analyzed and their elimination is presented. Particularly, an optimal partitioning of the resolution between the stages, and the number of parallel channels, in time-interleaved ADCs are derived. A low-power 10-bit 200-MS/s CMOS parallel pipeline ADC employing double sampling and a front-end sample-and-hold (S/H) circuit is implemented. Emphasis of the thesis is on high-resolution pipeline ADCs with IF-sampling capability. The resolution is extended beyond the limits set by device matching by using calibration, while time interleaving is applied to widen the signal bandwidth. A review of calibration and error averaging techniques is presented. A simple digital self-calibration technique to compensate capacitor mismatch within a single-channel pipeline ADC, and the gain and offset mismatch between the channels of a time-interleaved ADC, is developed. The new calibration method is validated with two high-resolution BiCMOS prototypes, a 13-bit 50-MS/s single-channel and a 14-bit 160-MS/s parallel pipeline ADC, both utilizing a highly linear front-end allowing sampling from 200-MHz IF-band.reviewe

Circuit techniques for low-voltage and high-speed A/D converters

The increasing digitalization in all spheres of electronics applications, from telecommunications systems to consumer electronics appliances, requires analog-to-digital converters (ADCs) with a higher sampling rate, higher resolution, and lower power consumption. The evolution of integrated circuit technologies partially helps in meeting these requirements by providing faster devices and allowing for the realization of more complex functions in a given silicon area, but simultaneously it brings new challenges, the most important of which is the decreasing supply voltage. Based on the switched capacitor (SC) technique, the pipelined architecture has most successfully exploited the features of CMOS technology in realizing high-speed high-resolution ADCs. An analysis of the effects of the supply voltage and technology scaling on SC circuits is carried out, and it shows that benefits can be expected at least for the next few technology generations. The operational amplifier is a central building block in SC circuits, and thus a comparison of the topologies and their low voltage capabilities is presented. It is well-known that the SC technique in its standard form is not suitable for very low supply voltages, mainly because of insufficient switch control voltage. Two low-voltage modifications are investigated: switch bootstrapping and the switched opamp (SO) technique. Improved circuit structures are proposed for both. Two ADC prototypes using the SO technique are presented, while bootstrapped switches are utilized in three other prototypes. An integral part of an ADC is the front-end sample-and-hold (S/H) circuit. At high signal frequencies its linearity is predominantly determined by the switches utilized. A review of S/H architectures is presented, and switch linearization by means of bootstrapping is studied and applied to two of the prototypes. Another important parameter is sampling clock jitter, which is analyzed and then minimized with carefully-designed clock generation and buffering. The throughput of ADCs can be increased by using parallelism. This is demonstrated on the circuit level with the double-sampling technique, which is applied to S/H circuits and a pipelined ADC. An analysis of nonidealities in double-sampling is presented. At the system level parallelism is utilized in a time-interleaved ADC. The mismatch of parallel signal paths produces errors, for the elimination of which a timing skew insensitive sampling circuit and a digital offset calibration are developed. A total of seven prototypes are presented: two double-sampled S/H circuits, a time-interleaved ADC, an IF-sampling self-calibrated pipelined ADC, a current steering DAC with a deglitcher, and two pipelined ADCs employing the SO technique.reviewe

K-Delta-1-Sigma Modulators for Wideband Analog-to-Digital Conversion

As CMOS technology scales, the transistor speed increases enabling higher speed communications and more complex systems. These benefits come at the cost of decreasing inherent device gain, increased transistor leakage currents, and additional mismatches due to process variations. All of these drawbacks affect the design of high-resolution analog-to-digital converters (ADCs) in nano-CMOS processes. To move towards an ADC topology useful in these small processes a first-order K-Delta-1-Sigma (KD1S) modulator-based ADC was proposed. The KD1S topology employs inherent time-interleaving with a shared integrator and K-quantizing feedback paths and can potentially achieve significantly higher conversion bandwidths when compared to the traditional switched-capacitor delta-sigma ADCs. The shared integrator in the KD1S modulator settles over a half the clock period and the op-amp is designed to operate at the base clock frequency. In this dissertation, the first-order KD1S modulator topology is analyzed for the effects of the non-idealities introduced by the K-path operation of the switched-capacitor integrator. Then, the concept of KD1S modulator is extended to higher-order modulators in order to achieve superior noise-shaping performance. A systematic synthesis method has been developed to design and simulate higher-order KD1S modulators at the system level. In order to demonstrate the developed theory, a prototype second-order KD1S modulator has been designed and fabricated in a 500-nm CMOS technology. The second-order KD1S modulator exhibits wideband noise-shaping with an SNDR of 42.7 dB or 6.81 bits in resolution for Kpath = 8 paths, an effective sampling rate of ƒs,new=800 MHz, effective oversampling ratio Kpath•OSR=64 and a signal bandwidth of 6.25 MHz. The second-order KD1S modulator consumes an average current of 3.0 mA from the 5 V supply and occupies an area of 0.55 mm2