Tilting micromirror platform based on liquid dielectrophoresis

This study presents an electrically actuated tilting micro platform based on liquid dielectrophoresis with three axes movement using three droplets situated 120° apart from each other. The interdigitated electrodes produce a non-uniform electric field that generates a body force. The dielectrophoretic mechanism is responsive within at least 30 ms, and it eliminates the solid-solid contact. The tilting platform enabled an angular coverage up to 0.9° (±0.02°), with a maximum displacement of 120 µm. The tilting micromirror platform has beam steering characteristics suitable for various optical applications. The actuating platform sensor is a cost-effective and simple alternative method to study liquid dielectrophoresis without measuring the droplet contact angle. Furthermore, the unique configuration without any solid-solid contact offers a potential improvement for applications in optics, actuators, and other conventional microelectromechanical systems

Optical MEMS

Optical microelectromechanical systems (MEMS), microoptoelectromechanical systems (MOEMS), or optical microsystems are devices or systems that interact with light through actuation or sensing at a micro- or millimeter scale. Optical MEMS have had enormous commercial success in projectors, displays, and fiberoptic communications. The best-known example is Texas Instruments’ digital micromirror devices (DMDs). The development of optical MEMS was impeded seriously by the Telecom Bubble in 2000. Fortunately, DMDs grew their market size even in that economy downturn. Meanwhile, in the last one and half decade, the optical MEMS market has been slowly but steadily recovering. During this time, the major technological change was the shift of thin-film polysilicon microstructures to single-crystal–silicon microsructures. Especially in the last few years, cloud data centers are demanding large-port optical cross connects (OXCs) and autonomous driving looks for miniature LiDAR, and virtual reality/augmented reality (VR/AR) demands tiny optical scanners. This is a new wave of opportunities for optical MEMS. Furthermore, several research institutes around the world have been developing MOEMS devices for extreme applications (very fine tailoring of light beam in terms of phase, intensity, or wavelength) and/or extreme environments (vacuum, cryogenic temperatures) for many years. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on (1) novel design, fabrication, control, and modeling of optical MEMS devices based on all kinds of actuation/sensing mechanisms; and (2) new developments of applying optical MEMS devices of any kind in consumer electronics, optical communications, industry, biology, medicine, agriculture, physics, astronomy, space, or defense

Characterizations and Micro-assembly of Electrostatic Actuators for 3-DOF Micromanipulators in Laser Phonomicrosurgery.

International audienceThis paper presents a design of electrostatic actuators for 3-DOF micromanipulators in robot-assisted laser phonomicrosurgery. By integrating three sets of electrostatic actuators in a vertical configuration, scanning micro-mirror canbe used as a manipulator for laser source. Key enable technology for these miniaturized actuators is microfabrication processes for microelectromechanical systems (MEMS) because the processes can create submicron features with high precision, mass productive, and low cost. Based on precise micromachined electrostatic actuators, the platform is assembled using micro assembly approach. With sizes less than 5 mm x 5 mm x 5 mm, the proposed design has three degree-of-freedom: two rotational motions around the in-plane axis and one out-of-plane translational motion. Static and dynamic analysis of the device is simulated by Finite Element Analysis (FEA) and compared to theoretical calculations. This system preserves outstanding characteristics of electrostatic actuators for fast response and low power consumption. By micro-assembly of the scanning micromirror, the endoscopic systems can be created with a high range of motion and high scanning speed. The target applications of this system include laryngeal microsurgery, optical coherence tomography (OCT), and minimally invasive surgeries (MIS)

FLEXIBLE LOW-COST HW/SW ARCHITECTURES FOR TEST, CALIBRATION AND CONDITIONING OF MEMS SENSOR SYSTEMS

During the last years smart sensors based on Micro-Electro-Mechanical systems (MEMS) are widely spreading over various fields as automotive, biomedical, optical and consumer, and nowadays they represent the outstanding state of the art. The reasons of their diffusion is related to the capability to measure physical and chemical information using miniaturized components. The developing of this kind of architectures, due to the heterogeneities of their components, requires a very complex design flow, due to the utilization of both mechanical parts typical of the MEMS sensor and electronic components for the interfacing and the conditioning. In these kind of systems testing activities gain a considerable importance, and they concern various phases of the life-cycle of a MEMS based system. Indeed, since the design phase of the sensor, the validation of the design by the extraction of characteristic parameters is important, because they are necessary to design the sensor interface circuit. Moreover, this kind of architecture requires techniques for the calibration and the evaluation of the whole system in addition to the traditional methods for the testing of the control circuitry. The first part of this research work addresses the testing optimization by the developing of different hardware/software architecture for the different testing stages of the developing flow of a MEMS based system. A flexible and low-cost platform for the characterization and the prototyping of MEMS sensors has been developed in order to provide an environment that allows also to support the design of the sensor interface. To reduce the reengineering time requested during the verification testing a universal client-server architecture has been designed to provide a unique framework to test different kind of devices, using different development environment and programming languages. Because the use of ATE during the engineering phase of the calibration algorithm is expensive in terms of ATE’s occupation time, since it requires the interruption of the production process, a flexible and easily adaptable low-cost hardware/software architecture for the calibration and the evaluation of the performance has been developed in order to allow the developing of the calibration algorithm in a user-friendly environment that permits also to realize a small and medium volume production. The second part of the research work deals with a topic that is becoming ever more important in the field of applications for MEMS sensors, and concerns the capability to combine information extracted from different typologies of sensors (typically accelerometers, gyroscopes and magnetometers) to obtain more complex information. In this context two different algorithm for the sensor fusion has been analyzed and developed: the first one is a fully software algorithm that has been used as a means to estimate how much the errors in MEMS sensor data affect the estimation of the parameter computed using a sensor fusion algorithm; the second one, instead, is a sensor fusion algorithm based on a simplified Kalman filter. Starting from this algorithm, a bit-true model in Mathworks Simulink(TM) has been created as a system study for the implementation of the algorithm on chip

Enhancements of MEMS design flow for Automotive and Optoelectronic applications

In the latest years we have been witnesses of a very rapidly and amazing grown of MicroElectroMechanical systems (MEMS) which nowadays represent the outstanding state-of-the art in a wide variety of applications from automotive to commercial, biomedical and optical (MicroOptoElectroMechanicalSystems). The increasing success of MEMS is found in their high miniaturization capability, thus allowing an easy integration with electronic circuits, their low manufacturing costs (that comes directly from low unit pricing and indirectly from cutting service and maintaining costs) and low power consumption. With the always growing interest around MEMS devices the necessity arises for MEMS designers to define a MEMS design flow. Indeed it is widely accepted that in any complex engineering design process, a well defined and documented design flow or procedure is vital. The top-level goal of a MEMS/MOEMS design flow is to enable complex engineering design in the shortest time and with the lowest number of fabrication iterations, preferably only one. These two characteristics are the measures of a good flow, because they translate directly to the industry-desirable reductions of the metrics “time to market” and “costs”. Like most engineering flows, the MEMS design flow begins with the product definition that generally involves a feasibility study and the elaboration of the device specifications. Once the MEMS specifications are set, a Finite Element Method (FEM) model is developed in order to study its physical behaviour and to extract the characteristic device parameters. These latter are used to develop a high level MEMS model which is necessary to the design of the sensor read out electronics. Once the MEMS geometry is completely defined and matches the device specifications, the device layout must be generated, and finally the MEMS sensor is fabricated. In order to have a MEMS sensor working according to specifications at first production run is essential that the MEMS design flow is as close as possible to the optimum design flow. The key factors in the MEMS design flow are the development of a sensor model as close as possible to the real device and the layout realization. This research work addresses these two aspects by developing optimized custom tools (a tool for layout check (LVS) and a tool for parasitic capacitances extraction) and new methodologies (a methodology for post layout simulations) which support the designer during the crucial steps of the design process as well as by presenting the models of two cases studies belonging to leading MEMS applications (a micromirror for laser projection system and a control loop for the shock immunity enhancement in gyroscopes for automotive applications)

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

Fabricación de sistemas MEMS – un caso de estudio en la fabricación de un micro-espejo

This paper presents the working principle, design, and fabrication of a silicon-based scanning micromirror with a new type of action mechanism as an example of MEMS (Micro-Electro-Mechanical Systems). Micromirrors can be found in barcode readers as well as micro-projectors, optical coherence tomography, or spectrometers’ adjustable filters. The fabrication process of the device prompted us to describe and discuss the problems related to the manufacture of MEMS. The article starts with some terminology and a brief introduction to the field of microsystems. Afterwards, the concept of a new scanning micromirror is explained. The device is operated by two pairs of thermal bimorphs. A special design enables to maintain a constant distance from the center of the mirror to the light source during the scanning process. The device was implemented in a one degree-of-freedom micromirror and a two degree-of-freedom micromirror. The fabrication process of both types is described. For each case, a different type of substrate was used. The first type of substrate was a standard silicon wafer; the second one, SOI (Silicon-On-Insulator). The process with the first one was complicated and caused many problems. Replacing this substrate with SOI solved some of the issues, but did not prevent new ones from arising. Nevertheless, the SOI substrate produces much better results and it is preferable to manufacture this type of MEMS devices.Este trabajo muestra un mecanismo de acción, un diseño y una fabricación de un nuevo dispositivo de escaneo - un micro-espejo. Los micro-espejos se pueden encontrar en los lectores de códigos de barras, así como en los micro proyectores, en sistemas de tomografía óptica coherente, o en los filtros ajustables de espectrómetros. El proceso de formación del nuevo dispositivo nos llevó a describir y discutir los problemas relacionados con la fabricación de MEMS (sistemas microelectrónicos). En primer lugar, se da una terminología y una breve introducción al campo de los microsistemas. A continuación, se explica un concepto del nuevo micro-espejo de escanéo. El dispositivo es accionado por dos pares de actuadores termo-bimorfos. Un diseño especial permite mantener la distancia constante desde el centro del espejo a la fuente de luz durante el proceso de escaneo. El dispositivo se implementó en dos versiones: un micro-espejo con un grado de libertad y un micro-espejo con dos grados de libertad. Se describe un proceso de fabricación para los dos tipos del dispositivo que utiliza dos tipos diferentes de sustrato. El primer tipo de sustrato corresponde a una oblea de silicio estándar, el segundo substrato corresponde a un SOI (Silicon-On-Insulator). El proceso con la oblea de silicio estándar fue complicado y causó muchos problemas. Cambiar el sustrato a SOI ayudó a resolver algunos de ellos, pero no permitió evitar algunos nuevos. Sin embargo, el sustrato SOI da mejores resultados y se encuentra que es preferible fabricar dispositivos MEMS de este tipo

A Two degrees-of-freedom (DOF) scanning micromirror using thermocapillary effect in microdroplets

This thesis research proposes a novel and simple means of tilting micromirror on a microdroplet by utilizing thermocapillary actuated droplet deformation. Device theory, device design, fabrication, packaging, testing and results are discussed to demonstrate the operation of a 2-degrees-of-freedom (2- DOF) scanning micromirror. Thermocapillary, or Marangoni, effect and contact angle hysteresis are employed to control the droplet shape and position. Hysteresis in different liquids is studied with its influence on the stability of the droplet. The device consists of a micromirror placed onto a microdroplet, and can produce a 6.5° tilting angle when actuated at 30 V. The tilting angle is found to be almost linearly dependent on actuation voltage. Linear, square and circular laser scanning patterns were drawn to demonstrate its successful operation. This technique shows potential applications in scanning micromirror and display technology. Finally, possible future work is discussed to further improve the device performance

MEMS Devices for Circumferential-scanned Optical Coherence Tomography Bio-imaging

Ph.DDOCTOR OF PHILOSOPH

Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG