FOREVER: Fault/intrusiOn REmoVal through Evolution & Recovery

The goal of the FOREVER project is to develop a service for Fault/intrusiOn REmoVal through Evolution & Recovery. In order to achieve this goal, our work addresses three main tasks: the definition of the FOREVER service architecture; the analysis of how diversity techniques can improve resilience; and the evaluation of the FOREVER service. The FOREVER service is an important contribution to intrustion-tolerant replication middleware and significantly enhances the resilience

DESIGN, MODELING, OPTIMIZATION, AND BENCHMARKING OF INTERCONNECTS AND SCALING TECHNOLOGIES AND THEIR CIRCUIT AND SYSTEM LEVEL IMPACT

This research focuses on the future of integrated circuit (IC) scaling technologies at the device and back end of line (BEOL) level. This work includes high level modeling of different technologies and quantifying potential performance gains on a circuit and system level. From the device side, this research looks at the scaling challenges and the future scaling drivers for conventional charge-based devices implemented at the 7nm technology node and beyond. It examines the system-level performance of stacking device logic in addition to tunneling field effect transistors (TFET) and their potential as beyond-CMOS devices. Finally, this research models and benchmarks BEOL scaling challenges and evaluates proposed technological advancements such as metal barrier scaling for copper interconnects and replacing local interconnects with ruthenium. Potential impact on performance, power, and area of these interconnect technologies is quantified for fully placed and routed circuits.Ph.D

Terahertz Microstrip Elevated Stack Antenna Technology on GaN-on-Low Resistivity Silicon Substrates for TMIC

In this paper we demonstrate a THz microstrip stack antenna on GaN-on-low resistivity silicon substrates (ρ < 40 Ω.cm). To reduce losses caused by the substrate and to enhance performance of the integrated antenna at THz frequencies, the driven patch is shielded by silicon nitride and gold in addition to a layer of benzocyclobutene (BCB). A second circular patch is elevated in air using gold posts, making this design a stack configuration. The demonstrated antenna shows a measured resonance frequency in agreement with the modeling at 0.27 THz and a measured S11 as low as −18 dB was obtained. A directivity, gain and radiation efficiency of 8.3 dB, 3.4 dB, and 32% respectively was exhibited from the 3D EM model. To the authors' knowledge, this is the first demonstrated THz integrated microstrip stack antenna for TMIC (THz Monolithic Integrated Circuits) technology; the developed technology is suitable for high performance III-V material on low resistivity/high dielectric substrates

Density Matrix Perturbation Theory

An expansion method for perturbation of the zero temperature grand canonical density matrix is introduced. The method achieves quadratically convergent recursions that yield the response of the zero temperature density matrix upon variation of the Hamiltonian. The technique allows treatment of embedded quantum subsystems with a computational cost scaling linearly with the size of the perturbed region, O(N_pert.), and as O(1) with the total system size. It also allows direct computation of the density matrix response functions to any order with linear scaling effort. Energy expressions to 4th order based on only first and second order density matrix response are given.Comment: 4 pages, 2 figure

Resilience-Building Technologies: State of Knowledge -- ReSIST NoE Deliverable D12

This document is the first product of work package WP2, "Resilience-building and -scaling technologies", in the programme of jointly executed research (JER) of the ReSIST Network of Excellenc