Flexible Ultralow-Power Sensor Interfaces for E-Skin

Thin-film electronics has hugely benefitted from low-cost processes, large-area processability, and multi-functionality. This has not only stimulated innovation in display and sensor technology, but has also demonstrated great potential for integration of components for human-machine interfaces. For electronics to be deployed as sensor interfaces and signal processing, the quest for low power is compelling due to the inherently limited battery lifetime. This review will present the state-of-the-art in thin film electronics and demonstrate examples of low-cost printable transistors and biosensors that are flexible/stretchable for wearable and other applications. Ultralow power design for thin-film transistors will be discussed from the standpoint of reducing both operating voltage and operating current, taking into account the challenges in meeting frequency requirements. Compact models for circuit design will be reviewed along with new insights into ultralow power transistors and high gain amplifier circuits. Finally, a concept for an integrated system comprising sensors and interfacing circuits will be demonstrated, which has the potential to enable battery-less operation.EPSRC under Project EP/M013650/1 EU under Projects DOMINO 645760, 1D-NEON 685758 and BET-EU 692373 IEEE Electron Devices Society PhD Student Fellowship China Scholarship Counci

Self-Healing of Open-Circuit Faults in Organic Thin-Film Transistor-Based Flexible Electronics

Flexible electronics has attracted tremendous attention due to the fast-growing market for portable devices and sensors. However, these devices usually suffer from internal and external forces, which can lead to the failure of interconnects in the circuit. To address this issue, some passive and active strategies have been developed for improving the reliability of interconnects in circuits. Although all these strategies are effective in tackling problems related to the mechanical stress, they have inherent limit in dealing with other failure causes or repairing the open fault. Therefore, in this dissertation, a particle-based self-healing (PBSH) technique has been developed. The detailed study starts with an overall review of the state of the art in techniques developed for improving the reliability of interconnects in flexible circuits. Then the mechanisms of the PBSH technique are analysed and the chemical treatment of metal particles are explored. The physical modelling of the healing is established, and relations between the healing time with the suspension concentration, electric field, length of open gap, and external resistance are verified by experimental results. In addition, to avoid the inherent conductivity of the suspension and the aggregation of micro-particles, they are modified by the oleic acid. This chemical treatment of metal particles improves the uniformity of the suspension and sets a threshold electric field for the occurrence of self-healing. As a key component in flexible circuits, an organic thin-film transistor (OTFT) fabricated by all inkjet-printing process has been developed and characterised in this study. This transistor uses 6,13-bis(triisopropylsilylethynyl)-pentacene (TIPSPentacene) as the semiconductor, poly (vinyl cinnamate) (PVC) as the dielectric, silver as the electrodes, and CYTOP as the encapsulation. Based on this device, two basic circuits: the current mirror and the common-source (CS) amplifier have been successfully built on flexible substrates. The proper functioning of the printed devices and circuits becomes the base for the study of the self-healing in flexible circuits. Subsequently, the PBSH in OTFT device and circuit interconnects is verified. This technique can successfully repair open faults at both source and drain sides in OTFT device interconnects. Simultaneously, it can heal open faults occurring at different locations in flexible current mirror and common-source amplifier circuits biased at the static state. Moreover, the self-healing is also proved to be effective and stable in common-source amplifier when processing alternating current (AC) signals. In order to demonstrate the feasibility of the PBSH technique in real-world applications, more performance characterisations have been conducted. The bending test shows the reliability and stability of the healing in the bent condition. And the dualfaults test verifies the ability of the PBSH technique for healing more than one open fault in interconnects. In addition, methods of packaging the circuit and confining the healing material in the expected region are also developed, which prove the feasibility and manufacturability of the PBSH technique in integrated circuits. This study sets a new benchmark for improving the reliability of inkjet-printed flexible circuits

Inkjet printing of organic transistor devices

In the last two decades inkjet printing passed from the field of graphic art and newspaper industry to that of organic and flexible electronics, as a manufacturing tool, becoming a major topic in scientific research. The appeal of this kind of technology is mainly due to its low cost, non-contact and additive approach, which makes it surely the most promising technique over the other technologies of Printed Electronics. The focus of this thesis is the optimization of the printing process, employing a piezo- electric Drop-on-Demand inkjet printer, for the realization of organic transistors on highly flexible plastic substrates, and their development in more complex systems for sensing applications. Indeed, all the devices realized have been investigated by means of electrical measures and spectroscopic techniques, in order to assess their performances and, consequently, to evaluate the reliability of inkjet printing as fabrication technique for such devices. In the first chapter a general introduction to the field of Printed Electronics, with particular focus on inkjet printing technique, is given. The second chapter provides informations concerning the fabrication characterization procedure followed, including a detailed description of the inkjet printing technology used, a report about the main physical and chemical properties of the materials employed, the explanation of the inkjet printing procedure for each material used in this thesis (as the printing parameters optimization and the approach for the resolution of some technical issues); finally also a brief description of the experimental techniques employed in order to characterize the devices is given. The third chapter is fully dedicated to the results concerning the fabrication and the characterization of all-Organic ElectroChemical Transistors (OECTs), while in the fourth chapter the results about inkjet printed Organic Field Effect Transistors (OFETs) are discussed. Finally, a brief chapter reports a summary of the main results achieved

Flexible sensors—from materials to applications

Flexible sensors have the potential to be seamlessly applied to soft and irregularly shaped surfaces such as the human skin or textile fabrics. This benefits conformability dependant applications including smart tattoos, artificial skins and soft robotics. Consequently, materials and structures for innovative flexible sensors, as well as their integration into systems, continue to be in the spotlight of research. This review outlines the current state of flexible sensor technologies and the impact of material developments on this field. Special attention is given to strain, temperature, chemical, light and electropotential sensors, as well as their respective applications

Next-generation organic blend semiconductors for high performance solution-processable field Effect Transistors

Ambitions for transparent, lightweight, flexible and inexpensive electronic technologies that can be printed over large area substrates have driven substantial advances in the field of organic/printed electronics in recent years. Amongst the various technologies investigated, solution-processed, organic thin-film transistors (OTFTs) have received extraordinary attention, primarily due to the enormous potential for simple, cost-effective manufacturing. Two exciting research areas relevant to OTFT development that offer tremendous potential are those of the small molecule/polymer organic semiconducting blends and the science and engineering of molecular doping. However, the lack of organic semiconducting blends that surpass the benchmark charge carrier mobility of 10 cm2/Vs, and the numerous challenges associated with the practical utilisation of molecular doping, have prevented adaptation of OTFTs as a viable technology for application in the emerging sector of plastic electronics. The work in this thesis focuses on an organic semiconducting system for OTFTs that addresses these two points. The first part of this thesis describes the development of advanced organic semiconducting blends, the so-called 3rd generation (3G) blend systems. Specifically, a new blend based on the small-molecule C8-BTBT and the conjugated polymer C16DT-BT is introduced. A third component, the molecular p-dopant, C60F48, is then added to the blend system and it is found to have remarkably positive effects on OTFT performance. The ternary blend system is then combined with a solvent-mixing approach, resulting in devices with an exceptional hole mobility value exceeding 13 cm2/Vs. Through the use of complementary characterisation techniques, it is shown that key to this achievement is the unusual three-component material distribution, hinting at the existence of an unconventional doping mechanism. Furthermore, by considering alternative processing techniques, the maximum mobility of the resulting OTFTs is improved further to a value in excess of 23 cm2/Vs. The second part of the thesis focuses on the impact of p-doping in the ternary C8 BTBT:C16IDT BT:C60F48 blend on other important operating characteristics of the OTFTs. The intentional and simple to implement doping process is shown to improve key device parameters such as bias-stress stability, parasitic contact resistance, threshold voltage and the overall device-to-device parameter variation (i.e. narrowing of the parameter spread). Importantly, the inclusion of the dopant is not found to adversely affect the nature of the C8 BTBT crystal packing at the OTFT channel. The final part of this thesis describes the incorporation of 3G blend-based OTFTs into fully functional logic electronic circuits. Hybrid inverter circuits (i.e. NOT gates) are fabricated at low temperatures from solution-phase by combining the high hole mobility C8-BTBT:C16IDT-BT:C60F48 blend OTFTs as the p-channel device and a novel In2O3/ZnO heterojunction metal oxide semiconducting system as the n-channel transistor. The resulting complementary inverters exhibit excellent signal gain and high noise margins, making this hybrid circuitry a promising contender for application in the emerging field of printed microelectronics.Open Acces

3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications

Modern microelectronic systems and their components are essentially 3D devices that have become smaller and lighter in order to improve performance and reduce costs. To maintain this trend, novel materials and technologies are required that provide more structural freedom in 3D over conventional microelectronics, as well as easier parallel fabrication routes while maintaining compatability with existing manufacturing methods. Self‐assembly of initially planar membranes into complex 3D architectures offers a wealth of opportunities to accommodate thin‐film microelectronic functionalities in devices and systems possessing improved performance and higher integration density. Existing work in this field, with a focus on components constructed from 3D self‐assembly, is reviewed, and an outlook on their application potential in tomorrow's microelectronics world is provided

Proceedings: Vol. 2

Contents: Part X: PostersPart I - IX: Session Abstracts (s. Volume 1)Version notice: There are minor differences between the printed and online version.Druckausgabe: 4th International Symposium Technologies for Polymer Electronics - TPE 10 : 18 - 20 May 2010, Rudolstadt/Germany / ed. by Hans-Klaus Roth, Klaus Heinemann and Gerhard Gobsch Ilmenau : Univ.-Verl. Ilmenau, 2010. - 2 Bd., insg. 337 S. ISBN 978-3-939473-66-4 Preis: 75,00