Piezoresistive effect of p-type single crystalline 3C-SiC on (111) plane

This paper presents for the first time the effect of strain on the electrical conductivity of p-type single crystalline 3C-SiC grown on a Si (111) substrate. 3C-SiC thin film was epitaxially formed on a Si (111) substrate using the low pressure chemical vapor deposition process. The piezoresistive effect of the grown film was investigated using the bending beam method. The average longitudinal gauge factor of the p-type single crystalline 3C-SiC was found to be around 11 and isotropic in the (111) plane. This gauge factor is 3 times smaller than that in a p-type 3C-SiC (100) plane. This reduction of the gauge factor was attributed to the high density of defects in the grown 3C-SiC (111) film. Nevertheless, the gauge factor of the p-type 3C-SiC (111) film is still approximately 5 times higher than that in most metals, indicating its potential for niche mechanical sensing applications

Microsystems, Space Qualified Electronics and Mobile Sensor Platforms for Harsh Environment Applications and Planetary Exploration

NASA Glenn Research Center is presently developing and applying a range of sensor and electronic technologies that can enable future planetary missions. These include space qualified instruments and electronics, high temperature sensors for Venus missions, mobile sensor platforms, and Microsystems for detection of a range of chemical species and particulates. A discussion of each technology area and its level of maturity is given. It is concluded that there is a strong need for low power devices which can be mobile and provide substantial characterization of the planetary environment where and when needed. While a given mission will require tailoring of the technology for the application, basic tools which can enable new planetary missions are being developed

High temperature tolerant optical fiber inline microsensors by laser fabrication

Fiber sensors are particularly attractive for harsh environment defined by high temperature, high pressure, corrosive/erosive, and strong electromagnetic interference, where conventional electronic sensors do not have a chance to survive. However, the key issue has been the robustness of the sensor probe (not the fiber itself) mostly due to the problems stemmed from the traditional assembly based approaches used to construct fiber optic sensors. For example, at high temperatures (e.g., above 500°C), the thermal expansion coefficient mismatch between different composited parts has a high chance to lead to sensors\u27 malfunction by breaking the sensor as a result of the excessive thermo-stress building up inside the multi-component sensor structure. To survive the high temperature harsh environment, it is thus highly desired that the sensor probes are made assembly-free. We are proposing to fabricate assembly-free fiber sensor probes by manufacturing various microstructures directly on optical fibers. This dissertation aims to design, develop and demonstrate robust, miniaturized fiber sensor probes for harsh environment applications through assembly-free, laser fabrication. Working towards this objective, the dissertation explored three types of fiber inline microsensors fabricated by two types of laser systems. Using a CO₂ laser, long period fiber grating (LPFG) and core-cladding mode interferometer sensors were fabricated. Using a femto-second laser, an extrinsic Fabry-Perot interferometric (EFPI) sensor with an open cavity was fabricated. The scope of the dissertation work consists of device design, device modeling/simulation, laser fabrication system setups, signal processing method development and sensor performance evaluation and demonstration. This research work provides theoretical and experimental evidences that laser fabrication technique is a valid tool to fabricate previously undoable miniaturized photonic sensor structures, which can avoid complicated assembly processes and, as a result, enhance robustness, functionality and survivability of the sensor for applications in harsh environments. In addition, a number of novel optical fiber sensor platforms are proposed, studied and demonstrated for sensing and monitoring of various physical and chemical parameters in high temperature harsh environments --Abstract, page iii

Experimental design with integrated temperature sensors in MEMS: an example of application for rarefied gases

This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the Makedonia Palace Hotel, Thessaloniki in Greece. The conference was organised by Brunel University and supported by the Italian Union of Thermofluiddynamics, Aristotle University of Thessaloniki, University of Thessaly, IPEM, the Process Intensification Network, the Institution of Mechanical Engineers, the Heat Transfer Society, HEXAG - the Heat Exchange Action Group, and the Energy Institute.This paper presents a new MEMS experimental device with integrated temperature sensors. Conventional silicon planar techniques for the fabrication of microelectronic sensors have been used to realize a particular layout, which does not limit the material of the microstructures it can be used with. The study of rarefied gases has been chosen as case study for the validation of the local measuring system. In this work the attention will be focused on the description of the sensor functioning principles and on the presentation of the preliminary results obtained during the calibration procedures. The tests showed promising results for a future development of the sensor design.The European Community’s Seventh Framework Program (FP7/2007-20013) under grant agreement no 215504

The Development of an in Vivo Spinal Fusion Monitor Using Microelectromechanical (Mems) Technology to Create Implantable Microsensors

Surgical fusion of the spine is a conventional approach, and often last alternative, to the correction of a degenerative painful spinal segment. The procedure involves the surgical removal of the intervertebral disc at the problematic site, and the placement of a bone graft that is commonly harvested from the patients iliac crest and placed within the discectomized space. The surrounding bone is expected to incorporate and remodel into the bone graft to eventually provide an immobilized site. Spinal instrumentation often accompanies the bone graft to provide further immobility to the targeted site, thus augmenting the fusion process. However, the status of a fusion and the incorporation of bone across a destabilized spinal segment are often difficult for the surgeon to assess. Radiographic methods provide static views of the fusion site that possess excessive limitations. The radiographic image cannot provide the surgeon with information regarding fusion integrity when the patient is mobile and the spine is exposed to multiple motions. Fortunately, technological advances utilizing microelectromechanical system technology (MEMS) have provided insight into the development of miniature devices that exhibit high resolution, electronic accuracy, miniature sizing, and have the capacity to monitor long-term, real-time in vivo pressures and forces for a variety of situations. However, numerous challenges exist with the utilization of MEMS devices for in vivo applications.This work investigated the feasibility of utilizing implantable microsensors to monitor the pressure and force patterns of bone incorporation and healing of a spine fusion in vivo. The knowledge obtained from this series of feasibility tests using commercially available transducers to monitor pressures and forces, will be applied towards the development of miniature sensors that utilize MEMS technology to monitor real-time, long-term spine fusion in living subjects. The packaging, radiographic, and sterilization characteristics of MEMS sensors were eva

The Development of an in Vivo Spinal Fusion Monitor Using Microelectromechanical (Mems) Technology to Create Implantable Microsensors

Surgical fusion of the spine is a conventional approach, and often last alternative, to the correction of a degenerative painful spinal segment. The procedure involves the surgical removal of the intervertebral disc at the problematic site, and the placement of a bone graft that is commonly harvested from the patients iliac crest and placed within the discectomized space. The surrounding bone is expected to incorporate and remodel into the bone graft to eventually provide an immobilized site. Spinal instrumentation often accompanies the bone graft to provide further immobility to the targeted site, thus augmenting the fusion process. However, the status of a fusion and the incorporation of bone across a destabilized spinal segment are often difficult for the surgeon to assess. Radiographic methods provide static views of the fusion site that possess excessive limitations. The radiographic image cannot provide the surgeon with information regarding fusion integrity when the patient is mobile and the spine is exposed to multiple motions. Fortunately, technological advances utilizing microelectromechanical system technology (MEMS) have provided insight into the development of miniature devices that exhibit high resolution, electronic accuracy, miniature sizing, and have the capacity to monitor long-term, real-time in vivo pressures and forces for a variety of situations. However, numerous challenges exist with the utilization of MEMS devices for in vivo applications.This work investigated the feasibility of utilizing implantable microsensors to monitor the pressure and force patterns of bone incorporation and healing of a spine fusion in vivo. The knowledge obtained from this series of feasibility tests using commercially available transducers to monitor pressures and forces, will be applied towards the development of miniature sensors that utilize MEMS technology to monitor real-time, long-term spine fusion in living subjects. The packaging, radiographic, and sterilization characteristics of MEMS sensors were eva

Application of adhesives in MEMS and MOEMS assembly: a review

This paper presents a review of the recent literature on the use of adhesives in MEMS packaging applications. The aim of this review has been to establish the current applications of adhesives in MEMS and MOEMS assembly and to investigate the limitations and future requirements of these materials. The review has shown that while there is a wealth of information available on the packaging of MEMS devices, there is very limited detail available within the public domain regarding the specific uses of adhesives and in particular exactly which products are in use. The paper begins with an overview of the uses of adhesives in MEMS packaging, subdivided into sections on structural adhesives, adhesives for optical applications and other applications. The paper then describes methods for adhesive dispensing and issues with adhesive use which affect the reliability of the package. The reliability of MEMS devices assembled using adhesives is a challenging issue, being more than a simple combination of electrical, mechanical and material reliability. Many failure modes in MEMS devices can be attributed to the adhesives used in the assembly; for example, thermal expansion mismatches can cause stress in the die attach, while outgassing from epoxies can cause failure of sealed devices and contamination of optical surfaces

Review on carbon-derived, solid-state, micro and nano sensors for electrochemical sensing applications

The aim of this review is to summarize the most relevant contributions in the development of electrochemical sensors based on carbon materials in the recent years. There have been increasing numbers of reports on the first application of carbon derived materials for the preparation of an electrochemical sensor. These include carbon nanotubes, diamond like carbon films and diamond film-based sensors demonstrating that the particular structure of these carbon material and their unique properties make them a very attractive material for the design of electrochemical biosensors and gas sensors. Carbon nanotubes (CNT) have become one of the most extensively studied nanostructures because of their unique properties. CNT can enhance the electrochemical reactivity of important biomolecules and can promote the electron-transfer reactions of proteins (including those where the redox center is embedded deep within the glycoprotein shell). In addition to enhanced electrochemical reactivity, CNT-modified electrodes have been shown useful to be coated with biomolecules (e.g., nucleic acids) and to alleviate surface fouling effects (such as those involved in the NADH oxidation process). The remarkable sensitivity of CNT conductivity with the surface adsorbates permits the use of CNT as highly sensitive nanoscale sensors. These properties make CNT extremely attractive for a wide range of electrochemical sensors ranging from amperometric enzyme electrodes to DNA hybridization biosensors. Recently, a CNT sensor based fast diagnosis method using non-treated blood assay has been developed for specific detection of hepatitis B virus (HBV) (human liver diseases, such as chronic hepatitis, cirrhosis, and hepatocellular carcinoma caused by hepatitis B virus). The linear detection limits for HBV plasma is in the range 0.5–3.0 μL−1 and for anti- HBVs 0.035–0.242 mg/mL in a 0.1 M NH4H2PO4 electrolyte solution. These detection limits enables early detection of HBV infection in suspected serum samples. Therefore, non-treated blood serum can be directly applied for real-time sensitive detection in medical diagnosis as well as in direct in vivo monitoring. Synthetic diamond has been recognized as an extremely attractive material for both (bio-) chemical sensing and as an interface to biological systems. Synthetic diamond have outstanding electrochemical properties, superior chemical inertness and biocompatibility. Recent advances in the synthesis of highly conducting nanocrystalline-diamond thin films and nano wires have lead to an entirely new class of electrochemical biosensors and bio-inorganic interfaces. In addition, it also combines with development of new chemical approaches to covalently attach biomolecules on the diamond surface also contributed to the advancement of diamond-based biosensors. The feasibility of a capacitive field-effect EDIS (electrolyte-diamond-insulatorsemiconductor) platform for multi-parameter sensing is demonstrated with an O-terminated nanocrystalline-diamond (NCD) film as transducer material for the detection of pH and penicillin concentration. This has also been extended for the label-free electrical monitoring of adsorption and binding of charged macromolecules. One more recent study demonstrated a novel bio-sensing platform, which is introduced by combination of a) geometrically controlled DNA bonding using vertically aligned diamond nano-wires and b) the superior electrochemical sensing properties of diamond as transducer material. Diamond nanowires can be a new approach towards next generation electrochemical gene sensor platforms. This review highlights the advantages of these carbon materials to promote different electron transfer reactions specially those related to biomolecules. Different strategies have been applied for constructing carbon material-based electrochemical sensors, their analytical performance and future prospects are discussed

Scalable and Stable Ferroelectric Non-Volatile Memory at > 500 ∘^\circC

Non-volatile memory (NVM) devices that reliably operate at temperatures above 300 $^\circ$C are currently non-existent and remains a critically unmet challenge in the development of high-temperature (T) resilient electronics, necessary for many emerging, complex computing and sensing in harsh environments. Ferroelectric Al$_x$Sc$_{1-x}$N exhibits strong potential for utilization in NVM devices operating at very high temperatures (> 500 $^\circ$C) given its stable and high remnant polarization (PR) above 100 $\mu$C/cm$^2$ with demonstrated ferroelectric transition temperature (TC) > 1000 $^\circ$C. Here, we demonstrate an Al$_{0.68}$Sc$_{0.32}$N ferroelectric diode based NVM device that can reliably operate with clear ferroelectric switching up to 600 $^\circ$C with distinguishable On and Off states. The coercive field (EC) from the Pulsed I-V measurements is found to be -5.84 (EC-) and +5.98 (EC+) (+/- 0.1) MV/cm at room temperature (RT) and found to decrease with increasing temperature up to 600 $^\circ$C. The devices exhibit high remnant polarizations (> 100 $\mu$C/cm$^2$) which are stable at high temperatures. At 500 $^\circ$C, our devices show 1 million read cycles and stable On-Off ratio above 1 for > 6 hours. Finally, the operating voltages of our AlScN ferrodiodes are < 15 V at 600 $^\circ$C which is well matched and compatible with Silicon Carbide (SiC) based high temperature logic technology, thereby making our demonstration a major step towards commercialization of NVM integrated high-T computers.Comment: MS and S