Replica Bit-Line Technique for Embedded Multilevel Gain-Cell DRAM

Multilevel gain-cell DRAMs are interesting to improve the area-efficiency of modern fault-tolerant systems-on-chip implemented in deep-submicron CMOS technologies. This paper addresses the problem of long access times in such multilevel gain-cell DRAMs, which are further aggravated by process parameter variations. A replica bit-line (BL) technique, previously proposed for SRAM, is adapted to speed up the multilevel read operation at a negligible area-increase. Moreover, the same replica column is used to improve the write access time. An 8-kb DRAM macro implemented in 90-nm CMOS technology shows that the replica column is able to successfully track die-to-die process, voltage, and temperature variations to generate control signals with optimum delay. Finally, Monte-Carlo simulations show that a small timing margin of 100 ps is sufficient to also cope with within-die process variations

Review and Classification of Gain Cell eDRAM Implementations

With the increasing requirement of a high-density, high-performance, low power alternative to traditional SRAM, Gain Cell (GC) embedded DRAMs have gained a renewed interest in recent years. Several industrial and academic publications have presented GC memory implementations for various target applications, including high-performance processor caches, wireless communication memories, and biomedical system storage. In this paper, we review and compare the recent publications, examining the design requirements and the implementation techniques that lead to achievement of the required design metrics of these applications

Energy Reduction Techniques to Increase Battery Life for Electronic Sensor Nodes

Preserving battery life in duty-cycled sensor nodes requires minimizing energy use in the active region. Lowering the power supply of CMOS gates down into sub-threshold mode is a good way to decrease energy. In this work, a unique technique to control the current in CMOS gates to reliably operate them in sub-threshold mode is described. Compared to the current state-of-theart for running digital gates in the sub-threshold regime, this work is often superior in its lack of complexity and in reduced variance in delay caused by process variations. In addition to presenting the design considerations, a demonstration of a complete digital design flow is given using the custom gates. An AES128 encryption/decryption engine is designed using the aforementioned digital flow in a commercial 180nm process. The resulting design has a ratio of maximum to minimum frequency variation over corners of only 50% with a 0.3V power supply where the same ratio with standard CMOS gates biased under the same supply voltage is 5600%. In addition, the custom gates are used to design a Wallace tree multiplier in an SOI 45nm process that is fully functional with an optimum energy power supply level of 0.34V with a typical operating frequency of 8 MHz having a variation over corners of 80%. For a proof of concept memory chip designed in this work, the architecture uses a logiccompatible CMOS process particularly suitable for embedded applications. The differential pair construct causes the read and refresh power to be independent of any process parameter including the within-die threshold voltage. The current stop feature keeps the read voltage transition low to further minimize read power. The bit cell operates in both single bit BASE2 and multi-bit BASE4 modes. An expression for the read signal was verified with bit cell simulations. These simulations also compare the performance impact of threshold voltage variance in the architecture with a standard gain cell. A DRAM bit cell array was fabricated in the XFab 180nm CMOS process. Measured waveforms closely match theoretical results obtained from a system simulation. The silicon retention time was measured at room temperature and is greater than 150 ms in BASE2 mode and greater than 75 ms in BASE4 mode. 180nm, 25C analysis predicts 0.8uW/Mbit refresh power at 630 MHz, the lowest in the literature. Further: the memory bit cell architecture presented here has a refresh power delay product several times lower than any other published architecture. The current controlled memory architecture in this work improves or overcomes the drawbacks of the 1T1C and gain cell memory architectures. A current controlled memory design was fabricated as a 131K bit array in an 180nm process to provide silicon proof. The bit cell configuration with shared read and write bit cells gives effectively two memory banks. The grouping of rows together into common source domains allows only two opamps to control the current in all the bit cells across the whole chip. The sense amplifiers have a globally controlled switching threshold point and keep their static power in the nano-amp range. The bit cells can operate either in BASE2 or BASE4 mode and the read bit line transitions are reduced with a current stop construct. Parts were received from the foundry in an 84-pin PLCC and were tested at a number of locations on the die. They proved to be fully functional in BASE4. The silicon retention time was measured at room temperature and was greater than four seconds

Caractérisation et conception d' architectures basées sur des mémoires à changement de phase

Semiconductor memory has always been an indispensable component of modern electronic systems. The increasing demand for highly scaled memory devices has led to the development of reliable non-volatile memories that are used in computing systems for permanent data storage and are capable of achieving high data rates, with the same or lower power dissipation levels as those of current advanced memory solutions.Among the emerging non-volatile memory technologies, Phase Change Memory (PCM) is the most promising candidate to replace conventional Flash memory technology. PCM offers a wide variety of features, such as fast read and write access, excellent scalability potential, baseline CMOS compatibility and exceptional high-temperature data retention and endurance performances, and can therefore pave the way for applications not only in memory devices, but also in energy demanding, high-performance computer systems. However, some reliability issues still need to be addressed in order for PCM to establish itself as a competitive Flash memory replacement.This work focuses on the study of embedded Phase Change Memory in order to optimize device performance and propose solutions to overcome the key bottlenecks of the technology, targeting high-temperature applications. In order to enhance the reliability of the technology, the stoichiometry of the phase change material was appropriately engineered and dopants were added, resulting in an optimized thermal stability of the device. A decrease in the programming speed of the memory technology was also reported, along with a residual resistivity drift of the low resistance state towards higher resistance values over time.A novel programming technique was introduced, thanks to which the programming speed of the devices was improved and, at the same time, the resistance drift phenomenon could be successfully addressed. Moreover, an algorithm for programming PCM devices to multiple bits per cell using a single-pulse procedure was also presented. A pulse generator dedicated to provide the desired voltage pulses at its output was designed and experimentally tested, fitting the programming demands of a wide variety of materials under study and enabling accurate programming targeting the performance optimization of the technology.Les mémoires à base de semi-conducteur sont indispensables pour les dispositifs électroniques actuels. La demande croissante pour des dispositifs mémoires fortement miniaturisées a entraîné le développement de mémoires non volatiles fiables qui sont utilisées dans des systèmes informatiques pour le stockage de données et qui sont capables d'atteindre des débits de données élevés, avec des niveaux de dissipation d'énergie équivalents voire moindres que ceux des technologies mémoires actuelles.Parmi les technologies de mémoires non-volatiles émergentes, les mémoires à changement de phase (PCM) sont le candidat le plus prometteur pour remplacer la technologie de mémoire Flash conventionnelle. Les PCM offrent une grande variété de fonctions, comme une lecture et une écriture rapide, un excellent potentiel de miniaturisation, une compatibilité CMOS et des performances élevées de rétention de données à haute température et d'endurance, et peuvent donc ouvrir la voie à des applications non seulement pour les dispositifs mémoires, mais également pour les systèmes informatiques à hautes performances. Cependant, certains problèmes de fiabilité doivent encore être résolus pour que les PCM se positionnent comme un remplacement concurrentiel de la mémoire Flash.Ce travail se concentre sur l'étude de mémoires à changement de phase intégrées afin d'optimiser leurs performances et de proposer des solutions pour surmonter les principaux points critiques de la technologie, ciblant des applications à hautes températures. Afin d'améliorer la fiabilité de la technologie, la stœchiométrie du matériau à changement de phase a été conçue de façon appropriée et des dopants ont été ajoutés, optimisant ainsi la stabilité thermique. Une diminution de la vitesse de programmation est également rapportée, ainsi qu'un drift résiduel de la résistance de l'état de faiblement résistif vers des valeurs de résistance plus élevées au cours du temps.Une nouvelle technique de programmation est introduite, permettant d'améliorer la vitesse de programmation des dispositifs et, dans le même temps, de réduire avec succès le phénomène de drift en résistance. Par ailleurs, un algorithme de programmation des PCM multi-bits est présenté. Un générateur d'impulsions fournissant des impulsions avec la tension souhaitée en sortie a été conçu et testé expérimentalement, répondant aux demandes de programmation d'une grande variété de matériaux innovants et en permettant la programmation précise et l’optimisation des performances des PCM

High-Density Solid-State Memory Devices and Technologies

This Special Issue aims to examine high-density solid-state memory devices and technologies from various standpoints in an attempt to foster their continuous success in the future. Considering that broadening of the range of applications will likely offer different types of solid-state memories their chance in the spotlight, the Special Issue is not focused on a specific storage solution but rather embraces all the most relevant solid-state memory devices and technologies currently on stage. Even the subjects dealt with in this Special Issue are widespread, ranging from process and design issues/innovations to the experimental and theoretical analysis of the operation and from the performance and reliability of memory devices and arrays to the exploitation of solid-state memories to pursue new computing paradigms

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Low-Power Design of Digital VLSI Circuits around the Point of First Failure

As an increase of intelligent and self-powered devices is forecasted for our future everyday life, the implementation of energy-autonomous devices that can wirelessly communicate data from sensors is crucial. Even though techniques such as voltage scaling proved to effectively reduce the energy consumption of digital circuits, additional energy savings are still required for a longer battery life. One of the main limitations of essentially any low-energy technique is the potential degradation of the quality of service (QoS). Thus, a thorough understanding of how circuits behave when operated around the point of first failure (PoFF) is key for the effective application of conventional energy-efficient methods as well as for the development of future low-energy techniques. In this thesis, a variety of circuits, techniques, and tools is described to reduce the energy consumption in digital systems when operated either in the safe and conservative exact region, close to the PoFF, or even inside the inexact region. A straightforward approach to reduce the power consumed by clock distribution while safely operating in the exact region is dual-edge-triggered (DET) clocking. However, the DET approach is rarely taken, primarily due to the perceived complexity of its integration. In this thesis, a fully automated design flow is introduced for applying DET clocking to a conventional single-edge-triggered (SET) design. In addition, the first static true-single-phase-clock DET flip-flop (DET-FF) that completely avoids clock-overlap hazards of DET registers is proposed. Even though the correct timing of synchronous circuits is ensured in worst-case conditions, the critical path might not always be excited. Thus, dynamic clock adjustment (DCA) has been proposed to trim any available dynamic timing margin by changing the operating clock frequency at runtime. This thesis describes a dynamically-adjustable clock generator (DCG) capable of modifying the period of the produced clock signal on a cycle-by-cycle basis that enables the DCA technique. In addition, a timing-monitoring sequential (TMS) that detects input transitions on either one of the clock phases to enable the selection of the best timing-monitoring strategy at runtime is proposed. Energy-quality scaling techniques aimat trading lower energy consumption for a small degradation on the QoS whenever approximations can be tolerated. In this thesis, a low-power methodology for the perturbation of baseline coefficients in reconfigurable finite impulse response (FIR) filters is proposed. The baseline coefficients are optimized to reduce the switching activity of the multipliers in the FIR filter, enabling the possibility of scaling the power consumption of the filter at runtime. The area as well as the leakage power of many system-on-chips is often dominated by embedded memories. Gain-cell embedded DRAM (GC-eDRAM) is a compact, low-power and CMOS-compatible alternative to the conventional static random-access memory (SRAM) when a higher memory density is desired. However, due to GC-eDRAMs relying on many interdependent variables, the adaptation of existing memories and the design of future GCeDRAMs prove to be highly complex tasks. Thus, the first modeling tool that estimates timing, memory availability, bandwidth, and area of GC-eDRAMs for a fast exploration of their design space is proposed in this thesis

ポータビリティを意識したCMOSミックスドシグナルVLSI回路設計手法に関する研究

本研究は、半導体上に集積されたアナログ・ディジタル・メモリ回路から構成されるミクストシグナルシステムを別の製造プロセスへ移行することをポーティングとして定義し、効率的なポーティングを行うための設計方式と自動回路合成アルゴリズムを提案し、いくつかの典型的な回路に対する設計事例を示し、提案手法の妥当性を立証している。北九州市立大

Low Power Memory/Memristor Devices and Systems

This reprint focusses on achieving low-power computation using memristive devices. The topic was designed as a convenient reference point: it contains a mix of techniques starting from the fundamental manufacturing of memristive devices all the way to applications such as physically unclonable functions, and also covers perspectives on, e.g., in-memory computing, which is inextricably linked with emerging memory devices such as memristors. Finally, the reprint contains a few articles representing how other communities (from typical CMOS design to photonics) are fighting on their own fronts in the quest towards low-power computation, as a comparison with the memristor literature. We hope that readers will enjoy discovering the articles within