Digital CMOS ISFET architectures and algorithmic methods for point-of-care diagnostics

Over the past decade, the surge of infectious diseases outbreaks across the globe is redefining how healthcare is provided and delivered to patients, with a clear trend towards distributed diagnosis at the Point-of-Care (PoC). In this context, Ion-Sensitive Field Effect Transistors (ISFETs) fabricated on standard CMOS technology have emerged as a promising solution to achieve a precise, deliverable and inexpensive platform that could be deployed worldwide to provide a rapid diagnosis of infectious diseases. This thesis presents advancements for the future of ISFET-based PoC diagnostic platforms, proposing and implementing a set of hardware and software methodologies to overcome its main challenges and enhance its sensing capabilities. The first part of this thesis focuses on novel hardware architectures that enable direct integration with computational capabilities while providing pixel programmability and adaptability required to overcome pressing challenges on ISFET-based PoC platforms. This section explores oscillator-based ISFET architectures, a set of sensing front-ends that encodes the chemical information on the duty cycle of a PWM signal. Two initial architectures are proposed and fabricated in AMS 0.35um, confirming multiple degrees of programmability and potential for multi-sensing. One of these architectures is optimised to create a dual-sensing pixel capable of sensing both temperature and chemical information on the same spatial point while modulating this information simultaneously on a single waveform. This dual-sensing capability, verified in silico using TSMC 0.18um process, is vital for DNA-based diagnosis where protocols such as LAMP or PCR require precise thermal control. The COVID-19 pandemic highlighted the need for a deliverable diagnosis that perform nucleic acid amplification tests at the PoC, requiring minimal footprint by integrating sensing and computational capabilities. In response to this challenge, a paradigm shift is proposed, advocating for integrating all elements of the portable diagnostic platform under a single piece of silicon, realising a ``Diagnosis-on-a-Chip". This approach is enabled by a novel Digital ISFET Pixel that integrates both ADC and memory with sensing elements on each pixel, enhancing its parallelism. Furthermore, this architecture removes the need for external instrumentation or memories and facilitates its integration with computational capabilities on-chip, such as the proposed ARM Cortex M3 system. These computational capabilities need to be complemented with software methods that enable sensing enhancement and new applications using ISFET arrays. The second part of this thesis is devoted to these methods. Leveraging the programmability capabilities available on oscillator-based architectures, various digital signal processing algorithms are implemented to overcome the most urgent ISFET non-idealities, such as trapped charge, drift and chemical noise. These methods enable fast trapped charge cancellation and enhanced dynamic range through real-time drift compensation, achieving over 36 hours of continuous monitoring without pixel saturation. Furthermore, the recent development of data-driven models and software methods open a wide range of opportunities for ISFET sensing and beyond. In the last section of this thesis, two examples of these opportunities are explored: the optimisation of image compression algorithms on chemical images generated by an ultra-high frame-rate ISFET array; and a proposed paradigm shift on surface Electromyography (sEMG) signals, moving from data-harvesting to information-focused sensing. These examples represent an initial step forward on a journey towards a new generation of miniaturised, precise and efficient sensors for PoC diagnostics.Open Acces

A survey of emerging architectural techniques for improving cache energy consumption

The search goes on for another ground breaking phenomenon to reduce the ever-increasing disparity between the CPU performance and storage. There are encouraging breakthroughs in enhancing CPU performance through fabrication technologies and changes in chip designs but not as much luck has been struck with regards to the computer storage resulting in material negative system performance. A lot of research effort has been put on finding techniques that can improve the energy efficiency of cache architectures. This work is a survey of energy saving techniques which are grouped on whether they save the dynamic energy, leakage energy or both. Needless to mention, the aim of this work is to compile a quick reference guide of energy saving techniques from 2013 to 2016 for engineers, researchers and students

Energy efficient hybrid computing systems using spin devices

Emerging spin-devices like magnetic tunnel junctions (MTJ\u27s), spin-valves and domain wall magnets (DWM) have opened new avenues for spin-based logic design. This work explored potential computing applications which can exploit such devices for higher energy-efficiency and performance. The proposed applications involve hybrid design schemes, where charge-based devices supplement the spin-devices, to gain large benefits at the system level. As an example, lateral spin valves (LSV) involve switching of nanomagnets using spin-polarized current injection through a metallic channel such as Cu. Such spin-torque based devices possess several interesting properties that can be exploited for ultra-low power computation. Analog characteristic of spin current facilitate non-Boolean computation like majority evaluation that can be used to model a neuron. The magneto-metallic neurons can operate at ultra-low terminal voltage of ∼20mV, thereby resulting in small computation power. Moreover, since nano-magnets inherently act as memory elements, these devices can facilitate integration of logic and memory in interesting ways. The spin based neurons can be integrated with CMOS and other emerging devices leading to different classes of neuromorphic/non-Von-Neumann architectures. The spin-based designs involve `mixed-mode\u27 processing and hence can provide very compact and ultra-low energy solutions for complex computation blocks, both digital as well as analog. Such low-power, hybrid designs can be suitable for various data processing applications like cognitive computing, associative memory, and currentmode on-chip global interconnects. Simulation results for these applications based on device-circuit co-simulation framework predict more than ∼100x improvement in computation energy as compared to state of the art CMOS design, for optimal spin-device parameters

Ultra-thin plasma nitrided oxide gate dielectrics for advanced MOS transistors

Ultra-thin plasma nitrided oxides have been optimized with the objective to decrease JG and maximize carrier mobility. It was found that while the base oxide cannot be aggressively scaled, plasma optimization yields better mobility thereby increase transistor performance. A summary of the EOT versus gate leakage current density of NMOS devices with plasma nitrided oxides is shown in Figure 5.19. EOT down to 1.2 nm has been achieved with a gate leakage current density of 40 A/cm2 at 1 V operating voltage

Simulation and Optimisation of SiGe MOSFETs

This research project is concerned with the development of methodology for simulating advanced SiGe MOSFETs using commercial simulators, the calibration of simulators against higher level Monte Carlo simulation results and real device measurements, and the application of simulation tools in the design of next generation p- channel devices. The methodology for the modelling and simulation of SiGe MOSFET devices is outlined. There are many simulation approaches widely used to simulate SiGe devices, such as Monte Carlo, hydrodynamic, energy transport, and drift diffusion. Different numerical techniques including finite difference, finite box and finite element methods, may be used in the simulators. The Si0.8Ge0.2 p-MOSFETs fabricated especially for high-field transport studies and the Si0.64Ge0.36 p-channel MOSFETs fabricated at Warwick and Southampton Universities with a CMOS compatible process in varying gate lengths were calibrated and investigated. Enhanced low field mobility in SiGe layers compared to Si control devices was observed. The results indicated that the potential of velocity overshoot effects for SiGe p-MOSFETs was considerably higher than Si counterparts, promising higher performance in the former at equal gate lengths at ultra-small devices. The effects of punchthrough stopper, undoped buffers and delta doping for SiGe p-MOSFETs were analysed systematically. It was found that the threshold voltage roll off might be reduced considerably by using an appropriate punchthrough stopper. In order to adjust the threshold voltage for digital CMOS applications, p-type delta doping was required for n+-polysilicon gate p-MOSFET. The use of delta doping made the threshold voltage roll off a more serious issue, therefore delta doping should be used with caution. The two-dimensional process simulator TSUPREM-4 and the two-dimensional device simulator MEDICI were employed to optimise and design Si/SiGe hybrid CMOS. The output of TSUPREM-4 was transferred automatically to the MEDICI device simulator. This made the simulation results more realistic. For devices at small gate length, lightly doped drain (LDD) structures were required. They would decrease the lateral subdiffusion and allow threshold voltage roll off to be minimised. These structures, however, would generally reduce drain current due to an increase in the series resistance of the drain region. Further consideration must be made of these trade-offs. Comparison between drift diffusion and hydrodynamic simulation results for SiGe p-MOSFETs were presented for the first time, with transport parameters extracted from our in-house full-band hole Monte Carlo transport simulator. It was shown that while drift diffusion and hydrodynamic simulations provided a reasonable estimation of the I-V characteristics for Si devices, the same could not be said for aggressively scaled SiGe devices. The resulting high fields at the source end of the devices meant that nonequilibrium transport effects were significant. Therefore for holes, models based on an isotropic carrier temperature were no longer appropriate, as it was shown by analysing the tensor components of the carrier temperature obtained from Monte Carlo simulation. Two-dimensional drift diffusion and Monte Carlo simulations of well-tempered Si p-MOSFETs with gate lengths of 25 and 50 nm were performed. By comparing Monte Carlo simulations with carefully calibrated drift diffusion results, it was found that nonequilibrium transport was important for understanding the high current device characteristics in sub 0.1 mum p-MOSFETs. The well-tempered devices showed better characteristics than the conventional SiGe devices. Both threshold voltage roll off and the subthreshold slope were acceptable although the effective channel length of this device was reduced from 50 nm to 25 nm. In order to adjust the threshold voltage for the digital CMOS applications, p-type delta doping was used for 50 nm well-tempered SiGe p- MOSFETs. As the delta doping made the threshold voltage roll off too serious, it was not suitable for 25 nm well-tempered SiGe p-MOSFETs

Stochastic-Based Computing with Emerging Spin-Based Device Technologies

In this dissertation, analog and emerging device physics is explored to provide a technology platform to design new bio-inspired system and novel architecture. With CMOS approaching the nano-scaling, their physics limits in feature size. Therefore, their physical device characteristics will pose severe challenges to constructing robust digital circuitry. Unlike transistor defects due to fabrication imperfection, quantum-related switching uncertainties will seriously increase their susceptibility to noise, thus rendering the traditional thinking and logic design techniques inadequate. Therefore, the trend of current research objectives is to create a non-Boolean high-level computational model and map it directly to the unique operational properties of new, power efficient, nanoscale devices. The focus of this research is based on two-fold: 1) Investigation of the physical hysteresis switching behaviors of domain wall device. We analyze phenomenon of domain wall device and identify hysteresis behavior with current range. We proposed the Domain-Wall-Motion-based (DWM) NCL circuit that achieves approximately 30x and 8x improvements in energy efficiency and chip layout area, respectively, over its equivalent CMOS design, while maintaining similar delay performance for a one bit full adder. 2) Investigation of the physical stochastic switching behaviors of Mag- netic Tunnel Junction (MTJ) device. With analyzing of stochastic switching behaviors of MTJ, we proposed an innovative stochastic-based architecture for implementing artificial neural network (S-ANN) with both magnetic tunneling junction (MTJ) and domain wall motion (DWM) devices, which enables efficient computing at an ultra-low voltage. For a well-known pattern recognition task, our mixed-model HSPICE simulation results have shown that a 34-neuron S-ANN implementation, when compared with its deterministic-based ANN counterparts implemented with digital and analog CMOS circuits, achieves more than 1.5 ~ 2 orders of magnitude lower energy consumption and 2 ~ 2.5 orders of magnitude less hidden layer chip area

A digital polar transmitter for multi-band OFDM Ultra-WideBand

Linear power amplifiers used to implement the Ultra-Wideband standard must be backed off from optimum power efficiency to meet the standard specifications and the power efficiency suffers. The problem of low efficiency can be mitigated by polar modulation. Digital polar architectures have been employed on numerous wireless standards like GSM, EDGE, and WLAN, where the fractional bandwidths achieved are only about 1%, and the power levels achieved are often in the vicinity of 20 dBm. Can the architecture be employed on wireless standards with low-power and high fractional bandwidth requirements and yet achieve good power efficiency? To answer these question, this thesis studies the application of a digital polar transmitter architecture with parallel amplifier stages for UWB. The concept of the digital transmitter is motivated and inspired by three factors. First, unrelenting advances in the CMOS technology in deep-submicron process and the prevalence of low-cost Digital Signal processing have resulted in the realization of higher level of integration using digitally intensive approaches. Furthermore, the architecture is an evolution of polar modulation, which is known for high power efficiency in other wireless applications. Finally, the architecture is operated as a digital-to-analog converter which circumvents the use of converters in conventional transmitters. Modeling and simulation of the system architecture is performed on the Agilent Advanced Design System Ptolemy simulation platform. First, by studying the envelope signal, we found that envelope clipping results in a reduction in the peak-to-average power ratio which in turn improves the error vector magnitude performance (figure of merit for the study). In addition, we have demonstrated that a resolution of three bits suffices for the digital polar transmitter when envelope clipping is performed. Next, this thesis covers a theoretical derivation for the estimate of the error vector magnitude based on the resolution, quantization and phase noise errors. An analysis on the process variations - which result in gain and delay mismatches - for a digital transmitter architecture with four bits ensues. The above studies allow RF designers to estimate the number of bits required and the amount of distortion that can be tolerated in the system. Next, a study on the circuit implementation was conducted. A DPA that comprises 7 parallel RF amplifiers driven by a constant RF phase-modulated signal and 7 cascode transistors (individually connected in series with the bottom amplifiers) digitally controlled by a 3-bit digitized envelope signal to reconstruct the UWB signal at the output. Through the use of NFET models from the IBM 130-nm technology, our simulation reveals that our DPA is able to achieve an EVM of - 22 dB. The DPA simulations have been performed at 3.432 GHz centre frequency with a channel bandwidth of 528 MHz, which translates to a fractional bandwidth of 15.4%. Drain efficiencies of 13.2/19.5/21.0% have been obtained while delivering -1.9/2.5/5.5 dBm of output power and consuming 5/9/17 mW of power. In addition, we performed a yield analysis on the digital polar amplifier, based on unit-weighted and binary-weighted architecture, when gain variations are introduced in all the individual stages. The dynamic element matching method is also introduced for the unit-weighted digital polar transmitter. Monte Carlo simulations reveal that when the gain of the amplifiers are allowed to vary at a mean of 1 with a standard deviation of 0.2, the binary-weighted architecture obtained a yield of 79%, while the yields of the unit-weighted architectures are in the neighbourhood of 95%. Moreover, the dynamic element matching technique demonstrates an improvement in the yield by approximately 3%. Finally, a hardware implementation for this architecture based on software-defined arbitrary waveform generators is studied. In this section, we demonstrate that the error vector magnitude results obtained with a four-stage binary-weighted digital polar transmitter under ideal combining conditions fulfill the European Computer Manufacturers Association requirements. The proposed experimental setup, believed to be the first ever attempted, confirm the feasibility of a digital polar transmitter architecture for Ultra-Wideband. In addition, we propose a number of power combining techniques suitable for the hardware implementation. Spatial power combining, in particular, shows a high potential for the digital polar transmitter architecture. The above studies demonstrate the feasibility of the digital polar architecture with good power efficiency for a wideband wireless standard with low-power and high fractional bandwidth requirements

MEMS for Photonic Integrated Circuits

The field of microelectromechanical Systems (MEMS) for photonic integrated circuits (PICs) is reviewed. This field leverages mechanics at the nanometer to micrometer scale to improve existing components and introduce novel functionalities in PICs. This review covers the MEMS actuation principles and the mechanical tuning mechanisms for integrated photonics. The state of the art of MEMS tunable components in PICs is quantitatively reviewed and critically assessed with respect to suitability for large-scale integration in existing PIC technology platforms. MEMS provide a powerful approach to overcome current limitations in PIC technologies and to enable a new design dimension with a wide range of applications