Testability and redundancy techniques for improved yield and reliability of CMOS VLSI circuits

The research presented in this thesis is concerned with the design of fault-tolerant integrated circuits as a contribution to the design of fault-tolerant systems. The economical manufacture of very large area ICs will necessitate the incorporation of fault-tolerance features which are routinely employed in current high density dynamic random access memories. Furthermore, the growing use of ICs in safety-critical applications and/or hostile environments in addition to the prospect of single-chip systems will mandate the use of fault-tolerance for improved reliability. A fault-tolerant IC must be able to detect and correct all possible faults that may affect its operation. The ability of a chip to detect its own faults is not only necessary for fault-tolerance, but it is also regarded as the ultimate solution to the problem of testing. Off-line periodic testing is selected for this research because it achieves better coverage of physical faults and it requires less extra hardware than on-line error detection techniques. Tests for CMOS stuck-open faults are shown to detect all other faults. Simple test sequence generation procedures for the detection of all faults are derived. The test sequences generated by these procedures produce a trivial output, thereby, greatly simplifying the task of test response analysis. A further advantage of the proposed test generation procedures is that they do not require the enumeration of faults. The implementation of built-in self-test is considered and it is shown that the hardware overhead is comparable to that associated with pseudo-random and pseudo-exhaustive techniques while achieving a much higher fault coverage through-the use of the proposed test generation procedures. The consideration of the problem of testing the test circuitry led to the conclusion that complete test coverage may be achieved if separate chips cooperate in testing each other's untested parts. An alternative approach towards complete test coverage would be to design the test circuitry so that it is as distributed as possible and so that it is tested as it performs its function. Fault correction relies on the provision of spare units and a means of reconfiguring the circuit so that the faulty units are discarded. This raises the question of what is the optimum size of a unit? A mathematical model, linking yield and reliability is therefore developed to answer such a question and also to study the effects of such parameters as the amount of redundancy, the size of the additional circuitry required for testing and reconfiguration, and the effect of periodic testing on reliability. The stringent requirement on the size of the reconfiguration logic is illustrated by the application of the model to a typical example. Another important result concerns the effect of periodic testing on reliability. It is shown that periodic off-line testing can achieve approximately the same level of reliability as on-line testing, even when the time between tests is many hundreds of hours

VLSI Testing and Test Power

This paper first reviews the basics of VLSI testing, focusing on test generation and design for testability. Then it discusses the impact of test power in scan testing, and highlights the need for low-power VLSI testing.2011 International Green Computing Conference and Workshops (IGCC 2011), July 25-28, 2011, Orlando, FL, US

Investigation into voltage and process variation-aware manufacturing test

Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality. The focus is on logic testing of static CMOS designs with respect to two important defect types in deep submicron CMOS: resistive bridges and full opens. The first part of the thesis addresses testing for resistive bridge defects in designs with multiple supply voltage settings. To enable analysis, a fault simulator is developed using a supply voltage-aware model for bridge defect behaviour. The analysis shows that for high defect coverage it is necessary to perform test for more than one supply voltage setting, due to supply voltage-dependent behaviour. A low-cost and effective test method is presented consisting of multi-voltage test generation that achieves high defect coverage and test set size reduction without compromise to defect coverage. Experiments on synthesised benchmarks with realistic bridge locations validate the proposed method.The second part focuses on the behaviour of full open defects under supply voltage variation. The aim is to determine the appropriate value of supply voltage to use when testing. Two models are considered for the behaviour of full open defects with and without gate tunnelling leakage influence. Analysis of the supply voltage-dependent behaviour of full open defects is performed to determine if it is required to test using more than one supply voltage to detect all full open defects. Experiments on synthesised benchmarks using an extended version of the fault simulator tool mentioned above, measure the quantitative impact of supply voltage variation on defect coverage.The final part studies the impact of process variation on the behaviour of bridge defects. Detailed analysis using synthesised ISCAS benchmarks and realistic bridge model shows that process variation leads to additional faults. If process variation is not considered in test generation, the test will fail to detect some of these faults, which leads to test escapes. A novel metric to quantify the impact of process variation on test quality is employed in the development of a new test generation tool, which achieves high bridge defect coverage. The method achieves a user-specified test quality with test sets which are smaller than test sets generated without consideration of process variation

Genetic algorithm as self-test path and circular self-test path design method

The paper presents the use of Genetic Algorithm to search for non-linear Autonomous Test Structures (ATS) in Built-In Testing approach. Such structures can include essentially STP and CSTP and their modifications. Non-linear structures are more difficult to analyze than the widely used structures such as independent Test Pattern Generator and the Test Response Compactor realized by Linear Feedback Shift Registers. To reduce time-consuming test simulation of sequential circuit, it was used an approach based on the stochastic model of pseudo-random testing. The use of stochastic model significantly affects the time effectiveness of the search for evolutionary autonomous structures. In test simulation procedure, the block of sequential circuit memory is not disconnected. This approach does not require a special selection of memory registers such as BILBOs. A series of studies to test circuits set ISCAS’89 are made. The results of the study are very promising

Exploiting Don\u27t Cares to Enhance Functional Tests

In simulation based design verification, deterministic or pseudo-random tests are used to check functional correctness of a design. In this paper we present a technique generating tests by specifying the don’t care inputs in the functional specifications so as to improve their coverage of both design errors and manufacturing faults. The don’t cares are chosen to maximize sensitization of signals in the circuit. The tests generated in this way require only a fraction of pseudo-exhaustive test patterns to achieve a high multiplicity of fault coverage

Secure Split Test for Preventing IC Piracy by Un-Trusted Foundry and Assembly

In the era of globalization, integrated circuit design and manufacturing is spread across different continents. This has posed several hardware intrinsic security issues. The issues are related to overproduction of chips without knowledge of designer or OEM, insertion of hardware Trojans at design and fabrication phase, faulty chips getting into markets from test centers, etc. In this thesis work, we have addressed the problem of counterfeit IC‟s getting into the market through test centers. The problem of counterfeit IC has different dimensions. Each problem related to counterfeiting has different solutions. Overbuilding of chips at overseas foundry can be addressed using passive or active metering. The solution to avoid faulty chips getting into open markets from overseas test centers is secure split test (SST). The further improvement to SST is also proposed by other researchers and is known as Connecticut Secure Split Test (CSST). In this work, we focus on improvements to CSST techniques in terms of security, test time and area. In this direction, we have designed all the required sub-blocks required for CSST architecture, namely, RSA, TRNG, Scrambler block, study of benchmark circuits like S38417, adding scan chains to benchmarks is done. Further, as a security measure, we add, XOR gate at the output of the scan chains to obfuscate the signal coming out of the scan chains. Further, we have improved the security of the design by using the PUF circuit instead of TRNG and avoid the use of the memory circuits. This use of PUF not only eliminates the use of memory circuits, but also it provides the way for functional testing also. We have carried out the hamming distance analysis for introduced security measure and results show that security design is reasonably good.Further, as a future work we can focus on: • Developing the circuit which is secuered for the whole semiconductor supply chain with reasonable hamming distance and less area overhead

Evolution of Test Programs Exploiting a FSM Processor Model

Microprocessor testing is becoming a challenging task, due to the increasing complexity of modern architectures. Nowadays, most architectures are tackled with a combination of scan chains and Software-Based Self-Test (SBST) methodologies. Among SBST techniques, evolutionary feedback-based ones prove effective in microprocessor testing: their main disadvantage, however, is the considerable time required to generate suitable test programs. A novel evolutionary-based approach, able to appreciably reduce the generation time, is presented. The proposed method exploits a high-level representation of the architecture under test and a dynamically built Finite State Machine (FSM) model to assess fault coverage without resorting to time-expensive simulations on low-level models. Experimental results, performed on an OpenRISC processor, show that the resulting test obtains a nearly complete fault coverage against the targeted fault mode

Test and Diagnosis of Integrated Circuits

The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users, the manufacturing process is becoming finer and denser, making chips more prone to defects.The work presented in the HDR manuscript addresses the challenges of test and diagnosis of integrated circuits. It covers:- Power aware test;- Test of Low Power Devices;- Fault Diagnosis of digital circuits