Course grained low power design flow using UPF

Increased system complexity has led to the substitution of the traditional bottom-up design flow by systematic hierarchical design flow. The main motivation behind the evolution of such an approach is the increasing difficulty in hardware realization of complex systems. With decreasing channel lengths, few key problems such as timing closure, design sign-off, routing complexity, signal integrity, and power dissipation arise in the design flows. Specifically, minimizing power dissipation is critical in several high-end processors. In high-end processors, the design complexity contributes to the overall dynamic power while the decreasing transistor size results in static power dissipation. This research aims at optimizing the design flow for power and timing using the unified power format (UPF). UPF provides a strategic format to specify power-aware design information at every stage in the flow. The low power reduction techniques enforced in this research are multi-voltage, multi-threshold voltage (Vth), and power gating with state retention. An inherent design challenge addressed in this research is the choice of power optimization techniques as the flow advances from synthesis to physical design. A top-down digital design flow for a 32 bit MIPS RISC processor has been implemented with and without UPF synthesis flow for 65nm technology. The UPF synthesis is implemented with two voltages, 1.08V and 0.864V (Multi-VDD). Area, power and timing metrics are analyzed for the flows developed. Power savings of about 20 % are achieved in the design flow with \u27multi-threshold\u27 power technique compared to that of the design flow with no low power techniques employed. Similarly, 30 % power savings are achieved in the design flow with the UPF implemented when compared to that of the design flow with \u27multi-threshold\u27 power technique employed. Thus, a cumulative power savings of 42% has been achieved in a complete power efficient design flow (UPF) compared to that of the generic top-down standard flow with no power saving techniques employed. This is substantiated by the low voltage operation of modules in the design, reduction in clock switching power by gating clocks in the design and extensive use of HVT and LVT standard cells for implementation. The UPF synthesis flow saw the worst timing slack and more area when compared to those of the `multi-threshold\u27 or the generic flow. Percentage increase in the area with UPF is approximately 15%; a significant source for this increase being the additional power controlling logic added

Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

A Multiple-objective ILP based Global Routing Approach for VLSI ASIC Design

A VLSI chip can today contain hundreds of millions transistors and is expected to contain more than 1 billion transistors in the next decade. In order to handle this rapid growth in integration technology, the design procedure is therefore divided into a sequence of design steps. Circuit layout is the design step in which a physical realization of a circuit is obtained from its functional description. Global routing is one of the key subproblems of the circuit layout which involves finding an approximate path for the wires connecting the elements of the circuit without violating resource constraints. The global routing problem is NP-hard, therefore, heuristics capable of producing high quality routes with little computational effort are required as we move into the Deep Sub-Micron (DSM) regime. In this thesis, different approaches for global routing problem are first reviewed. The advantages and disadvantages of these approaches are also summarized. According to this literature review, several mathematical programming based global routing models are fully investigated. Quality of solution obtained by these models are then compared with traditional Maze routing technique. The experimental results show that the proposed model can optimize several global routing objectives simultaneously and effectively. Also, it is easy to incorporate new objectives into the proposed global routing model. To speedup the computation time of the proposed ILP based global router, several hierarchical methods are combined with the flat ILP based global routing approach. The experimental results indicate that the bottom-up global routing method can reduce the computation time effectively with a slight increase of maximum routing density. In addition to wire area, routability, and vias, performance and low power are also important goals in global routing, especially in deep submicron designs. Previous efforts that focused on power optimization for global routing are hindered by excessively long run times or the routing of a subset of the nets. Accordingly, a power efficient multi-pin global routing technique (PIRT) is proposed in this thesis. This integer linear programming based techniques strives to find a power efficient global routing solution. The results indicate that an average power savings as high as 32\% for the 130-nm technology can be achieved with no impact on the maximum chip frequency

Experimental Evaluation and Comparison of Time-Multiplexed Multi-FPGA Routing Architectures

Emulating large complex designs require multi-FPGA systems (MFS). However, inter-FPGA communication is confronted by the challenge of lack of interconnect capacity due to limited number of FPGA input/output (I/O) pins. Serializing parallel signals onto a single trace effectively addresses the limited I/O pin obstacle. Besides the multiplexing scheme and multiplexing ratio (number of inter-FPGA signals per trace), the choice of the MFS routing architecture also affect the critical path latency. The routing architecture of an MFS is the interconnection pattern of FPGAs, fixed wires and/or programmable interconnect chips. Performance of existing MFS routing architectures is also limited by off-chip interface selection. In this dissertation we proposed novel 2D and 3D latency-optimized time-multiplexed MFS routing architectures. We used rigorous experimental approach and real sequential benchmark circuits to evaluate and compare the proposed and existing MFS routing architectures. This research provides a new insight into the encouraging effects of using off-chip optical interface and three dimensional MFS routing architectures. The vertical stacking results in shorter off-chip links improving the overall system frequency with the additional advantage of smaller footprint area. The proposed 3D architectures employed serialized interconnect between intra-plane and inter-plane FPGAs to address the pin limitation problem. Additionally, all off-chip links are replaced by optical fibers that exhibited latency improvement and resulted in faster MFS. Results indicated that exploiting third dimension provided latency and area improvements as compared to 2D MFS. We also proposed latency-optimized planar 2D MFS architectures in which electrical interconnections are replaced by optical interface in same spatial distribution. Performance evaluation and comparison showed that the proposed architectures have reduced critical path delay and system frequency improvement as compared to conventional MFS. We also experimentally evaluated and compared the system performance of three inter-FPGA communication schemes i.e. Logic Multiplexing, SERDES and MGT in conjunction with two routing architectures i.e. Completely Connected Graph (CCG) and TORUS. Experimental results showed that SERDES attained maximum frequency than the other two schemes. However, for very high multiplexing ratios, the performance of SERDES & MGT became comparable

Multilayer Modeling and Design of Energy Managed Microsystems

Aggressive energy reduction is one of the key technological challenges that all segments of the semiconductor industry have encountered in the past few years. In addition, the notion of environmental awareness and designing “green” products is yet another major driver for ultra low energy design of electronic systems. Energy management is one of the unique solutions that can address the simultaneous requirements of high-performance, (ultra) low energy and greenness in many classes of computing systems; including high-performance, embedded and wireless. These considerations motivate the focus of this dissertation on the energy efficiency improvement of Energy Managed Microsystems (EMM or EM2). The aim is to maximize the energy efficiency and/or the operational lifetime of these systems. In this thesis we propose solutions that are applicable to many classes of computing systems including high-performance and mobile computing systems. These solutions contribute to make such technologies “greener”. The proposed solutions are multilayer, since they belong to, and may be applicable to, multiple design abstraction layers. The proposed solutions are orthogonal to each other, and if deployed simultaneously in a vertical system integration approach, when possible, the net benefit may be as large as the multiplication of the individual benefits. At high-level, this thesis initially focuses on the modeling and design of interconnections for EM2. For this purpose, a design flow has been proposed for interconnections in EM2. This flow allows designing interconnects with minimum energy requirements that meet all the considered performance objectives, in all specified system operating states. Later, models for energy performance estimation of EM2 are proposed. By energy performance, we refer to the improvements of energy savings of the computing platforms, obtained when some enhancements are applied to those platforms. These models are based on the components of the application profile. The adopted method is inspired by Amdahl’s law, which is driven by the fact that ‘energy’ is ‘additive’, as ‘time’ is ‘additive’. These models can be used for the design space exploration of EM2. The proposed models are high-level and therefore they are easy to use and show fair accuracy, 9.1% error on average, when compared to the results of the implemented benchmarks. Finally, models to estimate energy consumption of EM2 according to their “activity” are proposed. By “activity” we mean the rate at which EM2 perform a set of predefined application functions. Good estimations of energy requirements are very useful when designing and managing the EM2 activity, in order to extend their battery lifetime. The study of the proposed models on some Wireless Sensor Network (WSN) application benchmark confirms a fair accuracy for the energy estimation models, 3% error on average on the considered benchmarks

Energy consumption in networks on chip : efficiency and scaling

Computer architecture design is in a new era where performance is increased by replicating processing cores on a chip rather than making CPUs larger and faster. This design strategy is motivated by the superior energy efficiency of the multi-core architecture compared to the traditional monolithic CPU. If the trend continues as expected, the number of cores on a chip is predicted to grow exponentially over time as the density of transistors on a die increases. A major challenge to the efficiency of multi-core chips is the energy used for communication among cores over a Network on Chip (NoC). As the number of cores increases, this energy also increases, imposing serious constraints on design and performance of both applications and architectures. Therefore, understanding the impact of different design choices on NoC power and energy consumption is crucial to the success of the multi- and many-core designs. This dissertation proposes methods for modeling and optimizing energy consumption in multi- and many-core chips, with special focus on the energy used for communication on the NoC. We present a number of tools and models to optimize energy consumption and model its scaling behavior as the number of cores increases. We use synthetic traffic patterns and full system simulations to test and validate our methods. Finally, we take a step back and look at the evolution of computer hardware in the last 40 years and, using a scaling theory from biology, present a predictive theory for power-performance scaling in microprocessor systems