Phase Locked Loop Test Methodology

Phase locked loops are incorporated into almost every large-scale mixed signal and digital system on chip (SOC). Various types of PLL architectures exist including fully analogue, fully digital, semi-digital, and software based. Currently the most commonly used PLL architecture for SOC environments and chipset applications is the Charge-Pump (CP) semi-digital type. This architecture is commonly used for clock synthesis applications, such as the supply of a high frequency on-chip clock, which is derived from a low frequency board level clock. In addition, CP-PLL architectures are now frequently used for demanding RF (Radio Frequency) synthesis, and data synchronization applications. On chip system blocks that rely on correct PLL operation may include third party IP cores, ADCs, DACs and user defined logic (UDL). Basically, any on-chip function that requires a stable clock will be reliant on correct PLL operation. As a direct consequence it is essential that the PLL function is reliably verified during both the design and debug phase and through production testing. This chapter focuses on test approaches related to embedded CP-PLLs used for the purpose of clock generation for SOC. However, methods discussed will generally apply to CP-PLLs used for other applications

Investigation into voltage and process variation-aware manufacturing test

Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality. The focus is on logic testing of static CMOS designs with respect to two important defect types in deep submicron CMOS: resistive bridges and full opens. The first part of the thesis addresses testing for resistive bridge defects in designs with multiple supply voltage settings. To enable analysis, a fault simulator is developed using a supply voltage-aware model for bridge defect behaviour. The analysis shows that for high defect coverage it is necessary to perform test for more than one supply voltage setting, due to supply voltage-dependent behaviour. A low-cost and effective test method is presented consisting of multi-voltage test generation that achieves high defect coverage and test set size reduction without compromise to defect coverage. Experiments on synthesised benchmarks with realistic bridge locations validate the proposed method.The second part focuses on the behaviour of full open defects under supply voltage variation. The aim is to determine the appropriate value of supply voltage to use when testing. Two models are considered for the behaviour of full open defects with and without gate tunnelling leakage influence. Analysis of the supply voltage-dependent behaviour of full open defects is performed to determine if it is required to test using more than one supply voltage to detect all full open defects. Experiments on synthesised benchmarks using an extended version of the fault simulator tool mentioned above, measure the quantitative impact of supply voltage variation on defect coverage.The final part studies the impact of process variation on the behaviour of bridge defects. Detailed analysis using synthesised ISCAS benchmarks and realistic bridge model shows that process variation leads to additional faults. If process variation is not considered in test generation, the test will fail to detect some of these faults, which leads to test escapes. A novel metric to quantify the impact of process variation on test quality is employed in the development of a new test generation tool, which achieves high bridge defect coverage. The method achieves a user-specified test quality with test sets which are smaller than test sets generated without consideration of process variation

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

Constraint-driven RF test stimulus generation and built-in test

With the explosive growth in wireless applications, the last decade witnessed an ever-increasing test challenge for radio frequency (RF) circuits. While the design community has pushed the envelope far into the future, by expanding CMOS process to be used with high-frequency wireless devices, test methodology has not advanced at the same pace. Consequently, testing such devices has become a major bottleneck in high-volume production, further driven by the growing need for tighter quality control. RF devices undergo testing during the prototype phase and during high-volume manufacturing (HVM). The benchtop test equipment used throughout prototyping is very precise yet specialized for a subset of functionalities. HVM calls for a different kind of test paradigm that emphasizes throughput and sufficiency, during which the projected performance parameters are measured one by one for each device by automated test equipment (ATE) and compared against defined limits called specifications. The set of tests required for each product differs greatly in terms of the equipment required and the time taken to test individual devices. Together with signal integrity, precision, and repeatability concerns, the initial cost of RF ATE is prohibitively high. As more functionality and protocols are integrated into a single RF device, the required number of specifications to be tested also increases, adding to the overall cost of testing, both in terms of the initial and recurring operating costs. In addition to the cost problem, RF testing proposes another challenge when these components are integrated into package-level system solutions. In systems-on-packages (SOP), the test problems resulting from signal integrity, input/output bandwidth (IO), and limited controllability and observability have initiated a paradigm shift in high-speed analog testing, favoring alternative approaches such as built-in tests (BIT) where the test functionality is brought into the package. This scheme can make use of a low-cost external tester connected through a low-bandwidth link in order to perform demanding response evaluations, as well as make use of the analog-to-digital converters and the digital signal processors available in the package to facilitate testing. Although research on analog built-in test has demonstrated hardware solutions for single specifications, the paradigm shift calls for a rather general approach in which a single methodology can be applied across different devices, and multiple specifications can be verified through a single test hardware unit, minimizing the area overhead. Specification-based alternate test methodology provides a suitable and flexible platform for handling the challenges addressed above. In this thesis, a framework that integrates ATE and system constraints into test stimulus generation and test response extraction is presented for the efficient production testing of high-performance RF devices using specification-based alternate tests. The main components of the presented framework are as follows: Constraint-driven RF alternate test stimulus generation: An automated test stimulus generation algorithm for RF devices that are evaluated by a specification-based alternate test solution is developed. The high-level models of the test signal path define constraints in the search space of the optimized test stimulus. These models are generated in enough detail such that they inherently define limitations of the low-cost ATE and the I/O restrictions of the device under test (DUT), yet they are simple enough that the non-linear optimization problem can be solved empirically in a reasonable amount of time. Feature extractors for BIT: A methodology for the built-in testing of RF devices integrated into SOPs is developed using additional hardware components. These hardware components correlate the high-bandwidth test response to low bandwidth signatures while extracting the test-critical features of the DUT. Supervised learning is used to map these extracted features, which otherwise are too complicated to decipher by plain mathematical analysis, into the specifications under test. Defect-based alternate testing of RF circuits: A methodology for the efficient testing of RF devices with low-cost defect-based alternate tests is developed. The signature of the DUT is probabilistically compared with a class of defect-free device signatures to explore possible corners under acceptable levels of process parameter variations. Such a defect filter applies discrimination rules generated by a supervised classifier and eliminates the need for a library of possible catastrophic defects.Ph.D.Committee Chair: Chatterjee, Abhijit; Committee Member: Durgin, Greg; Committee Member: Keezer, David; Committee Member: Milor, Linda; Committee Member: Sitaraman, Sures

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Null Convention Logic applications of asynchronous design in nanotechnology and cryptographic security

This dissertation presents two Null Convention Logic (NCL) applications of asynchronous logic circuit design in nanotechnology and cryptographic security. The first application is the Asynchronous Nanowire Reconfigurable Crossbar Architecture (ANRCA); the second one is an asynchronous S-Box design for cryptographic system against Side-Channel Attacks (SCA). The following are the contributions of the first application: 1) Proposed a diode- and resistor-based ANRCA (DR-ANRCA). Three configurable logic block (CLB) structures were designed to efficiently reconfigure a given DR-PGMB as one of the 27 arbitrary NCL threshold gates. A hierarchical architecture was also proposed to implement the higher level logic that requires a large number of DR-PGMBs, such as multiple-bit NCL registers. 2) Proposed a memristor look-up-table based ANRCA (MLUT-ANRCA). An equivalent circuit simulation model has been presented in VHDL and simulated in Quartus II. Meanwhile, the comparison between these two ANRCAs have been analyzed numerically. 3) Presented the defect-tolerance and repair strategies for both DR-ANRCA and MLUT-ANRCA. The following are the contributions of the second application: 1) Designed an NCL based S-Box for Advanced Encryption Standard (AES). Functional verification has been done using Modelsim and Field-Programmable Gate Array (FPGA). 2) Implemented two different power analysis attacks on both NCL S-Box and conventional synchronous S-Box. 3) Developed a novel approach based on stochastic logics to enhance the resistance against DPA and CPA attacks. The functionality of the proposed design has been verified using an 8-bit AES S-box design. The effects of decision weight, bitstream length, and input repetition times on error rates have been also studied. Experimental results shows that the proposed approach enhances the resistance to against the CPA attack by successfully protecting the hidden key --Abstract, page iii

Efficient verification/testing of system-on-chip through fault grading and analog behavioral modeling

textThis dissertation presents several cost-effective production test solutions using fault grading and mixed-signal design verification cases enabled by analog behavioral modeling. Although the latest System-on-Chip (SOC) is getting denser, faster, and more complex, the manufacturing technology is dominated by subtle defects that are introduced by small-scale technology. Thus, SOC requires more mature testing strategies. By performing various types of testing, better quality SoC can be manufactured, but test resources are too limited to accommodate all those tests. To create the most efficient production test flow, any redundant or ineffective tests need to be removed or minimized. Chapter 3 proposes new method of test data volume reduction by combining the nonlinear property of feedback shift register (FSR) and dictionary coding. Instead of using the nonlinear FSR for actual hardware implementation, the expanded test set by nonlinear expansion is used as the one-column test sets and provides big reduction ratio for the test data volume. The experimental results show the combined method reduced the total test data volume and increased the fault coverage. Due to the increased number of test patterns, total test time is increased. Chapter 4 addresses a whole process of functional fault grading. Fault grading has always been a ”desire-to-have” flow because it can bring up significant value for cost saving and yield analysis. However, it is very hard to perform the fault grading on the complex large scale SOC. A commercial tool called Z01X is used as a fault grading platform, and whole fault grading process is coordinated and each detailed execution is performed. Simulation- based functional fault grading identifies the quality of the given functional tests against the static faults and transition delay faults. With the structural tests and functional tests, functional fault grading can indicate the way to achieve the same test coverage by spending minimal test time. Compared to the consumed time and resource for fault grading, the contribution to the test time saving might not be acceptable as very promising, but the fault grading data can be reused for yield analysis and test flow optimization. For the final production testing, confident decisions on the functional test selection can be made based on the fault grading results. Chapter 5 addresses the challenges of Package-on-Package (POP) testing. Because POP devices have pins on both the top and the bottom of the package, the increased test pins require more test channels to detect packaging defects. Boundary scan chain testing is used to detect those continuity defects by relying on leakage current from the power supply. This proposed test scheme does not require direct test channels on the top pins. Based on the counting algorithm, minimal numbers of test cycles are generated, and the test achieved full test coverage for any combinations of pin-to-pin shortage defects on the top pins of the POP package. The experimental results show about 10 times increased leakage current from the shorted defect. Also, it can be expanded to multi-site testing with less test channels for high-volume production. Fault grading is applied within different structural test categories in Chapter 6. Stuck-at faults can be considered as TDFs having infinite delay. Hence, the TDF Automatic Test Pattern Generation (ATPG) tests can detect both TDFs and stuck-at faults. By removing the stuck-at faults being detected by the given TDF ATPG tests, the tests that target stuck-at faults can be reduced, and the reduced stuck-at fault set results in fewer stuck-at ATPG patterns. The structural test time is reduced while keeping the same test coverage. This TDF grading is performed with the same ATPG tool used to generate the stuck-at and TDF ATPG tests. To expedite the mixed-signal design verification of complex SoC, analog behavioral modeling methods and strategies are addressed in Chapter 7 and case studies for detailed verification with actual mixed-signal design are ad- dressed in Chapter 8. Analog modeling effort can enhance verification quality for a mixed-signal design with less turnaround time, and it enables compatible integration of the mixed-signal design cores into the SoC. The modeling process may reveal any potential design errors or incorrect testbench setup, and it results in minimizing unnecessary debugging time for quality devices. Two mixed-signal design cases were verified by me using the analog models. A fully hierarchical digital-to-analog converter (DAC) model is implemented and silicon mismatches caused by process variation are modeled and inserted into the DAC model, and the calibration algorithm for the DAC is successfully verified by model-based simulation at the full DAC-level. When the mismatch amount is increased and exceeded the calibration capability of the DAC, the simulation results show the increased calibration error with some outliers. This verification method can identify the saturation range of the DAC and predict the yield of the devices from process variation. A phase-locked loop (PLL) design cases were also verified by me using the analog model. Both open-loop PLL model and closed-loop PLL model cases are presented. Quick bring-up of open-loop PLL model provides low simulation overhead for widely-used PLLs in the SOC and enables early starting of design verification for the upper-level design using the PLL generated clocks. Accurate closed-loop PLL model is implemented for DCO-based PLL design, and the mixed-simulation with analog models and schematic designs enables flexible analog verification. Only focused analog design block is set to the schematic design and the rest of the analog design is replaced by the analog model. Then, this scaled-down SPICE simulation is performed about 10 times to 100 times faster than full-scale SPICE simulation. The analog model of the focused block is compared with the scaled-down SPICE simulation result and the quality of the model is iteratively enhanced. Hence, the analog model enables both compatible integration and flexible analog design verification. This dissertation contributes to reduce test time and to enhance test quality, and helps to set up efficient production testing flows. Depending on the size and performance of CUT, proper testing schemes can maximize the efficiency of production testing. The topics covered in this dissertation can be used in optimizing the test flow and selecting the final production tests to achieve maximum test capability. In addition, the strategies and benefits of analog behavioral modeling techniques that I implemented are presented, and actual verification cases shows the effectiveness of analog modeling for better quality SoC products.Electrical and Computer Engineerin

The 1992 4th NASA SERC Symposium on VLSI Design

Papers from the fourth annual NASA Symposium on VLSI Design, co-sponsored by the IEEE, are presented. Each year this symposium is organized by the NASA Space Engineering Research Center (SERC) at the University of Idaho and is held in conjunction with a quarterly meeting of the NASA Data System Technology Working Group (DSTWG). One task of the DSTWG is to develop new electronic technologies that will meet next generation electronic data system needs. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The NASA SERC is proud to offer, at its fourth symposium on VLSI design, presentations by an outstanding set of individuals from national laboratories, the electronics industry, and universities. These speakers share insights into next generation advances that will serve as a basis for future VLSI design

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important