16,464 research outputs found

    Adaptive Latency Insensitive Protocols andElastic Circuits with Early Evaluation: A Comparative Analysis

    Get PDF
    AbstractLatency Insensitive Protocols (LIP) and Elastic Circuits (EC) solve the same problem of rendering a design tolerant to additional latencies caused by wires or computational elements. They are performance-limited by a firing semantics that enforces coherency through a lazy evaluation rule: Computation is enabled if all inputs to a block are simultaneously available. Adaptive LIP's (ALIP) and EC with early evaluation (ECEE) increase the performance by relaxing the evaluation rule: Computation is enabled as soon as the subset of inputs needed at a given time is available. Their difference in terms of implementation and behavior in selected cases justifies the need for the comparative analysis reported in this paper. Results have been obtained through simple examples, a single representative case-study already used in the context of both LIP's and EC and through extensive simulations over a suite of benchmarks

    Adaptive Latency Insensitive Protocols

    Get PDF
    Latency-insensitive design copes with excessive delays typical of global wires in current and future IC technologies. It achieves its goal via encapsulation of synchronous logic blocks in wrappers that communicate through a latency-insensitive protocol (LIP) and pipelined interconnects. Previously proposed solutions suffer from an excessive performance penalty in terms of throughput or from a lack of generality. This article presents an adaptive LIP that outperforms previous static implementations, as demonstrated by two relevant cases — a microprocessor and an MPEG encoder — whose components we made insensitive to the latencies of their interconnections through a newly developed wrapper. We also present an informal exposition of the theoretical basis of adaptive LIPs, as well as implementation detail

    On-Chip Transparent Wire Pipelining (invited paper)

    Get PDF
    Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate delays and increasing wire delays in deep-submicron technologies. Far from being a straightforwardly applicable technique, this methodology requires a number of design modifications in order to insert it seamlessly in the current design flow. In this paper we briefly survey the methods presented by other researchers in the field and then we thoroughly analyze the solutions we recently proposed, ranging from system-level wire pipelining to physical design aspects

    Throughput-driven floorplanning with wire pipelining

    Get PDF
    The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires
    corecore