Recent Trends and Considerations for High Speed Data in Chips and System Interconnects

This paper discusses key issues related to the design of large processing volume chip architectures and high speed system interconnects. Design methodologies and techniques are discussed, where recent trends and considerations are highlighted

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Network-on-Chip Synchronization

Technology scaling has enabled the number of cores within a System on Chip (SoC) to increase significantly. Globally Asynchronous Locally Synchronous (GALS) systems using Dynamic Voltage and Frequency Scaling (DVFS) operate each of these cores on distinct and dynamic clock domains. The main communication method between these cores is increasingly more likely to be a Network-on-Chip (NoC). Typically, the interfaces between these clock domains experience multi-cycle synchronization latencies due to their use of “brute-force” synchronizers. This dissertation aims to improve the performance of NoCs and thereby SoCs as a whole by reducing this synchronization latency. First, a survey of NoC improvement techniques is presented. One such improvement technique: a multi-layer NoC, has been successfully simulated. Given how one of the most commonly used techniques is DVFS, a thorough analysis and simulation of brute-force synchronizer circuits in both current and future process technologies is presented. Unfortunately, a multi-cycle latency is unavoidable when using brute-force synchronizers, so predictive synchronizers which require only a single cycle of latency have been proposed. To demonstrate the impact of these predictive synchronizer circuits at a high level, multi-core system simulations incorporating these circuits have been completed. Multiple forms of GALS NoC configurations have been simulated, including multi-synchronous, NoC-synchronous, and single-synchronizer. Speedup on the SPLASH benchmark suite was measured to directly quantify the performance benefit of predictive synchronizers in a full system. Additionally, Mean Time Between Failures (MTBF) has been calculated for each NoC synchronizer configuration to determine the reliability benefit possible when using predictive synchronizers

Coupling Routing Algorithm and Data Encoding for Low Power Networks on Chip

The routing algorithm used in a Network-on-Chip (NoC) has a strong impact on both the functional and non functional indices of the overall system. Traditionally, routing algorithms have been designed considering performance and cost as the main objectives. In this study we focus on two important non functional metrics, namely, power dissipation and energy consumption. We propose a selection policy that can be coupled with any multi-path routing function and whose primary goal is reducing power dissipation. As technology shrinks, the power dissipated by the network links represents an ever more significant fraction of the total power budget. Based on this, the proposed selection policy tries to reduce link power dissipation by selecting the output port of the router which minimises the switching activity of the output link. A set of experiments carried out on both synthetic and real traffic scenarios is presented. When the proposed selection policy is used in conjunction with a data encoding technique, on average, 31% of energy reduction and 37% of power saving is observed. An architectural implementation of the selection policy is also presented and its impact on cost (silicon area) and power dissipation of the baseline router is discussed

Design Space Exploration for MPSoC Architectures

Multiprocessor system-on-chip (MPSoC) designs utilize the available technology and communication architectures to meet the requirements of the upcoming applications. In MPSoC, the communication platform is both the key enabler, as well as the key differentiator for realizing efficient MPSoCs. It provides product differentiation to meet a diverse, multi-dimensional set of design constraints, including performance, power, energy, reconfigurability, scalability, cost, reliability and time-to-market. The communication resources of a single interconnection platform cannot be fully utilized by all kind of applications, such as the availability of higher communication bandwidth for computation but not data intensive applications is often unfeasible in the practical implementation. This thesis aims to perform the architecture-level design space exploration towards efficient and scalable resource utilization for MPSoC communication architecture. In order to meet the performance requirements within the design constraints, careful selection of MPSoC communication platform, resource aware partitioning and mapping of the application play important role. To enhance the utilization of communication resources, variety of techniques such as resource sharing, multicast to avoid re-transmission of identical data, and adaptive routing can be used. For implementation, these techniques should be customized according to the platform architecture. To address the resource utilization of MPSoC communication platforms, variety of architectures with different design parameters and performance levels, namely Segmented bus (SegBus), Network-on-Chip (NoC) and Three-Dimensional NoC (3D-NoC), are selected. Average packet latency and power consumption are the evaluation parameters for the proposed techniques. In conventional computing architectures, fault on a component makes the connected fault-free components inoperative. Resource sharing approach can utilize the fault-free components to retain the system performance by reducing the impact of faults. Design space exploration also guides to narrow down the selection of MPSoC architecture, which can meet the performance requirements with design constraints.Siirretty Doriast

Efficient mechanisms to provide fault tolerance in interconnection networks for pc clusters

Actualmente, los clusters de PC son un alternativa rentable a los computadores paralelos. En estos sistemas, miles de componentes (procesadores y/o discos duros) se conectan a través de redes de interconexión de altas prestaciones. Entre las tecnologías de red actualmente disponibles para construir clusters, InfiniBand (IBA) ha emergido como un nuevo estándar de interconexión para clusters. De hecho, ha sido adoptado por muchos de los sistemas más potentes construidos actualmente (lista top500). A medida que el número de nodos aumenta en estos sistemas, la red de interconexión también crece. Junto con el aumento del número de componentes la probabilidad de averías aumenta dramáticamente, y así, la tolerancia a fallos en el sistema en general, y de la red de interconexión en particular, se convierte en una necesidad. Desafortunadamente, la mayor parte de las estrategias de encaminamiento tolerantes a fallos propuestas para los computadores masivamente paralelos no pueden ser aplicadas porque el encaminamiento y las transiciones de canal virtual son deterministas en IBA, lo que impide que los paquetes eviten los fallos. Por lo tanto, son necesarias nuevas estrategias para tolerar fallos. Por ello, esta tesis se centra en proporcionar los niveles adecuados de tolerancia a fallos a los clusters de PC, y en particular a las redes IBA. En esta tesis proponemos y evaluamos varios mecanismos adecuados para las redes de interconexión para clusters. El primer mecanismo para proporcionar tolerancia a fallos en IBA (al que nos referimos como encaminamiento tolerante a fallos basado en transiciones; TFTR) consiste en usar varias rutas disjuntas entre cada par de nodos origen-destino y seleccionar la ruta apropiada en el nodo fuente usando el mecanismo APM proporcionado por IBA. Consiste en migrar las rutas afectadas por el fallo a las rutas alternativas sin fallos. Sin embargo, con este fin, es necesario un algoritmo eficiente de encaminamiento capaz de proporcionar suficientesMontañana Aliaga, JM. (2008). Efficient mechanisms to provide fault tolerance in interconnection networks for pc clusters [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/2603Palanci

Cyber-Physical Threat Intelligence for Critical Infrastructures Security

Modern critical infrastructures comprise of many interconnected cyber and physical assets, and as such are large scale cyber-physical systems. Hence, the conventional approach of securing these infrastructures by addressing cyber security and physical security separately is no longer effective. Rather more integrated approaches that address the security of cyber and physical assets at the same time are required. This book presents integrated (i.e. cyber and physical) security approaches and technologies for the critical infrastructures that underpin our societies. Specifically, it introduces advanced techniques for threat detection, risk assessment and security information sharing, based on leading edge technologies like machine learning, security knowledge modelling, IoT security and distributed ledger infrastructures. Likewise, it presets how established security technologies like Security Information and Event Management (SIEM), pen-testing, vulnerability assessment and security data analytics can be used in the context of integrated Critical Infrastructure Protection. The novel methods and techniques of the book are exemplified in case studies involving critical infrastructures in four industrial sectors, namely finance, healthcare, energy and communications. The peculiarities of critical infrastructure protection in each one of these sectors is discussed and addressed based on sector-specific solutions. The advent of the fourth industrial revolution (Industry 4.0) is expected to increase the cyber-physical nature of critical infrastructures as well as their interconnection in the scope of sectorial and cross-sector value chains. Therefore, the demand for solutions that foster the interplay between cyber and physical security, and enable Cyber-Physical Threat Intelligence is likely to explode. In this book, we have shed light on the structure of such integrated security systems, as well as on the technologies that will underpin their operation. We hope that Security and Critical Infrastructure Protection stakeholders will find the book useful when planning their future security strategies