Early analysis of VLSI systems with packaging considerations

There is an explosive growth in the size of the VLSI (Very Large Scale Integration) systems today. Microelectronic system designers are packing millions of transistors in a single IC chip. Packaging techniques like Multi-chip module (MCM) and flip-chip bonding offer faster interconnects and IC\u27s capable of accommodating a larger number of inputs and outputs. The complexity of today\u27s designs and the availability of advanced packaging techniques call for an early analysis of the system based on estimation of system parameters to select from a wide choice of circuit partitioning, architecture alternatives and packaging options which give the best cost/performance. A procedure for the early analysis of VLSI systems under packaging considerations has been developed and implemented in this dissertation work. The early analysis tool was used to evaluate the inter-relationship between partitioning and packaging and to determine the best system design considering cost, size and delays. The functional unit level description of a 750,000-transistor MicroSparc processor was studied using an exhaustive search technique. The early analysis performed on the MicroSparc design suggested that the three chip multi-chip design using flip-chip IC\u27s interconnected on a MCM-D substrate is the most cost effective. An early bond pitch analysis performed using the tool concluded that a 250-micron bond pitch is the best choice for the multi-chip MicroSparc designs. The tool was also used to perform an early cache analysis which showed that the use of separate memory and logic processes made it feasible to design the MicroSparc design with larger cache sizes than the use of a combined logic and memory process. The designs based on the separate processes gave equivalent or better performance than the design candidates with smaller cache sizes. Future extensions of the procedure are also outlined here

Center for Aeronautics and Space Information Sciences

This report summarizes the research done during 1991/92 under the Center for Aeronautics and Space Information Science (CASIS) program. The topics covered are computer architecture, networking, and neural nets

Improving the Scalability of High Performance Computer Systems

Improving the performance of future computing systems will be based upon the ability of increasing the scalability of current technology. New paths need to be explored, as operating principles that were applied up to now are becoming irrelevant for upcoming computer architectures. It appears that scaling the number of cores, processors and nodes within an system represents the only feasible alternative to achieve Exascale performance. To accomplish this goal, we propose three novel techniques addressing different layers of computer systems. The Tightly Coupled Cluster technique significantly improves the communication for inter node communication within compute clusters. By improving the latency by an order of magnitude over existing solutions the cost of communication is considerably reduced. This enables to exploit fine grain parallelism within applications, thereby, extending the scalability considerably. The mechanism virtually moves the network interconnect into the processor, bypassing the latency of the I/O interface and rendering protocol conversions unnecessary. The technique is implemented entirely through firmware and kernel layer software utilizing off-the-shelf AMD processors. We present a proof-of-concept implementation and real world benchmarks to demonstrate the superior performance of our technique. In particular, our approach achieves a software-to-software communication latency of 240 ns between two remote compute nodes. The second part of the dissertation introduces a new framework for scalable Networks-on-Chip. A novel rapid prototyping methodology is proposed, that accelerates the design and implementation substantially. Due to its flexibility and modularity a large application space is covered ranging from Systems-on-chip, to high performance many-core processors. The Network-on-Chip compiler enables to generate complex networks in the form of synthesizable register transfer level code from an abstract design description. Our engine supports different target technologies including Field Programmable Gate Arrays and Application Specific Integrated Circuits. The framework enables to build large designs while minimizing development and verification efforts. Many topologies and routing algorithms are supported by partitioning the tasks into several layers and by the introduction of a protocol agnostic architecture. We provide a thorough evaluation of the design that shows excellent results regarding performance and scalability. The third part of the dissertation addresses the Processor-Memory Interface within computer architectures. The increasing compute power of many-core processors, leads to an equally growing demand for more memory bandwidth and capacity. Current processor designs exhibit physical limitations that restrict the scalability of main memory. To address this issue we propose a memory extension technique that attaches large amounts of DRAM memory to the processor via a low pin count interface using high speed serial transceivers. Our technique transparently integrates the extension memory into the system architecture by providing full cache coherency. Therefore, applications can utilize the memory extension by applying regular shared memory programming techniques. By supporting daisy chained memory extension devices and by introducing the asymmetric probing approach, the proposed mechanism ensures high scalability. We furthermore propose a DMA offloading technique to improve the performance of the processor memory interface. The design has been implemented in a Field Programmable Gate Array based prototype. Driver software and firmware modifications have been developed to bring up the prototype in a Linux based system. We show microbenchmarks that prove the feasibility of our design

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Efficient parallel processing with optical interconnections

With the advances in VLSI technology, it is now possible to build chips which can each contain thousands of processors. The efficiency of such chips in executing parallel algorithms heavily depends on the interconnection topology of the processors. It is not possible to build a fully interconnected network of processors with constant fan-in/fan-out using electrical interconnections. Free space optics is a remedy to this limitation. Qualities exclusive to the optical medium are its ability to be directed for propagation in free space and the property that optical channels can cross in space without any interference. In this thesis, we present an electro-optical interconnected architecture named Optical Reconfigurable Mesh (ORM). It is based on an existing optical model of computation. There are two layers in the architecture. The processing layer is a reconfigurable mesh and the deflecting layer contains optical devices to deflect light beams. ORM provides three types of communication mechanisms. The first is for arbitrary planar connections among sets of locally connected processors using the reconfigurable mesh. The second is for arbitrary connections among N of the processors using the electrical buses on the processing layer and N2 fixed passive deflecting units on the deflection layer. The third is for arbitrary connections among any of the N2 processors using the N2 mechanically reconfigurable deflectors in the deflection layer. The third type of communication mechanisms is significantly slower than the other two. Therefore, it is desirable to avoid reconfiguring this type of communication during the execution of the algorithms. Instead, the optical reconfiguration can be done before the execution of each algorithm begins. Determining a right configuration that would be suitable for the entire configuration of a task execution is studied in this thesis. The basic data movements for each of the mechanisms are studied. Finally, to show the power of ORM, we use all three types of communication mechanisms in the first O(logN) time algorithm for finding the convex hulls of all figures in an N x N binary image presented in this thesis

Developments and experimental evaluation of partitioning algorithms for adaptive computing systems

Multi-FPGA systems offer the potential to deliver higher performance solutions than traditional computers for some low-level computing tasks. This requires a flexible hardware substrate and an automated mapping system. CHAMPION is an automated mapping system for implementing image processing applications in multi-FPGA systems under development at the University of Tennessee. CHAMPION will map applications in the Khoros Cantata graphical programming environment to hardware. The work described in this dissertation involves the automation of the CHAMPION backend design flow, which includes the partitioning problem, netlist to structural VHDL conversion, synthesis and placement and routing, and host code generation. The primary goal is to investigate the development and evaluation of three different k-way partitioning approaches. In the first and the second approaches, we discuss the development and implementation of two existing algorithms. The first approach is a hierarchical partitioning method based on topological ordering (HP). The second approach is a recursive algorithm based on the Fiduccia and Mattheyses bipartitioning heuristic (RP). We extend these algorithms to handle the multiple constraints imposed by adaptive computing systems. We also introduce a new recursive partitioning method based on topological ordering and levelization (RPL). In addition to handling the partitioning constraints, the new approach efficiently addresses the problem of minimizing the number of FPGAs used and the amount of computation, thereby overcoming some of the weaknesses of the HP and RP algorithms

Doctor of Philosophy

dissertationIn-memory big data applications are growing in popularity, including in-memory versions of the MapReduce framework. The move away from disk-based datasets shifts the performance bottleneck from slow disk accesses to memory bandwidth. MapReduce is a data-parallel application, and is therefore amenable to being executed on as many parallel processors as possible, with each processor requiring high amounts of memory bandwidth. We propose using Near Data Computing (NDC) as a means to develop systems that are optimized for in-memory MapReduce workloads, offering high compute parallelism and even higher memory bandwidth. This dissertation explores three different implementations and styles of NDC to improve MapReduce execution. First, we use 3D-stacked memory+logic devices to process the Map phase on compute elements in close proximity to database splits. Second, we attempt to replicate the performance characteristics of the 3D-stacked NDC using only commodity memory and inexpensive processors to improve performance of both Map and Reduce phases. Finally, we incorporate fixed-function hardware accelerators to improve sorting performance within the Map phase. This dissertation shows that it is possible to improve in-memory MapReduce performance by potentially two orders of magnitude by designing system and memory architectures that are specifically tailored to that end

Network-on-Chip

Limitations of bus-based interconnections related to scalability, latency, bandwidth, and power consumption for supporting the related huge number of on-chip resources result in a communication bottleneck. These challenges can be efficiently addressed with the implementation of a network-on-chip (NoC) system. This book gives a detailed analysis of various on-chip communication architectures and covers different areas of NoCs such as potentials, architecture, technical challenges, optimization, design explorations, and research directions. In addition, it discusses current and future trends that could make an impactful and meaningful contribution to the research and design of on-chip communications and NoC systems

The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

Extension of the L1Calo PreProcessor System for the ATLAS Phase-I Calorimeter Trigger Upgrade

For the Run-3 data-taking period at the Large Hadron Collider (LHC), the hardware- based Level-1 Calorimeter Trigger (L1Calo) of the ATLAS experiment was upgraded. Through new and sophisticated algorithms, the upgrade will increase the trigger performance in a challenging, high-pileup environment while maintaining low selection thresholds. The Tile Rear Extension (TREX) modules are the latest addition to the L1Calo PreProcessor system. Hosting state-of-the-art FPGAs and high-speed optical transceivers, the TREX modules provide digitised hadronic transverse energies from the ATLAS Tile Calorimeter to the new feature extractor (FEX) processors every 25 ns. In addition, the modules are designed to maintain compatibility with the original trigger processors. The system of 32 TREX modules has been developed, produced and successfully installed in ATLAS. The thesis describes the functional implementation of the modules and the detailed integration and commissioning into the ATLAS detector