In-memory computing with emerging memory devices: Status and outlook

Supporting data for "In-memory computing with emerging memory devices: status and outlook", submitted to APL Machine Learning

An Energy-Efficient Design Paradigm for a Memory Cell Based on Novel Nanoelectromechanical Switches

In this chapter, we explain NEMsCAM cell, a new content-addressable memory (CAM) cell, which is designed based on both CMOS technologies and nanoelectromechanical (NEM) switches. The memory part of NEMsCAM is designed with two complementary nonvolatile NEM switches and located on top of the CMOS-based comparison component. As a use case, we evaluate first-level instruction and data translation lookaside buffers (TLBs) with 16 nm CMOS technology at 2 GHz. The simulation results demonstrate that the NEMsCAM TLB reduces the energy consumption per search operation (by 27%), standby mode (by 53.9%), write operation (by 41.9%), and the area (by 40.5%) compared to a CMOS-only TLB with minimal performance overhead

Design and Robustness Analysis on Non-volatile Storage and Logic Circuit

By combining the flexibility of MOS logic and the non-volatility of spintronic devices, spin-MOS logic and storage circuitry offer a promising approach to implement highly integrated, power-efficient, and nonvolatile computing and storage systems. Besides the persistent errors due to process variations, however, the functional correctness of Spin-MOS circuitry suffers from additional non-persistent errors that are incurred by the randomness of spintronic device operations, i.e., thermal fluctuations. This work quantitatively investigates the impact of thermal fluctuations on the operations of two typical Spin-MOS circuitry: one transistor and one magnetic tunnel junction (1T1J) spin-transfer torque random access memory (STT-RAM) cell and a nonvolatile latch design. A new nonvolatile latch design is proposed based on magnetic tunneling junction (MTJ) devices. In the standby mode, the latched data can be retained in the MTJs without consuming any power. Two types of operation errors can occur, namely, persistent and non-persistent errors. These are quantitatively analyzed by including models for process variations and thermal fluctuations during the read and write operations. A mixture importance sampling methodology is applied to enable yield-driven design and extend its application beyond memories to peripheral circuits and logic blocks. Several possible design techniques to reduce thermal induced non-persistent error rate are also discussed

Sub-10nm Transistors for Low Power Computing: Tunnel FETs and Negative Capacitance FETs

One of the major roadblocks in the continued scaling of standard CMOS technology is its alarmingly high leakage power consumption. Although circuit and system level methods can be employed to reduce power, the fundamental limit in the overall energy efficiency of a system is still rooted in the MOSFET operating principle: an injection of thermally distributed carriers, which does not allow subthreshold swing (SS) lower than 60mV/dec at room temperature. Recently, a new class of steep-slope devices like Tunnel FETs (TFETs) and Negative-Capacitance FETs (NCFETs) have garnered intense interest due to their ability to surpass the 60mV/dec limit on SS at room temperature. The focus of this research is on the simulation and design of TFETs and NCFETs for ultra-low power logic and memory applications. Using full band quantum mechanical model within the Non-Equilibrium Greens Function (NEGF) formalism, source-underlapping has been proposed as an effective technique to lower the SS in GaSb-InAs TFETs. Band-tail states, associated with heavy source doping, are shown to significantly degrade the SS in TFETs from their ideal value. To solve this problem, undoped source GaSb-InAs TFET in an i-i-n configuration is proposed. A detailed circuit-to-system level evaluation is performed to investigate the circuit level metrics of the proposed devices. To demonstrate their potential in a memory application, a 4T gain cell (GC) is proposed, which utilizes the low-leakage and enhanced drain capacitance of TFETs to realize a robust and long retention time GC embedded-DRAMs. The device/circuit/system level evaluation of proposed TFETs demonstrates their potential for low power digital applications. The second part of the thesis focuses on the design space exploration of hysteresis-free Negative Capacitance FETs (NCFETs). A cross-architecture analysis using HfZrOx ferroelectric (FE-HZO) integrated on bulk MOSFET, fully-depleted SOI-FETs, and sub-10nm FinFETs shows that FDSOI and FinFET configurations greatly benefit the NCFET performance due to their undoped body and improved gate-control which enables better capacitance matching with the ferroelectric. A low voltage NC-FinFET operating down to 0.25V is predicted using ultra-thin 3nm FE-HZO. Next, we propose one-transistor ferroelectric NOR type (Fe-NOR) non-volatile memory based on HfZrOx ferroelectric FETs (FeFETs). The enhanced drain-channel coupling in ultrashort channel FeFETs is utilized to dynamically modulate memory window of storage cells thereby resulting in simple erase-, program-and read-operations. The simulation analysis predicts sub-1V program/erase voltages in the proposed Fe-NOR memory array and therefore presents a significantly lower power alternative to conventional FeRAM and NOR flash memories

Efficient Deep Neural Network Accelerator Using Controlled Ferroelectric Domain Dynamics

The current work reports an efficient deep neural network (DNN) accelerator where synaptic weight elements are controlled by ferroelectric domain dynamics. An integrated device-to-algorithm framework for benchmarking novel synaptic devices is used. In P(VDF-TrFE) based ferroelectric tunnel junctions, analog conductance states are measured using a custom pulsing protocol and associated custom circuits and array architectures for DNN training is simulated. Our results show precise control of polarization switching dynamics in multi-domain, polycrystalline ferroelectric thin films can produce considerable weight update linearity in metal-ferroelectric-semiconductor (MFS) tunnel junctions. Ultrafast switching and low junction current in these devices offer extremely energy efficient operation. Through an integrated platform of hardware development, characterization and modelling, we predict the available conductance range where linearity is expected under identical potentiating and depressing pulses for efficient DNN training and inference tasks. As an example, an analog crossbar based DNN accelerator with MFS junctions as synaptic weight elements showed ~ 93% training accuracy on large MNIST handwritten digit dataset while for cropped images, a 95% accuracy is achieved. One observed challenge is rather limited dynamic conductance range while operating under identical potentiating and depressing pulses below 1V. Investigation is underway for improving the dynamic conductance range without losing the weight update linearity

MTJ-BASED HYBRID STORAGE CELLS FOR “NORMALLY-OFF AND INSTANT-ON” COMPUTING

Besides increasing a computing throughput, multi-core processor architectures bring increased capacity of SRAM-based cache memory. As a result, cache memory now occupies large proportion of recent processor chips, becoming a major source of the leakage power consumption. The power gating technique applied on a SRAM cache is not efficient since it is paid by data loss. In this paper, we present two hybrid memory cells that combine a conventional volatile CMOS part with Magnetic Tunnel Junctions (MTJs) able to store a data bit in a non-volatile way. Being inherently non-volatile, these hybrid cells enable instantaneous power off and thus complete reduction of the leakage power. Moreover, given that the data bit can be stored in local MTJs and not in distant storage memories, these cells also offer instantaneous and efficient data retrieval. To demonstrate their functionality, the cells are designed using 28 nm FD-SOI technology for the CMOS part and 45 nm round spin transfer torque MTJs (STT-MTJs) with perpendicular magnetization anisotropy. We report the measured performances of the cells in terms of required silicon area, robustness, read/write speed and energy consumption

Phase Noise Analyses and Measurements in the Hybrid Memristor-CMOS Phase-Locked Loop Design and Devices Beyond Bulk CMOS

Phase-locked loop (PLLs) has been widely used in analog or mixed-signal integrated circuits. Since there is an increasing market for low noise and high speed devices, PLLs are being employed in communications. In this dissertation, we investigated phase noise, tuning range, jitter, and power performances in different architectures of PLL designs. More energy efficient devices such as memristor, graphene, transition metal di-chalcogenide (TMDC) materials and their respective transistors are introduced in the design phase-locked loop. Subsequently, we modeled phase noise of a CMOS phase-locked loop from the superposition of noises from its building blocks which comprises of a voltage-controlled oscillator, loop filter, frequency divider, phase-frequency detector, and the auxiliary input reference clock. Similarly, a linear time-invariant model that has additive noise sources in frequency domain is used to analyze the phase noise. The modeled phase noise results are further compared with the corresponding phase-locked loop designs in different n-well CMOS processes. With the scaling of CMOS technology and the increase of the electrical field, the problem of short channel effects (SCE) has become dominant, which causes decay in subthreshold slope (SS) and positive and negative shifts in the threshold voltages of nMOS and pMOS transistors, respectively. Various devices are proposed to continue extending Moore\u27s law and the roadmap in semiconductor industry. We employed tunnel field effect transistor owing to its better performance in terms of SS, leakage current, power consumption etc. Applying an appropriate bias voltage to the gate-source region of TFET causes the valence band to align with the conduction band and injecting the charge carriers. Similarly, under reverse bias, the two bands are misaligned and there is no injection of carriers. We implemented graphene TFET and MoS2 in PLL design and the results show improvements in phase noise, jitter, tuning range, and frequency of operation. In addition, the power consumption is greatly reduced due to the low supply voltage of tunnel field effect transistor