Design and analysis of SRAMs for energy harvesting systems

PhD ThesisAt present, the battery is employed as a power source for wide varieties of microelectronic systems ranging from biomedical implants and sensor net-works to portable devices. However, the battery has several limitations and incurs many challenges for the majority of these systems. For instance, the design considerations of implantable devices concern about the battery from two aspects, the toxic materials it contains and its lifetime since replacing the battery means a surgical operation. Another challenge appears in wire-less sensor networks, where hundreds or thousands of nodes are scattered around the monitored environment and the battery of each node should be maintained and replaced regularly, nonetheless, the batteries in these nodes do not all run out at the same time. Since the introduction of portable systems, the area of low power designs has witnessed extensive research, driven by the industrial needs, towards the aim of extending the lives of batteries. Coincidentally, the continuing innovations in the field of micro-generators made their outputs in the same range of several portable applications. This overlap creates a clear oppor-tunity to develop new generations of electronic systems that can be powered, or at least augmented, by energy harvesters. Such self-powered systems benefit applications where maintaining and replacing batteries are impossi-ble, inconvenient, costly, or hazardous, in addition to decreasing the adverse effects the battery has on the environment. The main goal of this research study is to investigate energy harvesting aware design techniques for computational logic in order to enable the capa- II bility of working under non-deterministic energy sources. As a case study, the research concentrates on a vital part of all computational loads, SRAM, which occupies more than 90% of the chip area according to the ITRS re-ports. Essentially, this research conducted experiments to find out the design met-ric of an SRAM that is the most vulnerable to unpredictable energy sources, which has been confirmed to be the timing. Accordingly, the study proposed a truly self-timed SRAM that is realized based on complete handshaking protocols in the 6T bit-cell regulated by a fully Speed Independent (SI) tim-ing circuitry. The study proved the functionality of the proposed design in real silicon. Finally, the project enhanced other performance metrics of the self-timed SRAM concentrating on the bit-line length and the minimum operational voltage by employing several additional design techniques.Umm Al-Qura University, the Ministry of Higher Education in the Kingdom of Saudi Arabia, and the Saudi Cultural Burea

PAOD: a predictive approach for optimization of design in FinFET/SRAM

The evolutions in the modern memory units are comeup with FinFET/SRAM which can be utilized over high scaled computing units and in other devices. Some of the recent systems were surveyed through which it is known that existing systems lags with improving the performance and optimization of FinFET/SRAM design. Thus, the paper introduces an optimized model based on Search Optimization mechanism that uses Predictive Approach to optimize the design structure of FinFET/SRAM (PAOD). Using this can achieve significant fault tolerance under dynamic cumpting devices and applications. The model uses mathematical methodology which helps to attain less computational time and significant output even at more simulation iteration. This POAD is cost effective as it provides better convergence of FinFET/SRAM design than recursive design

Robust Circuit Design for Low-Voltage VLSI.

Voltage scaling is an effective way to reduce the overall power consumption, but the major challenges in low voltage operations include performance degradation and reliability issues due to PVT variations. This dissertation discusses three key circuit components that are critical in low-voltage VLSI. Level converters must be a reliable interface between two voltage domains, but the reduced on/off-current ratio makes it extremely difficult to achieve robust conversions at low voltages. Two static designs are proposed: LC2 adopts a novel pulsed-operation and modulates its pull-up strength depending on its state. A 3-sigma robustness is guaranteed using a current margin plot; SLC inherently reduces the contention by diode-insertion. Improvements in performance, power, and robustness are measured from 130nm CMOS test chips. SRAM is a major bottleneck in voltage-scaling due to its inherent ratioed-bitcell design. The proposed 7T SRAM alleviates the area overhead incurred by 8T bitcells and provides robust operation down to 0.32V in 180nm CMOS test chips with 3.35fW/bit leakage. Auto-Shut-Off provides a 6.8x READ energy reduction, and its innate Quasi-Static READ has been demonstrated which shows a much improved READ error rate. A use of PMOS Pass-Gate improves the half-select robustness by directly modulating the device strength through bitline voltage. Clocked sequential elements, flip-flops in short, are ubiquitous in today’s digital systems. The proposed S2CFF is static, single-phase, contention-free, and has the same number of devices as in TGFF. It shows a 40% power reduction as well as robust low-voltage operations in fabricated 45nm SOI test chips. Its simple hold-time path and the 3.4x improvement in 3-sigma hold-time is presented. A new on-chip flip-flop testing harness is also proposed, and measured hold-time variations of flip-flops are presented.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111525/1/yejoong_1.pd

Robust low-power digital circuit design in nano-CMOS technologies

Device scaling has resulted in large scale integrated, high performance, low-power, and low cost systems. However the move towards sub-100 nm technology nodes has increased variability in device characteristics due to large process variations. Variability has severe implications on digital circuit design by causing timing uncertainties in combinational circuits, degrading yield and reliability of memory elements, and increasing power density due to slow scaling of supply voltage. Conventional design methods add large pessimistic safety margins to mitigate increased variability, however, they incur large power and performance loss as the combination of worst cases occurs very rarely. In-situ monitoring of timing failures provides an opportunity to dynamically tune safety margins in proportion to on-chip variability that can significantly minimize power and performance losses. We demonstrated by simulations two delay sensor designs to detect timing failures in advance that can be coupled with different compensation techniques such as voltage scaling, body biasing, or frequency scaling to avoid actual timing failures. Our simulation results using 45 nm and 32 nm technology BSIM4 models indicate significant reduction in total power consumption under temperature and statistical variations. Future work involves using dual sensing to avoid useless voltage scaling that incurs a speed loss. SRAM cache is the first victim of increased process variations that requires handcrafted design to meet area, power, and performance requirements. We have proposed novel 6 transistors (6T), 7 transistors (7T), and 8 transistors (8T)-SRAM cells that enable variability tolerant and low-power SRAM cache designs. Increased sense-amplifier offset voltage due to device mismatch arising from high variability increases delay and power consumption of SRAM design. We have proposed two novel design techniques to reduce offset voltage dependent delays providing a high speed low-power SRAM design. Increasing leakage currents in nano-CMOS technologies pose a major challenge to a low-power reliable design. We have investigated novel segmented supply voltage architecture to reduce leakage power of the SRAM caches since they occupy bulk of the total chip area and power. Future work involves developing leakage reduction methods for the combination logic designs including SRAM peripherals

DESTINY: A Comprehensive Tool with 3D and Multi-Level Cell Memory Modeling Capability

To enable the design of large capacity memory structures, novel memory technologies such as non-volatile memory (NVM) and novel fabrication approaches, e.g., 3D stacking and multi-level cell (MLC) design have been explored. The existing modeling tools, however, cover only a few memory technologies, technology nodes and fabrication approaches. We present DESTINY, a tool for modeling 2D/3D memories designed using SRAM, resistive RAM (ReRAM), spin transfer torque RAM (STT-RAM), phase change RAM (PCM) and embedded DRAM (eDRAM) and 2D memories designed using spin orbit torque RAM (SOT-RAM), domain wall memory (DWM) and Flash memory. In addition to single-level cell (SLC) designs for all of these memories, DESTINY also supports modeling MLC designs for NVMs. We have extensively validated DESTINY against commercial and research prototypes of these memories. DESTINY is very useful for performing design-space exploration across several dimensions, such as optimizing for a target (e.g., latency, area or energy-delay product) for a given memory technology, choosing the suitable memory technology or fabrication method (i.e., 2D v/s 3D) for a given optimization target, etc. We believe that DESTINY will boost studies of next-generation memory architectures used in systems ranging from mobile devices to extreme-scale supercomputers. The latest source-code of DESTINY is available from the following git repository: https://bitbucket.org/sparsh_mittal/destiny_v2

정적 램 및 파워 게이트 회로에 대한 전압 및 보존용 공간 할당 문제

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2021.8. 김태환.칩의 저전력 동작은 중요한 문제이며, 공정이 발전하면서 그 중요성은 점점 커지고 있다. 본 논문은 칩을 구성하는 정적 램(SRAM) 및 로직(logic) 각각에 대해서 저전력으로 동작시키는 방법론을 논한다. 우선, 본 논문에서는 칩을 문턱 전압 근처의 전압(NTV)에서 동작시키고자 할 때 모니터링 회로의 측정을 통해 칩 내의 모든 SRAM 블록에서 동작 실패가 발생하지 않는 최소 동작 전압을 추론하는 방법론을 제안한다. 칩을 NTV 영역에서 동작시키는 것은 에너지 효율성을 증대시킬 수 있는 매우 효과적인 방법 중 하나이지만 SRAM의 경우 동작 실패 때문에 동작 전압을 낮추기 어렵다. 하지만 칩마다 영향을 받는 공정 변이가 다르므로 최소 동작 전압은 칩마다 다르며, 모니터링을 통해 이를 추론해낼 수 있다면 칩별로 SRAM에 서로 다른 전압을 인가해 에너지 효율성을 높일 수 있다. 본 논문에서는 다음과 같은 과정을 통해 이 문제를 해결한다: (1) 디자인 인프라 설계 단계에서는 SRAM의 최소 동작 전압을 추론하고 칩 생산 단계에서는 SRAM 모니터의 측정을 통해 전압을 인가하는 방법론을 제안한다; (2) 칩의 SRAM 비트셀(bitcell)과 주변 회로를 포함한 SRAM 블록들의 공정 변이를 모니터링할 수 있는 SRAM 모니터와 SRAM 모니터에서 모니터링할 대상을 정의한다; (3) SRAM 모니터의 측정값을 이용해 같은 칩에 존재하는 모든 SRAM 블록에서 목표 신뢰수준 내에서 읽기, 쓰기, 및 접근 동작 실패가 발생하지 않는 최소 동작 전압을 추론한다. 벤치마크 회로의 실험 결과는 본 논문에서 제안한 방법을 따라 칩별로 SRAM 블록들의 최소 동작 전압을 다르게 인가할 경우, 기존 방법대로 모든 칩에 동일한 전압을 인가하는 것 대비 수율은 같은 수준으로 유지하면서 SRAM 비트셀 배열의 전력 소모를 감소시킬 수 있음을 보인다. 두 번째로, 본 논문에서는 파워 게이트 회로에서 기존의 보존용 공간 할당 방법들이 지니고 있는 문제를 해결하고 누설 전력 소모를 더 줄일 수 있는 방법론을 제안한다. 기존의 보존용 공간 할당 방법은 멀티플렉서 피드백 루프가 있는 모든 플립플롭에는 무조건 보존용 공간을 할당해야 해야 하기 때문에 다중 비트 보존용 공간의 장점을 충분히 살리지 못하는 문제가 있다. 본 논문에서는 다음과 같은 방법을 통해 보존용 공간을 최소화하는 문제를 해결한다: (1) 보존용 공간 할당 과정에서 멀티플렉서 피드백 루프를 무시할 수 있는 조건을 제시하고, (2) 해당 조건을 이용해 멀티플렉서 피드백 루프가 있는 플립플롭이 많이 존재하는 회로에서 보존용 공간을 최소화한다; (3) 추가로, 플립플롭에 이미 할당된 보존용 공간 중 일부를 제거할 수 있는 조건을 찾고, 이를 이용해 보존용 공간을 더 감소시킨다. 벤치마크 회로의 실험 결과는 본 논문에서 제안한 방법론이 기존의 보존용 공간 할당 방법론보다 더 적은 보존용 공간을 할당하며, 따라서 칩의 면적 및 전력 소모를 감소시킬 수 있음을 보인다.Low power operation of a chip is an important issue, and its importance is increasing as the process technology advances. This dissertation addresses the methodology of operating at low power for each of the SRAM and logic constituting the chip. Firstly, we propose a methodology to infer the minimum operating voltage at which SRAM failure does not occur in all SRAM blocks in the chip operating on near threshold voltage (NTV) regime through the measurement of a monitoring circuit. Operating the chip on NTV regime is one of the most effective ways to increase energy efficiency, but in case of SRAM, it is difficult to lower the operating voltage because of SRAM failure. However, since the process variation on each chip is different, the minimum operating voltage is also different for each chip. If it is possible to infer the minimum operating voltage of SRAM blocks of each chip through monitoring, energy efficiency can be increased by applying different voltage. In this dissertation, we propose a new methodology of resolving this problem. Specifically, (1) we propose to infer minimum operation voltage of SRAM in design infra development phase, and assign the voltage using measurement of SRAM monitor in silicon production phase; (2) we define a SRAM monitor and features to be monitored that can monitor process variation on SRAM blocks including SRAM bitcell and peripheral circuits; (3) we propose a new methodology of inferring minimum operating voltage of SRAM blocks in a chip that does not cause read, write, and access failures under a target confidence level. Through experiments with benchmark circuits, it is confirmed that applying different voltage to SRAM blocks in each chip that inferred by our proposed methodology can save overall power consumption of SRAM bitcell array compared to applying same voltage to SRAM blocks in all chips, while meeting the same yield target. Secondly, we propose a methodology to resolve the problem of the conventional retention storage allocation methods and thereby further reduce leakage power consumption of power gated circuit. Conventional retention storage allocation methods have problem of not fully utilizing the advantage of multi-bit retention storage because of the unavoidable allocation of retention storage on flip-flops with mux-feedback loop. In this dissertation, we propose a new methodology of breaking the bottleneck of minimizing the state retention storage. Specifically, (1) we find a condition that mux-feedback loop can be disregarded during the retention storage allocation; (2) utilizing the condition, we minimize the retention storage of circuits that contain many flip-flops with mux-feedback loop; (3) we find a condition to remove some of the retention storage already allocated to each of flip-flops and propose to further reduce the retention storage. Through experiments with benchmark circuits, it is confirmed that our proposed methodology allocates less retention storage compared to the state-of-the-art methods, occupying less cell area and consuming less power.1 Introduction 1 1.1 Low Voltage SRAM Monitoring Methodology 1 1.2 Retention Storage Allocation on Power Gated Circuit 5 1.3 Contributions of this Dissertation 8 2 SRAM On-Chip Monitoring Methodology for High Yield and Energy Efficient Memory Operation at Near Threshold Voltage 13 2.1 SRAM Failures 13 2.1.1 Read Failure 13 2.1.2 Write Failure 15 2.1.3 Access Failure 16 2.1.4 Hold Failure 16 2.2 SRAM On-chip Monitoring Methodology: Bitcell Variation 18 2.2.1 Overall Flow 18 2.2.2 SRAM Monitor and Monitoring Target 18 2.2.3 Vfail to Vddmin Inference 22 2.3 SRAM On-chip Monitoring Methodology: Peripheral Circuit IR Drop and Variation 29 2.3.1 Consideration of IR Drop 29 2.3.2 Consideration of Peripheral Circuit Variation 30 2.3.3 Vddmin Prediction including Access Failure Prohibition 33 2.4 Experimental Results 41 2.4.1 Vddmin Considering Read and Write Failures 42 2.4.2 Vddmin Considering Read/Write and Access Failures 45 2.4.3 Observation for Practical Use 45 3 Allocation of Always-On State Retention Storage for Power Gated Circuits - Steady State Driven Approach 49 3.1 Motivations and Analysis 49 3.1.1 Impact of Self-loop on Power Gating 49 3.1.2 Circuit Behavior Before Sleeping 52 3.1.3 Wakeup Latency vs. Retention Storage 54 3.2 Steady State Driven Retention Storage Allocation 56 3.2.1 Extracting Steady State Self-loop FFs 57 3.2.2 Allocating State Retention Storage 59 3.2.3 Designing and Optimizing Steady State Monitoring Logic 59 3.2.4 Analysis of the Impact of Steady State Monitoring Time on the Standby Power 63 3.3 Retention Storage Refinement Utilizing Steadiness 65 3.3.1 Extracting Flip-flops for Retention Storage Refinement 66 3.3.2 Designing State Monitoring Logic and Control Signals 68 3.4 Experimental Results 73 3.4.1 Comparison of State Retention Storage 75 3.4.2 Comparison of Power Consumption 79 3.4.3 Impact on Circuit Performance 82 3.4.4 Support for Immediate Power Gating 83 4 Conclusions 89 4.1 Chapter 2 89 4.2 Chapter 3 90박

Concertina: Squeezing in cache content to operate at near-threshold voltage

© 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Scaling supply voltage to values near the threshold voltage allows a dramatic decrease in the power consumption of processors; however, the lower the voltage, the higher the sensitivity to process variation, and, hence, the lower the reliability. Large SRAM structures, like the last-level cache (LLC), are extremely vulnerable to process variation because they are aggressively sized to satisfy high density requirements. In this paper, we propose Concertina, an LLC designed to enable reliable operation at low voltages with conventional SRAM cells. Based on the observation that for many applications the LLC contains large amounts of null data, Concertina compresses cache blocks in order that they can be allocated to cache entries with faulty cells, enabling use of 100 percent of the LLC capacity. To distribute blocks among cache entries, Concertina implements a compression- and fault-aware insertion/replacement policy that reduces the LLC miss rate. Concertina reaches the performance of an ideal system implementing an LLC that does not suffer from parameter variation with a modest storage overhead. Specifically, performance degrades by less than 2 percent, even when using small SRAM cells, which implies over 90 percent of cache entries having defective cells, and this represents a notable improvement on previously proposed techniques.Peer ReviewedPostprint (author's final draft

-Memory Computing Based Reliable and High Speed Schmitt trigger 10T SRAM cell design

Static random access memories (SRAM) are useful building blocks in various applications, including cache memories, integrated data storage systems, and microprocessors. The von Neumann bottleneck difficulties are solved by in-memory computing. It eliminates unnecessary frequent data transfer between memory and processing units simultaneously. In this research, the replica-based 10T SRAM design for in-memory computing (IMC) is designed by adapting the word line control scheme in 14nm CMOS technology. In order to achieve high reading and writing capability, the Schmitt trigger inverter was used for energy-saving and stable use. To speed up the writing process of the design, a single transistor is inserted between the cross-coupled inverters. In addition, to increase the node capacity, the voltage boosting circuitry is emphasized. The adaptive word line control scheme was utilized by integrating the replica column based circuit. The Replica approach regulates signal flow through the core by using a dummy column and a dummy row in RAM. To demonstrate the viability of the suggested design, the simulated outcomes are contrasted with those of existing designs. The various performance metrics examined are Read Static Noise Margin (RSNM), Write (WSNM), Hold (HSNM), Read Access Delay (RAD), Write Access Delay (WAD), Read performance and Write performance the varying supply voltage is evaluated