POWER AND PERFORMANCE STUDIES OF THE EXPLICIT MULTI-THREADING (XMT) ARCHITECTURE

Power and thermal constraints gained critical importance in the design of microprocessors over the past decade. Chipmakers failed to keep power at bay while sustaining the performance growth of serial computers at the rate expected by consumers. As an alternative, they turned to fitting an increasing number of simpler cores on a single die. While this is a step forward for relaxing the constraints, the issue of power is far from resolved and it is joined by new challenges which we explain next. As we move into the era of many-cores, processors consisting of 100s, even 1000s of cores, single-task parallelism is the natural path for building faster general-purpose computers. Alas, the introduction of parallelism to the mainstream general-purpose domain brings another long elusive problem to focus: ease of parallel programming. The result is the dual challenge where power efficiency and ease-of-programming are vital for the prevalence of up and coming many-core architectures. The observations above led to the lead goal of this dissertation: a first order validation of the claim that even under power/thermal constraints, ease-of-programming and competitive performance need not be conflicting objectives for a massively-parallel general-purpose processor. As our platform, we choose the eXplicit Multi-Threading (XMT) many-core architecture for fine grained parallel programs developed at the University of Maryland. We hope that our findings will be a trailblazer for future commercial products. XMT scales up to thousand or more lightweight cores and aims at improving single task execution time while making the task for the programmer as easy as possible. Performance advantages and ease-of-programming of XMT have been shown in a number of publications, including a study that we present in this dissertation. Feasibility of the hardware concept has been exhibited via FPGA and ASIC (per our partial involvement) prototypes. Our contributions target the study of power and thermal envelopes of an envisioned 1024-core XMT chip (XMT1024) under programs that exist in popular parallel benchmark suites. First, we compare XMT against an area and power equivalent commercial high-end many-core GPU. We demonstrate that XMT can provide an average speedup of 8.8x in irregular parallel programs that are common and important in general purpose computing. Even under the worst-case power estimation assumptions for XMT, average speedup is only reduced by half. We further this study by experimentally evaluating the performance advantages of Dynamic Thermal Management (DTM), when applied to XMT1024. DTM techniques are frequently used in current single and multi-core processors, however until now their effects on single-tasked many-cores have not been examined in detail. It is our purpose to explore how existing techniques can be tailored for XMT to improve performance. Performance improvements up to 46% over a generic global management technique has been demonstrated. The insights we provide can guide designers of other similar many-core architectures. A significant infrastructure contribution of this dissertation is a highly configurable cycle-accurate simulator, XMTSim. To our knowledge, XMTSim is currently the only publicly-available shared-memory many-core simulator with extensive capabilities for estimating power and temperature, as well as evaluating dynamic power and thermal management algorithms. As a major component of the XMT programming toolchain, it is not only used as the infrastructure in this work but also contributed to other publications and dissertations

Power, Energy, and Thermal Management for Clustered Manycores

Efficient and effective system-level power, energy, and thermal management are very important issues in modern computing systems, for which clustered architectures with multiple voltage islands are an expected compromise between global and per-core DVFS. In this dissertation, we focus on two of the most relevant problems for such architectures, specifically, optimizing performance under power/thermal constraints, and minimizing energy under performance constraints

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Power efficient resource scaling in partitioned architectures through dynamic heterogeneity

Journal ArticleThe ever increasing demand for high clock speeds and the desire to exploit abundant transistor budgets have resulted in alarming increases in processor power dissipation. Partitioned (or clustered) architectures have been proposed in recent years to address scalability concerns in future billion-transistor microprocessors. Our analysis shows that increasing processor resources in a clustered architecture results in a linear increase in power consumption, while providing diminishing improvements in single-thread performance. To preserve high performance to power ratios, we claim that the power consumption of additional resources should be in proportion to the performance improvements they yield. Hence, in this paper, we propose the implementation of heterogeneous clusters that have varying delay and power characteristics. A cluster's performance and power characteristic is tuned by scaling its frequency and novel policies dynamically assign frequencies to clusters, while attempting to either meet a fixed power budget or minimize a metric such as Energy×Delay2 (ED2). By increasing resources in a power-efficient manner, we observe a 11% improvement in ED2 and a 22.4% average reduction in peak temperature, when compared to a processor with homogeneous units. Our proposed processor model also provides strategies to handle thermal emergencies that have a relatively low impact on performance

Integration of behavioral and layout synthesis : a chip synthesis approach

Chip synthesis deals with the transformation of a behavioral description into a fabricated chip. Typically, chip synthesis is carried out in three stages: behavioral, logic/sequential and layout synthesis. Since chip synthesis involves a multi-level synthesis task, integration and coordination of tasks for all levels of synthesis is the essential issue.This dissertation addresses a chip synthesis paradigm and describes the key issues with regard to the integration of behavioral and layout synthesis for chip design. In order to successfully integrate all tasks in the chip synthesis process, a finite-state machine with a datapath (FSMD) design model and a sliced-layout architecture have been developed for chip synthesis. Using the sliced-layout architecture, a partitioning-based layout synthesis method and system have been developed to synthesize layout from generalized register-transfer (RT) netlists. In addition, based on the FSMD and the sliced-layout architecture, area and timing models are developed for behavioral synthesis. To incorporate layout information into behavioral synthesis, a unified representation is developed for behavioral synthesis. Using the unified representation and layout model, a layout-driven unit-binding approach is presented. Several sets of experiments were performed to validate the proposed approaches including the layout-synthesis method, the layout model and the layout-driven unit-binding task

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures