Perspective of buried oxide thickness variation on triple metal-gate (TMG) recessed-S/D FD-SOI MOSFET

Recently, Fully-Depleted Silicon on Insulator (FD-SOI) MOSFETs have been accepted as a favourable technology beyond nanometer nodes, and the technique of Recessed-Source/Drain (Re-S/D) has made it more immune in regards of various performance factors. However, the proper selection of Buried-Oxide (BOX) thickness is one of the major challenges in the design of FD-SOI based MOS devices in order to suppress the drain electric penetrations across the BOX interface efficiently. In this work, the effect of BOX thickness on the performance of TMG Re-S/D FD-SOI MOSFET has been presented at 60 nm gate length. The perspective of BOX thickness variation has been analysed on the basis of its surface potential profile and the extraction of the threshold voltage by performing two-dimensional numerical simulations. Moreover, to verify the short channel immunity, the impact of gate length scaling has also been discussed. It is found that the device attains two step-up potential profile with suppressed short channel effects. The outcomes reveal that the Drain Induced Barrier Lowering (DIBL) values are lower among conventional SOI MOSFETs. The device has been designed and simulated by using 2D numerical ATLAS Silvaco TCAD simulator

Comparison of SOI, power device structures in power converters for high-voltage, low-charge electrostatic microgenerators

Published versio

Compact modeling of gate tunneling leakage current in advanced nanoscale soi mosfets

En esta tesis se han desarrollado modelos compactos de corriente de fuga por túnel de puerta en SOI MOSFET (de simple y doble puerta) avanzados basados en una aproximación WKB de la probabilidad de túnel. Se han estudiado los materiales dieléctricos high-k más prometedores para los diferentes requisitos de nodos tecnológicos de acuerdo ala hoja de ruta ITRS de miniaturización de dispositivos electrónicos. Hemos presentado un modelo compacto de particionamiento de la corriente de fuga de puerta para un MOSFET nanométrico de doble puerta (DG MOSFET), utilizando modelos analíticos de la corriente de fuga por el túnel directo de puerta. Se desarrollaron también Los modelos analíticos dependientes de la temperatura de la corriente de túnel en la región de inversión y de la corriente túnel asistido por trampas en régimen subumbral. Finalmente, se desarrolló una técnica de extracción automática de parámetros de nuestro modelo compacto en DG MOSFET incluyendo efectos de canal corto. La corriente de la puerta por túnel directo y asistido por trampas modelada mediante los parámetros extraídos se verificó exitosamente mediante comparación con medidas experimentales

Semiconductor Device Modeling and Simulation for Electronic Circuit Design

This chapter covers different methods of semiconductor device modeling for electronic circuit simulation. It presents a discussion on physics-based analytical modeling approach to predict device operation at specific conditions such as applied bias (e.g., voltages and currents); environment (e.g., temperature, noise); and physical characteristics (e.g., geometry, doping levels). However, formulation of device model involves trade-off between accuracy and computational speed and for most practical operation such as for SPICE-based circuit simulator, empirical modeling approach is often preferred. Thus, this chapter also covers empirical modeling approaches to predict device operation by implementing mathematically fitted equations. In addition, it includes numerical device modeling approaches, which involve numerical device simulation using different types of commercial computer-based tools. Numerical models are used as virtual environment for device optimization under different conditions and the results can be used to validate the simulation models for other operating conditions

Benchmarking the screen-grid field effect transistor (SGrFET) for digital applications

Continuous scaling of CMOS technology has now reached a state of evolution, therefore, novel device structures and new materials have been proposed for this purpose. The Screen- Grid field Effect Transistor is introduced as a as a novel device structure that takes advantage of several innovative aspects of the FinFET while introducing new geometrical feature to improve a FET device performance. The idea is to design a FET which is as small as possible without down-scaling issues, at the same time satisfying optimum device performance for both analogue and digital applications. The analogue operation of the SGrFET shows some promising results which make it interesting to continue the investigation on SGrFET for digital applications. The SGrFET addresses some of the concerns of scaled CMOS such as Drain Induce Barrier Lowering and sub-threshold slope, by offering the superior short channel control. In this work in order to evaluate SGrFET performance, the proposed device compared to the classical MOSFET and provides comprehensive benchmarking with finFETs. Both AC and DC simulations are presented using TaurusTM and MediciTM simulators which are commercially available via Synopsis. Initial investigation on the novel device with the single gate structure is carried out. The multi-geometrical characteristic of the proposed device is used to reduce parasitic capacitance and increase ION/IOFF ratio to improve device performance in terms of switching characteristic in different circuit structures. Using TaurusTM AC simulation, a small signal circuit is introduced for SGrFET and evaluated using both extracted small signal elements from TaurusTM and Y-parameter extraction. The SGrFET allows for the unique behavioural characteristics of an independent-gate device. Different configurations of double-gate device are introduced and benchmark against the finFET serving as a double gate device. Five different logic circuits, the complementary and N-inverter, the NOR, NAND and XOR, and controllable Current Mirror circuits are simulated with finFET and SGrFET and their performance compared. Some digital key merits are extracted for both finFET and SGrFET such as power dissipation, noise margin and switching speed to compare the devices under the investigation performance against each other. It is shown that using multi-geometrical feature in SGrFET together with its multi-gate operation can greatly decrease the number of device needed for the logic function without speed degradation and it can be used as a potential candidate in mix-circuit configuration as a multi-gate device. The initial fabrication steps of the novel device explained together with some in-house fabrication process using E-Beam lithography. The fabricated SGrFET is characterised via electrical measurements and used in a circuit configuration

A surface-potential-based compact model for partially-depleted silicon-on-insulator MOSFETs

With the continuous scaling of CMOS technologies, Silicon-on-Insulator (SOI) technologies have become more competitive compared to bulk, due to their lower parasitic capacitances and leakage currents. The shift towards high frequency, low power circuitry, coupled with the increased maturity of SOI process technologies, have made SOI a genuinely costeffective solution for leading edge applications. The original STAG2 model, developed at the University of Southampton, UK, was among the first compact circuit simulation models to specifically model the behaviour of Partially-Depleted (PD) SOI devices. STAG2 was a robust, surface-potential based compact model, employing closed-form equations to minimise simulation times for large circuits. It was able to simulate circuits in DC, small signal, and transient modes, and particular care was taken to ensure that convergence problems were kept to a minimum. In this thesis, the ongoing development of the STAG model, culminating in the release of a new version, STAG3, is described. STAG3 is intended to make the STAG model applicable to process technologies down to 100nm. To this end, a number of major model improvements were undertaken, including: a new core surface potential model, new vertical and lateral field mobility models, quantum mechanical models, the ability to model non-uniform vertical doping profiles, and other miscellaneous effects relevant to deep submicron devices such as polysilicon depletion, velocity overshoot, and the reverse short channel effect.As with the previous versions of STAG, emphasis has been placed on ensuring that model equations are numerically robust, as well as closed-form wherever possible, in order to minimise convergence problems and circuit simulation times. The STAG3 model has been evaluated with devices manufactured in PD-SOI technologies down to 0.25?m, and was found to give good matching to experimental data across a range of device sizes and biases, whilst requiring only a single set of model parameters