Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes

Today, power electronic reliability is a main subject of interest for many companies and laboratories. The main process leading to the IGBT failure is the cycling thermal stress. Indeed the current flow induce local heating and then mechanical stress. This paper deals with electro thermal stress under steady and transient current states. The main objective is to test bonded wires with active current cycle. Consequently, the thermo mechanical stress is obtained. A numerical 3D finite element model is presented and some experimental results are given. Indeed an infrared system monitors the temperature dispatching from an experimental test bench under active current cycle. The overall study is a first step before a global simulation (electrical thermal-mechanical) in order to optimize some geometric parameters of the packaging

SEE Test and Data Analysis for Complex FPGA Systems

Critical space applications require knowledge of single event upset (SEU) susceptibility (mission survivability). Generic SEU test and analysis techniques do not provide adequate data for survivability analysis. This presentation provides information on how to: (1) Investigate (test for) SEU susceptibilities of tactical (mission specific) designs that are implemented in a SRAM-based FPGA; and (2) Analyze SEU cross-sections for use in survivability prediction

Thermal Characterization and Lifetime Prediction of LED Boards for SSL Lamp

This work presents a detailed 3-D thermo-mechanical modelling of two LED board technologies to compare their performance. LED board are considered to be used in high power 800 lumen retrofit SSL (Solid State Lighting) lamp. Thermal, mechanical and life time properties are evaluated by numerical modelling. Experimental results measured on fabricated LED board samples are compared to calculated data. Main role of LED board in SSL lamp is to transport heat from LED die to a heat sink and keep the thermal stresses in all layers as low as possible. The work focuses on improving of new LED board thermal management. Moreover, reliability and lifetime of LED board has been inspected by numerical calculation and validated by experiment. Thermally induced stress has been studied for wide temperature range that can affect the LED boards (-40 to +125°C). Numerical modelling of thermal performance, thermal stress distribution and lifetime has been carried out with ANSYS structural analysis where temperature dependent stress-strain material properties have been taken into account. The objective of this study is to improve not only the thermal performance of new LED board, but also identification of potential problems from mechanical fatigue point of view. Accelerated lifetime testing (e.g., mechanical) is carried out in order to study the failure behaviour of current and newly developed LED board

The roles of charged and neutral oxidising species in silicon oxidation from ab initio calculations

We examine the roles of charged oxidising species based on extensive ab initio density functional theory calculations. Six species are considered: interstitial atomic O, O-, O2- and molecular species: O-2, O-2(-), O-2(2-) We calculate their incorporation energies into bulk silicon dioxide, vertical electron affinities and diffusion barriers. In our calculations, we assume that the electrons responsible for the change of charge state come from the silicon conduction band, however, the generalisation to any other source of electrons is possible, and hence, our results are also relevant to electron-beam assisted oxidation and plasma oxidation. The calculations yield information about the relative stability of oxidising species, and the possible transformations between them and their charging patterns. We discuss the ability to exchange O atoms between the mobile species and the host lattice during diffusion, since this determines whether or not isotope exchange is expected. Our results show very clear trends: (1) the molecular species are energetically preferable over alo,nic ones, (2) the charged species are energetically more favourable than neutral ones, (3) diffusion of atomic species (O, O-, O2-) will result in oxygen exchange, whereas the diffusion of nzoleculai species (O-2, O-2(-), O-2(2-)) is not likely to lead to a significant exchange with the lattice. On the basis of our calculation, we predict that charging of oxidising species may play a key role in silicon oxidation process. (C) 2000 Elsevier Science Ltd. All rights reserved

A novel method for fatigue testing of MEMS devices containing movable elements

In this paper we present an electronic circuit for position or capacitance estimation of MEMS electrostatic actuators based on a switched capacitor technique. The circuit uses a capacitive divider configuration composed by a fixed capacitor and the variable capacitance of the electrostatic actuator for generating a signal that is a function of the input voltage and capacitive ratio. The proposed circuit can be used to actuate and to sense position of an electrostatic MEMS actuator without extra sensing elements. This approach is compatible with the requirements of most analog feedback systems and the circuit topology of pulsed digital oscillators (PDO).Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Optimizing construction of scheduled data flow graph for on-line testability

The objective of this work is to develop a new methodology for behavioural synthesis using a flow of synthesis, better suited to the scheduling of independent calculations and non-concurrent online testing. The traditional behavioural synthesis process can be defined as the compilation of an algorithmic specification into an architecture composed of a data path and a controller. This stream of synthesis generally involves scheduling, resource allocation, generation of the data path and controller synthesis. Experiments showed that optimization started at the high level synthesis improves the performance of the result, yet the current tools do not offer synthesis optimizations that from the RTL level. This justifies the development of an optimization methodology which takes effect from the behavioural specification and accompanying the synthesis process in its various stages. In this paper we propose the use of algebraic properties (commutativity, associativity and distributivity) to transform readable mathematical formulas of algorithmic specifications into mathematical formulas evaluated efficiently. This will effectively reduce the execution time of scheduling calculations and increase the possibilities of testability

Effects of Humidity on the Electro-Optical-Thermal Characteristics of High-Power LEDs

LEDs are subjected to environments with high moisture in many applications. In this paper, the experiments reveal photometric and colorimetric degradation at high humidity. Corresponding spectral power analysis and parameter extraction indicate that the flip-chip bonded LED samples show accelerated chip failure compared to the conventionally bonded samples. The chip-related failure induces greater heat accumulation, which correlates with the increase in heating power observed in the package. However, the temperature rise and thermal resistance for the flip-chip bonded LEDs do not increase substantially as compared to the conventionally bonded LEDs. This is because the junction temperature can be reduced with a flip-chip die-bonding configuration where the heat generated in the LED chip is dissipated effectively onto the AlN substrate, thereby reducing the increase in temperature rise and thermal resistance. The experimental results are supported by evaluation of the derivative structure functions. In addition, as the thermal resistance of the LED package varies with different humidity levels, there is a need to specify the conditions of humidity in data sheets as LED manufacturers routinely specify a universal thermal resistance value under a fixed operating condition