6T CMOS SRAM Stability in Nanoelectronic Era: From Metrics to Built-in Monitoring

The digital technology in the nanoelectronic era is based on intensive data processing and battery-based devices. As a consequence, the need for larger and energy-efficient circuits with large embedded memories is growing rapidly in current system-on-chip (SoC). In this context, where embedded SRAM yield dominate the overall SoC yield, the memory sensitivity to process variation and aging effects has aggressively increased. In addition, long-term aging effects introduce extra variability reducing the failure-free period. Therefore, although stability metrics are used intensively in the circuit design phases, more accurate and non-invasive methodologies must be proposed to observe the stability metric for high reliability systems. This chapter reviews the most extended memory cell stability metrics and evaluates the feasibility of tracking SRAM cell reliability evolution implementing a detailed bit-cell stability characterization measurement. The memory performance degradation observation is focused on estimating the threshold voltage (Vth) drift caused by process variation and reliability mechanisms. A novel SRAM stability degradation measurement architecture is proposed to be included in modern memory designs with minimal hardware intrusion. The new architecture may extend the failure-free period by introducing adaptable circuits depending on the measured memory stability parameter

6T-SRAM 1Mb Design with Test Structures and Post Silicon Validation

abstract: Static random-access memories (SRAM) are integral part of design systems as caches and data memories that and occupy one-third of design space. The work presents an embedded low power SRAM on a triple well process that allows body-biasing control. In addition to the normal mode operation, the design is embedded with Physical Unclonable Function (PUF) [Suh07] and Sense Amplifier Test (SA Test) mode. With PUF mode structures, the fabrication and environmental mismatches in bit cells are used to generate unique identification bits. These bits are fixed and known as preferred state of an SRAM bit cell. The direct access test structure is a measurement unit for offset voltage analysis of sense amplifiers. These designs are manufactured using a foundry bulk CMOS 55 nm low-power (LP) process. The details about SRAM bit-cell and peripheral circuit design is discussed in detail, for certain cases the circuit simulation analysis is performed with random variations embedded in SPICE models. Further, post-silicon testing results are discussed for normal operation of SRAMs and the special test modes. The silicon and circuit simulation results for various tests are presented.Dissertation/ThesisMasters Thesis Electrical Engineering 201

Memory Module Design for High-Temperature Applications in SiC CMOS Technology

The wide bandgap (WBG) characteristics of SiC play a significant and disruptive role in the power electronics industry. The same characteristics make this material a viable choice for high-temperature electronics systems. Leveraging the high-temperature capability of SiC is crucial to automotive, space exploration, aerospace, deep well drilling, and gas turbines. A significant issue with the high-temperature operation is the exponential increase in leakage current. The lower intrinsic carrier concentration of SiC (10-9 cm-3) compared to Si (1010 cm-3) leads to lower leakage over temperature. Several researchers have demonstrated analog and digital circuits designed in SiC. However, a memory module is required to realize a complete electronic system in SiC that bridges the gap between data processing and data storage. Designing memory that can process massive amounts of data in harsh environments while consuming low power opens doors for future electronics. A novel static random-access memory (SRAM) cell is designed and implemented in a SiC 1 µm triple well CMOS process for high-temperature applications in this work. The prevalent issues encountered during SiC fabrication and the uncertainties in device performance led to 6T SRAM cell design modifications that enable adaptability to the worst and the best cases. However, design trade-offs are made in the design size, the number of transistors, number of I/Os, and the cell\u27s power consumption. The novel SRAM cell design mitigates the effect of poor p-type contacts after the device fabrication by controlling the cell\u27s drive strength via an additional pull-up network. The design also includes two parallel access transistors and separate wordlines that control both access transistors. This individual control enables post-fabrication tunability in the cell ratio (CR) and the pull-up (PR) ratio of the cell. It also allows tuning the access transistors\u27 effective width during a data read operation, and a data write operation, independently. Along with the SRAM cell design, the conventional latch-based sense amplifier is also designed in the SiC CMOS process to realize the monolithic memory IC modules. The SRAM cell performance is evaluated on the basis of static noise margin (SNM), write SNM (WSNM), read SNM (RSNM), leakage current, and read access time over a wide temperature range (25ºC to 500ºC) on three uniquely processed wafers. The noise margins measured on Wafer #2 show a lower leakage current of ~500 nA at 500ºC with the supply voltage of 10 V. The SNM of 6.07 V is measured at 500ºC with a 10 V of power supply. The read access time at 400ºC is ~7.5 µs at a supply voltage of 10 V

Robust Circuit Design for Low-Voltage VLSI.

Voltage scaling is an effective way to reduce the overall power consumption, but the major challenges in low voltage operations include performance degradation and reliability issues due to PVT variations. This dissertation discusses three key circuit components that are critical in low-voltage VLSI. Level converters must be a reliable interface between two voltage domains, but the reduced on/off-current ratio makes it extremely difficult to achieve robust conversions at low voltages. Two static designs are proposed: LC2 adopts a novel pulsed-operation and modulates its pull-up strength depending on its state. A 3-sigma robustness is guaranteed using a current margin plot; SLC inherently reduces the contention by diode-insertion. Improvements in performance, power, and robustness are measured from 130nm CMOS test chips. SRAM is a major bottleneck in voltage-scaling due to its inherent ratioed-bitcell design. The proposed 7T SRAM alleviates the area overhead incurred by 8T bitcells and provides robust operation down to 0.32V in 180nm CMOS test chips with 3.35fW/bit leakage. Auto-Shut-Off provides a 6.8x READ energy reduction, and its innate Quasi-Static READ has been demonstrated which shows a much improved READ error rate. A use of PMOS Pass-Gate improves the half-select robustness by directly modulating the device strength through bitline voltage. Clocked sequential elements, flip-flops in short, are ubiquitous in today’s digital systems. The proposed S2CFF is static, single-phase, contention-free, and has the same number of devices as in TGFF. It shows a 40% power reduction as well as robust low-voltage operations in fabricated 45nm SOI test chips. Its simple hold-time path and the 3.4x improvement in 3-sigma hold-time is presented. A new on-chip flip-flop testing harness is also proposed, and measured hold-time variations of flip-flops are presented.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111525/1/yejoong_1.pd

A 32kb 10T subthreshold SRAM array with bit-interleaving and differential read scheme in 90nm CMOS

We demonstrate a 10T subthreshold SRAM with an efficient bit-interleaving structure for soft-error tolerance and a differential read scheme for improved stability. The 32kb (256128) SRAM array is fabricated in 90nm CMOS and operates at 31.25kHz at 0.18V With more aggressive wordline boosting, the V DD can be reduced to 0.16V At the minimum VDD condition, the operating frequency is 500Hz and the power consumption is 0.123W

Oxygen-insertion Technology for CMOS Performance Enhancement

Until 2003, the semiconductor industry followed Dennard scaling rules to improve complementary metal-oxide-semiconductor (CMOS) transistor performance. However, performance gains with further reductions in transistor gate length are limited by physical effects that do not scale commensurately with device dimensions: short-channel effects (SCE) due to gate-leakage-limited gate-oxide thickness scaling, channel mobility degradation due to enhanced vertical electric fields, increased parasitic resistances due to reductions in source/drain (S/D) contact area, and increased variability in transistor performance due to random dopant fluctuation (RDF) effects and gate work function variations (WFV). These emerging scaling issues, together with increased process complexity and cost, pose severe challenges to maintaining the exponential scaling of transistor dimensions. This dissertation discusses the benefits of oxygen-insertion (OI) technology, a CMOS performance booster, for overcoming these challenges. The benefit of OI technology to mitigate the increase in sheet resistance ($R_{sh}$) with decreasing junction depth ($X_J$) for ultra-shallow-junctions (USJs) relevant for deep-sub-micron planar CMOS transistors is assessed through the fabrication of $R_{sh}$ test structures, electrical characterization, and technology computer-aided design (TCAD) simulations. Experimental and secondary ion mass spectroscopy (SIMS) analyses indicate that OI technology can facilitate low-resistivity USJ formation by reducing $R_{sh}$ and $X_J$ due to retarded transient-enhanced-diffusion (TED) effects and enhanced dopant retention during post-implantation thermal annealing. It is also shown that a low-temperature-oxide (LTO) capping can increase $R_{sh}$ unfavorably due to lower dopant activation levels, which can be alleviated by OI technology. This dissertation extends the evaluation of OI technology to advanced FinFET technology, targeting 7/8-nm low power technology node. A bulk-Si FinFET design comprising a super-steep retrograde (SSR) fin channel doping profile achievable with OI technology is studied by three-dimensional (3-D) TCAD simulations. As compared with the conventional bulk-Si (control) FinFET design with a heavily-doped fin channel doping profile, SSR FinFETs can achieve higher $I_{on}/I_{off}$ ratios and reduce the sensitivity of device performance to variations due to the lightly doped fin channel. As compared with the SOI FinFET design, SSR FinFETs can achieve similarly low $V_{DD,min}$ for 6T-SRAM cell yield estimation. Both SSR and SOI design can provide for as much as 100 mV reduction in $V_{DD,min}$ compared with the control FinFET design. Overall, the SSR FinFET design that can be achieved with OI technology is demonstrated to be a cheaper alternative to the SOI FinFET technology for extending CMOS scaling beyond the 10-nm node. Finally, this dissertation investigates the benefits of OI technology for reducing the Schottky barrier height ($\Phi_{Bp}$) of a Pt/Ti/p-type Si metal-semiconductor (M/S) contact, which can be expected to help reduce the specific contact resistivity for a p-type silicon contact. Electrical measurements of back-to-back Schottky diodes, SIMS, and X-ray photoelectron spectroscopy (XPS) show that the reduction in $\Phi_{Bp}$ is associated with enhanced Ti 2p and Si 2p core energy level shifts. OI technology is shown to favor low-$\Phi_{Bp}$ Pt monosilicide formation during forming gas anneal (FGA) by suppressing the grain boundary diffusion of Pt atoms into the crystalline Si substrate

Statistical Characterization and Decomposition of SRAM cell Variability and Aging

abstract: Memories play an integral role in today's advanced ICs. Technology scaling has enabled high density designs at the price paid for impact due to variability and reliability. It is imperative to have accurate methods to measure and extract the variability in the SRAM cell to produce accurate reliability projections for future technologies. This work presents a novel test measurement and extraction technique which is non-invasive to the actual operation of the SRAM memory array. The salient features of this work include i) A single ended SRAM test structure with no disturbance to SRAM operations ii) a convenient test procedure that only requires quasi-static control of external voltages iii) non-iterative method that extracts the VTH variation of each transistor from eight independent switch point measurements. With the present day technology scaling, in addition to the variability with the process, there is also the impact of other aging mechanisms which become dominant. The various aging mechanisms like Negative Bias Temperature Instability (NBTI), Channel Hot Carrier (CHC) and Time Dependent Dielectric Breakdown (TDDB) are critical in the present day nano-scale technology nodes. In this work, we focus on the impact of NBTI due to aging in the SRAM cell and have used Trapping/De-Trapping theory based log(t) model to explain the shift in threshold voltage VTH. The aging section focuses on the following i) Impact of Statistical aging in PMOS device due to NBTI dominates the temporal shift of SRAM cell ii) Besides static variations , shifting in VTH demands increased guard-banding margins in design stage iii) Aging statistics remain constant during the shift, presenting a secondary effect in aging prediction. iv) We have investigated to see if the aging mechanism can be used as a compensation technique to reduce mismatch due to process variations. Finally, the entire test setup has been tested in SPICE and also validated with silicon and the results are presented. The method also facilitates the study of design metrics such as static, read and write noise margins and also the data retention voltage and thus help designers to improve the cell stability of SRAM.Dissertation/ThesisM.S. Electrical Engineering 201

Strained Silicon Complementary TFET SRAM: Experimental Demonstration and Simulations

A half SRAM cell with strained Si nanowire complementary tunnel-FETs (TFETs) was fabricated and characterized to explore the feasibility and functionality of 6T-SRAM based on TFETs. Outward-faced n-TFETs are used as access-transistors. Static measurements were performed to determine the SRAM butterfly curves, allowing the assessment of cell functionality and stability. The forward p-i-n leakage of the access-transistor at certain bias configurations leads to malfunctioning storage operation, even without the contribution of the ambipolar behavior. At large VDD, lowering of the bit-line bias is needed to mitigate such effect, demonstrating functional hold, read and write operations. Circuit simulations were carried out using a Verilog-A compact model calibrated on the experimental TFETs, providing a better understanding of the TFET SRAM operation at different supply voltages and for different cell sizing and giving an estimate of the dynamic performance of the cell

A Review on Enhancement of SRAM Memory Cell

In this field research paper explores the design and analysis of Static Random Access Memory (SRAMs) that focuses on optimizing delay and power. CMOS SRAM cell consumes very little power and has less read and write time. Higher cell ratios will decrease the read and write time and improve stability. PMOS semiconductor unit with fewer dimensions reduces the ability consumption. During this paper, 6T SRAM cell is implemented with reduced power and performance is good according to read and write time, delay and power consumption. It's been noticed typically that increased memory capability will increase the bit-line parasitic capacitance that successively slows down voltage sensing, to avoid this drawback use optimized scaling techniques and more, get improve performance of the design. Memories are a core part of most of the electronic systems. Performance in terms of speed and power dissipation is the major area of concern in today's memory technology. During this paper SRAM cells supported 6T, 9T, and 8T configurations are compared based on performance for reading and write operations. During this paper completely different static random access memory is designed to satisfy low power, high-performance circuit and also the extensive survey on options of various static random access memory (SRAM) designs were reported. Improve performance static random access memory based on designing a low power SRAM cell structure with optimum write access power